Works about SOLDER pastes

Results: 202

Study of Hydration Process of Cement Paste with Chemical Mapping.

Published in:

ACI Materials Journal, 2016, v. 113, n. 5, p. 609, doi. 10.14359/51689106

By:

Fengjuan Liu;
Zhihui Sun

Publication type:

Article

Influence of a PCB Layout Design on the Efficiency of Heat Dissipation and Mutual Thermal Couplings between Transistors.

Published in:

Electronics (2079-9292), 2023, v. 12, n. 19, p. 4116, doi. 10.3390/electronics12194116

By:

Górecki, Krzysztof;
Posobkiewicz, Krzysztof

Publication type:

Article

Evaluation of Solder Joint Reliability in 3D Packaging Memory Devices under Thermal Shock.

Published in:

Electronics (2079-9292), 2022, v. 11, n. 16, p. 2556, doi. 10.3390/electronics11162556

By:

Zhou, Shuai;
Lin, Zhenpei;
Qiu, Baojun;
Wang, Han;
Xiong, Jingang;
He, Chang;
Zhou, Bei;
Pan, Yiliang;
Huang, Renbin;
Bao, Yiliang;
Cai, Nian

Publication type:

Article

Washable, Low-Temperature Cured Joints for Textile-Based Electronics.

Published in:

Electronics (2079-9292), 2021, v. 10, n. 22, p. 2749, doi. 10.3390/electronics10222749

By:

Szalapak, Jerzy;
Scenev, Vitalij;
Janczak, Daniel;
Werft, Lukas;
Rotzler, Sigrid;
Jakubowska, Malgorzata;
von Krshiwoblozki, Malte;
Kallmayer, Christine;
Schneider-Ramelow, Martin

Publication type:

Article

DDR4 BER Degradation Due to Crack in FBGA Package Solder Ball.

Published in:

Electronics (2079-9292), 2021, v. 10, n. 12, p. 1445, doi. 10.3390/electronics10121445

By:

Waqar, Muhammad;
Bak, Geunyong;
Kwon, Junhyeong;
Baeg, Sanghyeon

Publication type:

Article

Study on oxygen contamination during atomisation of solder powders for microelectronics.

Published in:

Powder Metallurgy, 2007, v. 50, n. 3, p. 228, doi. 10.1179/174329007X189612

By:

Reddy, R. C.;
Kiran, B. S.;
Sethi, V. C.;
Prakash, T. L.

Publication type:

Article

Development of hypoeutectic SnBi alloy solder reinforced with WO3 nanoparticles for connecting Cu substrates via thermal bonding.

Published in:

Scientific Reports, 2025, v. 15, n. 1, p. 1, doi. 10.1038/s41598-025-89729-z

By:

Fathy, Naglaa;
Hafez, Khalid M.;
Abdulaziz, Fahad;
Abdelraouf, R. E.;
Ramadan, Mohamed

Publication type:

Article

Influence of solder and flux composition on thermal stability of brazed PDC cutters.

Published in:

Welding International, 2021, v. 35, n. 1-3, p. 121, doi. 10.1080/09507116.2021.1963535

By:

Pashkov, I. N.;
Misnikov, V. E.;
Morozov, V. A.;
Gadzhiev, M.;
Bazlova, T. A.

Publication type:

Article

Composite gallium soldering pastes for low-temperature diffusion soldering of cermet sections.

Published in:

Welding International, 2012, v. 26, n. 1, p. 51, doi. 10.1080/09507116.2011.592714

By:

Temnykh, V.I.;
Kazakov, V.S.;
Mityaev, A.E.;
Temnykh, E.V.

Publication type:

Article

Effect on lead-free solder joint reliability caused by solder volume.

Published in:

Welding International, 2011, v. 25, n. 11, p. 851, doi. 10.1080/09507116.2011.590656

By:

Yamabe, Mitsuharu;
Fukumitsu, Masako;
Fukuchi, Yoshitoshi

Publication type:

Article

The Effect of Thermal Aging on the Mechanical Properties of Gold-Containing Solder Joints.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 9, p. 5460, doi. 10.1007/s11664-024-11264-w

By:

Bi, Yinghao;
Guo, Weiqi;
Wang, Shaobin;
Zhang, Weiwei;
Wu, Ping

Publication type:

Article

In-Line Test Structures and Non-destructive Characterization of Electromigration-Driven Phase Evolution in Microscale Solder Joints.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 6, p. 3070, doi. 10.1007/s11664-024-11043-7

By:

Jois, Chetan;
Chou, Pei-En;
Subbarayan, Ganesh

Publication type:

Article

Isothermal Aging Effect on Sn-58Bi Solder Interconnect Mechanical Shear Stability.

Published in:

Journal of Electronic Materials, 2022, v. 51, n. 3, p. 1169, doi. 10.1007/s11664-021-09379-5

By:

Waduge, Gihan Dodanduwa;
Baty, Greg;
Lee, Young-woo;
Lee, Tae-Kyu

Publication type:

Article

Interfacial Solid–Liquid Reaction of Ni/In/Ni Structure During Isothermal Reflow Process.

Published in:

Journal of Electronic Materials, 2021, v. 50, n. 12, p. 6575, doi. 10.1007/s11664-021-09253-4

By:

Cheng, Yen-Jui;
Lu, Cheng-Hsin;
Ouyang, Fan-Yi

Publication type:

Article

Research on the Mechanical and Performance Effects of Flux on Solder Layer Interface Voids.

Published in:

Journal of Electronic Materials, 2021, v. 50, n. 12, p. 6629, doi. 10.1007/s11664-021-09157-3

By:

Zhai, Xinmeng;
Chen, Yue;
Li, Yuefeng;
Zou, Jun;
Shi, Mingming;
Yang, Bobo;
Guo, Chunfeng;
Hu, Rongrong;
Su, Xiaofeng

Publication type:

Article

Effects of Ag Flake Addition in Sn-3.0Ag-0.5Cu on Microstructure and Mechanical Properties with High-Temperature Storage Test.

Published in:

Journal of Electronic Materials, 2021, v. 50, n. 10, p. 5639, doi. 10.1007/s11664-021-09102-4

By:

Jang, Jun-Ho;
Min, Kyung Deuk;
Lee, Choong-Jae;
Hwang, Byeong-Uk;
Jung, Seung-Boo

Publication type:

Article

Fabrication of a Silicide Thermoelectric Module Employing Fractional Factorial Design Principles.

Published in:

Journal of Electronic Materials, 2021, v. 50, n. 7, p. 4041, doi. 10.1007/s11664-021-08902-y

By:

Graff, Joachim S.;
Schuler, Raphael;
Song, Xin;
Castillo-Hernandez, Gustavo;
Skomedal, Gunstein;
Enebakk, Erik;
Wright, Daniel Nilsen;
Stange, Marit;
de Boor, Johannes;
Løvvik, Ole Martin;
Schrade, Matthias

Publication type:

Article

Diffusion soldering using a Gallium metallic paste as solder alloy: study of the phase formation systematics.

Published in:

Journal of Materials Science, 2007, v. 42, n. 23, p. 9707, doi. 10.1007/s10853-007-1940-z

By:

Sommadossi, Silvana;
Troiani, Horacio E.;
Fernández Guillermet, Armando

Publication type:

Article

Standardization of a shear test method for lead-free solder paste chip joints.

Published in:

Journal of Materials Science, 2007, v. 42, n. 17, p. 7451, doi. 10.1007/s10853-007-1627-5

By:

Choi, Jai-Kyoung;
Park, Jai-Hyun;
Ahn, Yong-Sik

Publication type:

Article

Correlation between interfacial microstructure and shear behavior of Sn–Ag–Cu solder ball joined with Sn–Zn–Bi paste.

Published in:

Journal of Materials Science, 2007, v. 42, n. 8, p. 2574, doi. 10.1007/s10853-006-1294-y

By:

Shih, Po-Cheng;
Lin, Kwang-Lung

Publication type:

Article

Solder paste inspection using region-based defect detection.

Published in:

International Journal of Advanced Manufacturing Technology, 2009, v. 42, n. 7/8, p. 725, doi. 10.1007/s00170-008-1639-6

By:

Tak-Wai Hui;
Grantham Pang

Publication type:

Article

Construction of 3D solder paste surfaces using multi-projection images.

Published in:

International Journal of Advanced Manufacturing Technology, 2006, v. 31, n. 5/6, p. 509, doi. 10.1007/s00170-005-0221-8

By:

Chung-Hsien Kuo;
Fang-Chung Yang;
Jein-Jong Wing;
Ching-Kun Yang

Publication type:

Article

Increasing the Strength of Soldered Joints by Introducing Carbon Nanotubes into Soldering Pastes.

Published in:

Journal of Engineering Physics & Thermophysics, 2022, v. 95, n. 6, p. 1437, doi. 10.1007/s10891-022-02612-w

By:

Zhdanok, S. A.;
Lanin, V. L.;
Emel'yanov, V. A.;
Krauklis, A. V.

Publication type:

Article

Analyzing the Overfitting of Boosted Decision Trees for the Modelling of Stencil Printing.

Published in:

Periodica Polytechnica: Electrical Engineering & Computer Science, 2022, v. 66, n. 2, p. 132, doi. 10.3311/PPee.19274

By:

Martinek, Péter;
Krammer, Oliver

Publication type:

Article

Studies of the Thermal Conductivity and Thermal Resistance of Solder Layers with Lead-Free Pastes by the Photodeflection Method.

Published in:

Technical Physics Letters, 2023, v. 49, n. 12, p. 265, doi. 10.1134/S1063785023900200

By:

Glazov, A. L.;
Kalinovskii, V. S.;
Kontrosh, E. V.;
Muratikov, K. L.

Publication type:

Article

Sentencia del Tribunal Supremo de 17 de diciembre de 2024 (Sala de lo Contencioso Administrativo, Sección 5ª, Ponente: Ángeles Huet De Sande).

Published in:

Actualidad Jurídica Ambiental, 2025, n. 153, p. 133

By:

Mora Ruiz, Manuela

Publication type:

Article

Airborne contact dermatitis to colophony in soldering flux.

Published in:

Contact Dermatitis (01051873), 1987, v. 17, n. 2, p. 89, doi. 10.1111/j.1600-0536.1987.tb02667.x

By:

Goh, C. L.;
Ng, S. K.

Publication type:

Article

Microstructural and mechanical responses of Sn58Bi/Cu composite solder joints with 0.1wt.% Ni and carbon fiber addition.

Published in:

Scientific Reports, 2024, v. 14, n. 1, p. 1, doi. 10.1038/s41598-024-83905-3

By:

Kong, Xiangxia;
Liu, Zuchen;
Ma, Ruipeng;
Zhai, Junjun;
Pan, Zhen;
Li, Xuemei;
Sun, Fenglian

Publication type:

Article

Microstructural Optimization of Sn-58Bi Low-Temperature Solder Fabricated by Intense Pulsed Light (IPL) Irradiation.

Published in:

Crystals (2073-4352), 2024, v. 14, n. 5, p. 465, doi. 10.3390/cryst14050465

By:

Go, Hyeri;
Noh, Taejoon;
Jung, Seung-Boo;
Sohn, Yoonchul

Publication type:

Article

Residual Stress Testing and Simulation Analysis of Crystal Structures of Electronic Device Materials.

Published in:

Crystals (2073-4352), 2023, v. 13, n. 10, p. 1462, doi. 10.3390/cryst13101462

By:

Chen, Ming;
Li, Jiasheng;
Su, Wei;
Nie, Zhenhua;
Zhong, Butian;
Dong, Xianshan

Publication type:

Article

Board Level Drop Test for Evaluating the Reliability of High-Strength Sn–Bi Composite Solder Pastes with Thermosetting Epoxy.

Published in:

Crystals (2073-4352), 2022, v. 12, n. 7, p. N.PAG, doi. 10.3390/cryst12070924

By:

Liu, Lu;
Xue, Songbai;
Ni, Ruiyang;
Zhang, Peng

Publication type:

Article

Study on the Reliability of Sn–Bi Composite Solder Pastes with Thermosetting Epoxy under Thermal Cycling and Humidity Treatment.

Published in:

Crystals (2073-4352), 2021, v. 11, n. 7, p. 733, doi. 10.3390/cryst11070733

By:

Liu, Lu;
Xue, Songbai;
Ni, Ruiyang;
Zhang, Peng;
Wu, Jie

Publication type:

Article

New Version of High-Damping PCB with Multi-Layered Viscous Lamina.

Published in:

Aerospace (MDPI Publishing), 2021, v. 8, n. 8, p. 202, doi. 10.3390/aerospace8080202

By:

Park, Tae-Yong;
Shin, Seok-Jin;
Oh, Hyun-Ung

Publication type:

Article

High Speed Soldering Using Laser Printing for the Assembly of Electronic Components.

Published in:

Journal of Laser Micro / Nanoengineering, 2020, v. 15, n. 3, p. 204, doi. 10.2961/jlmn.2020.03.2008

By:

Makrygianni, M.;
Margariti, E.;
Andritsos, K.;
Reppas, D.;
Zacharatos, F.;
Oikonomidis, N.;
Spandonidis, Ch.;
Zergioti, I.

Publication type:

Article

Effect of Soldering Temperature on the Reliability of Sn-Ag-Cu Lead-Free Solder Joints.

Published in:

Journal of Electronic Materials, 2021, v. 50, n. 3, p. 869, doi. 10.1007/s11664-020-08715-5

By:

Xinmeng, Zhai;
Yuefeng, Li;
Jun, Zou;
Mingming, Shi;
Bobo, Yang;
Yang, Li;
Chunfeng, Guo;
Rongrong, Hu

Publication type:

Article

Investigation of the Effect of Temperature on the Properties of No-Clean Reflow Soldering Fluxes.

Published in:

Journal of Electronic Materials, 2020, v. 49, n. 11, p. 6727, doi. 10.1007/s11664-020-08407-0

By:

Gacs, JenŐ;
Kocsis, László;
Németh, Csaba;
Mátyási, Judit;
Szieberth, Dénes

Publication type:

Article

Failure Mechanism of the SnAgCu/SnPb Mixed Soldering Process in a Ball Grid Array Structure.

Published in:

Journal of Electronic Materials, 2020, v. 49, n. 10, p. 6223, doi. 10.1007/s11664-020-08372-8

By:

Gao, Li-Yin;
Cui, Xian-Wei;
Tian, Fei-Fei;
Liu, Zhi-Quan

Publication type:

Article

Experimental Study of the Solder Paste Jet Printing Process Using High Speed Photography and Rheological Methods.

Published in:

Journal of Electronic Materials, 2019, v. 48, n. 5, p. 2801, doi. 10.1007/s11664-019-06996-z

By:

Li, Saipeng;
Hao, Jian;
Zhou, Jian;
Xue, Feng

Publication type:

Article

Morphology and Shear Strength of Lead-Free Solder Joints with Sn3.0Ag0.5Cu Solder Paste Reinforced with Ceramic Nanoparticles.

Published in:

Journal of Electronic Materials, 2016, v. 45, n. 12, p. 6143, doi. 10.1007/s11664-016-4832-7

By:

Yakymovych, A.;
Plevachuk, Yu.;
Švec, P.;
Janičkovič, D.;
Šebo, P.;
Beronská, N.;
Roshanghias, A.;
Ipser, H.

Publication type:

Article

Interfacial Microstructure Evolution Between Sn-Zn Solders and Ag Substrate During Solid-State Annealing.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 12, p. 4594, doi. 10.1007/s11664-014-3358-0

By:

Wang, Chao-hong;
Li, Po-yi;
Li, Kuan-ting

Publication type:

Article

Effect of Cr Addition on Wetting Behavior Between Cu and High-Temperature Zn-25Sn-0.15Al-0.1Ga- xCr Pb-Free Solder.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 12, p. 4502, doi. 10.1007/s11664-014-3449-y

By:

Liu, Chin-Wei;
Lin, Kwang-Lung

Publication type:

Article

Mechanical Properties of Sintered Ag as a New Material for Die Bonding: Influence of the Density.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 12, p. 4510, doi. 10.1007/s11664-014-3458-x

By:

Caccuri, V.;
Milhet, X.;
Gadaud, P.;
Bertheau, D.;
Gerland, M.

Publication type:

Article

Interfacial Reaction Between Sn3.0Ag0.5Cu Solder and ENEPIG for Fine Pitch BGA by Stencil Printing.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 9, p. 3341, doi. 10.1007/s11664-014-3236-9

By:

Liu, Ziyu;
Cai, Jian;
Wang, Qian;
He, Xi;
Chen, Yu

Publication type:

Article

Effects of Ni Additions on the Growth of CuSn in High-Lead Solders.

Published in:

Journal of Electronic Materials, 2010, v. 39, n. 12, p. 2636, doi. 10.1007/s11664-010-1317-y

By:

Wang, Y.;
Chang, C.;
Chen, W.;
Kao, C.

Publication type:

Article

Wetting Properties and Interfacial Reactions of Mechanically Alloyed Cu5Zn8-Bearing Pb-Free Solders on a Copper Substrate.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 11, p. 2301, doi. 10.1007/s11664-009-0860-x

By:

Jung, Inyu;
Cho, Moon Gi;
Lee, Hyuck Mo

Publication type:

Article

Spreading Kinetics of Liquid Solders over an Intermetallic Solid Surface. Part 2: Lead-Free Solders.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 9, p. 1846, doi. 10.1007/s11664-009-0870-8

By:

H. Zhao;
H. Q. Wang;
Sekulic, D. P.;
Y. Y.Qian

Publication type:

Article

Intermetallic Compound Formation and Evolution in Solid-State Sn/Immersion-Ag/Cu Trilayer Interfacial Reactions on a Flexible Polymer Board.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 6, p. 908, doi. 10.1007/s11664-009-0778-3

By:

Lin, Chi-pu;
Chen, Chih-ming

Publication type:

Article

Inhibition of Whisker Growth on the Surface of Sn-3Ag-0.5Cu-0.5Ce Solder Alloyed with Zn.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 3, p. 420, doi. 10.1007/s11664-008-0606-1

By:

Chuang, Tung-Han;
Lin, Hsiu-Jen

Publication type:

Article

Factors That Govern the Performance of Thermal Interface Materials.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 1, p. 175, doi. 10.1007/s11664-008-0563-8

By:

Saeed Abadi, Parisa Pour Shahid;
Leong, Chia-Ken;
Chung, D.D.L.

Publication type:

Article

Effect of Migration and Condensation of Pre-existing Voids on Increase in Bump Resistance of Flip Chips on Flexible Substrates during Electromigration.

Published in:

Journal of Electronic Materials, 2008, v. 37, n. 7, p. 962, doi. 10.1007/s11664-008-0463-y

By:

Liang, S. W.;
Chang, Y. W.;
Chih Chen;
Preciado, Jackie;
Tu, K. N.

Publication type:

Article