Works matching DE "SOLDERING equipment"

Results: 31

Improved microstructure, thermal and tensile properties of Zn and graphine oxide nano sheets (GONSs) doped Sn-1 wt%Ag-0.5 wt%Cu for electronic assemblies.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 24, p. 19181, doi. 10.1007/s10854-017-7877-3

By:

Sobhy, M.;
Mahmoud, M.;
Fayek, S.;
Fawzy, J.;
Fawzy, A.;
Saad, G.

Publication type:

Article

Local vacuum sealing of casings of devices by light beam soldering.

Published in:

Welding International, 2014, v. 28, n. 5, p. 417, doi. 10.1080/09507116.2013.840029

By:

Bazhanov, A.V.;
Frolov, V.A.;
Fedorov, S.A.

Publication type:

Article

Somont.

Published in:: 2011
Publication type:: Product Review

2BG offers complete automation of string bussing soldering process.

Published in:: 2011
Publication type:: Product Review

Working in Tight Places.

Published in:

Nautical Research Journal, 2019, v. 64, n. 3, p. 281

By:

Wheeler, Steve

Publication type:

Article

Jewelry Makers Tools for the Model Maker.

Published in:

Nautical Research Journal, 2017, v. 62, n. 3, p. 227

By:

Yotter, Dave

Publication type:

Article

Occupational asthma to gel flux containing dodecanedioic acid.

Published in:

2009

By:

Moore, V. C.;
Manney, S.;
Vellore, A. D.;
Burge, P. S.

Publication type:

Other

Innovative parametric design for environmentally conscious adhesive dispensing process.

Published in:

Journal of Intelligent Manufacturing, 2015, v. 26, n. 1, p. 1, doi. 10.1007/s10845-013-0755-9

By:

Huang, Chien-Yi

Publication type:

Article

Transparent Solder guard.

Published in:: 1990
Publication type:: Product Review

Nitrogen Inerting Technology Can Lower Costs for Electronics Packaging and Assembly.

Published in:

Advanced Materials & Processes, 2011, v. 169, n. 6, p. 32

By:

Dong, C. Christine

Publication type:

Article

DAMAGE MECHANISM ANALYSIS OF DEVICE FOR THE WAVE SOLDERING.

Published in:

Annals of DAAAM & Proceedings, 2011, p. 1019

By:

Provaznik, Martin;
Kolenak, Roman;
Martinkovic, Maros

Publication type:

Article

Lasersysteme für Fertigung und Recycling kupferbasierter Elektronikkomponenten.

Published in:: Praktiker, 2025, n. 3, p. 7
Publication type:: Article

Smartes Trio zur Oberflächenbeschichtung.

Published in:

Praktiker, 2020, n. 1/2, p. 26

By:

Jerzembeck, Jens;
Nocker, Isabel

Publication type:

Article

Silver and Gold Solders -- Analysis Due to Corrosion.

Published in:

Quintessence International, 1981, v. 12, n. 3, p. 327

By:

Mueller, H. J.

Publication type:

Article

Reducing the Cost of the Production Process. Selective Soldering -- Continuous Improvement.

Published in:

Journal of Computer Science & Control Systems, 2015, v. 8, n. 1, p. 11

By:

DRĂGHICIU, Nicolae;
KUN, Simona

Publication type:

Article

Getting a head start on device design and manufacturing.

Published in:

2016

By:

Nelson, Rick

Publication type:

Product Review

Aluminium and aluminium alloy hard soldering technology.

Published in:

Welding International, 2012, v. 26, n. 5, p. 330, doi. 10.1080/09507116.2011.581339

By:

Ambroziak, Andrzej;
Lange, Artur;
Derlukiewicz, Wiesław;
Mosińska, Sylwia

Publication type:

Article

The aggressive influence of lead-free solders and the protection of soldering devices against damage.

Published in:

Welding International, 2011, v. 25, n. 8, p. 622, doi. 10.1080/09507116.2010.540844

By:

Mirski, Zbigniew;
Drzeniek, Hubert;
Wojdat, Tomasz

Publication type:

Article

Application of inverter welding machine.

Published in:

Welding International, 2011, v. 25, n. 8, p. 596, doi. 10.1080/09507111003655457

By:

Mitsuno, Masanobu

Publication type:

Article

Ecologically clean solder based on Sn-Ag-Cu.

Published in:

Welding International, 2011, v. 25, n. 7, p. 531, doi. 10.1080/09507116.2011.554256

By:

Perevezentsev, B.N.;
Krumaev, M.N.

Publication type:

Article

Lead-free solders: Still learning, adapting, and working out the kinks.

Published in:

JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2010, v. 62, n. 7, p. 15, doi. 10.1007/s11837-010-0101-z

By:

Chada, Srinivas

Publication type:

Article

Di Paul, Inc.: Transitioning in Measured Steps.

Published in:

Entrepreneurship: Theory & Practice, 2014, v. 38, n. 2, p. 427, doi. 10.1111/etap.12010

By:

Shirokova, Galina;
Vega, Gina;
Kozyreva, Tatiana

Publication type:

Article

Study on improving silicone losses in the process of mixing components of soldering machines.

Published in:

Annals of the University of Oradea: Facsicle of Management & Technological Engineering, 2018, v. 27, n. 2, p. 155, doi. 10.15660/auofmte.2018-2.3377

By:

Zerbes, Mihai Victor;
Popescu, Liliana Georgeta

Publication type:

Article

Evolution of the Microstructure of Sn58Bi Solder Paste with Sn-3.0Ag-0.5Cu Addition During Isothermal Aging.

Published in:

Journal of Electronic Materials, 2019, v. 48, n. 3, p. 1758, doi. 10.1007/s11664-018-06865-1

By:

Xu, Ruisheng;
Liu, Yang;
Zhang, Hao;
Li, Zhao;
Sun, Fenglian;
Zhang, Guoqi

Publication type:

Article

Effects of Forming Processes on the Microstructure and Solderability of Sn-3.5Ag Eutectic Solder Ribbons as well as the Mechanical Properties of Solder Joints.

Published in:

Journal of Electronic Materials, 2017, v. 46, n. 11, p. 6373, doi. 10.1007/s11664-017-5672-9

By:

Liu, Shengfa;
Hu, Zhebing;
Xiong, Jieran;
Tan, Guanghua;
Xiong, Wenyong;
Chen, Chen;
Huang, Shangyu

Publication type:

Article

High-Speed Cyclic Bend Tests and Board-Level Drop Tests for Evaluating the Robustness of Solder Joints in Printed Circuit Board Assemblies.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 6, p. 884, doi. 10.1007/s11664-008-0610-5

By:

Wong, E. H.;
Seah, S. K. W.;
Selvanayagam, C. S.;
Rajoo, R.;
Driel, W. D.;
Caers, J. F. J. M.;
Zhao, X. J.;
Owens, N.;
Leoni, M.;
Tan, L. C.;
Lai, Y. -S.;
Yeh, C. -L.

Publication type:

Article

Thermal Fatigue Endurance of Lead-Free Composite Solder Joints over a Temperature Range of −55°C to 150°C.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 6, p. 843, doi. 10.1007/s11664-009-0772-9

By:

Nousiainen, Olli;
Kangasvieri, Tero;
Rautioaho, Risto;
Vähäkangas, Jouko

Publication type:

Article

An Assessment of Immersion Silver Surface Finish for Lead-Free Electronics.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 6, p. 815, doi. 10.1007/s11664-009-0761-z

By:

Weiqiang Wang;
Choubey, Anupam;
Azarian, Michael;
Pecht, Michael

Publication type:

Article

Intermetallic Compound Formation and Evolution in Solid-State Sn/Immersion-Ag/Cu Trilayer Interfacial Reactions on a Flexible Polymer Board.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 6, p. 908, doi. 10.1007/s11664-009-0778-3

By:

Lin, Chi-pu;
Chen, Chih-ming

Publication type:

Article

The Influence of an Imposed Current on the Creep of Sn-Ag-Cu Solder.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 2, p. 221, doi. 10.1007/s11664-008-0568-3

By:

Kinney, Christopher;
Morris, J. W.;
Tae-Kyu Lee;
Kuo-Chuan Liu;
Jie ,1Xue;
Towne, Dave

Publication type:

Article

Effects of Ag and Al Additions on the Structure and Creep Properties of Sn-9Zn Solder Alloy.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 2, p. 330, doi. 10.1007/s11664-008-0576-3

By:

Mahmudi, R.;
Geranmayeh, A.R.;
Noori, H.;
Taghaddosi, M.

Publication type:

Article