Works matching DE "SOLDER pastes"

Results: 202

The Effect of Thermal Aging on the Mechanical Properties of Gold-Containing Solder Joints.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 9, p. 5460, doi. 10.1007/s11664-024-11264-w

By:

Bi, Yinghao;
Guo, Weiqi;
Wang, Shaobin;
Zhang, Weiwei;
Wu, Ping

Publication type:

Article

In-Line Test Structures and Non-destructive Characterization of Electromigration-Driven Phase Evolution in Microscale Solder Joints.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 6, p. 3070, doi. 10.1007/s11664-024-11043-7

By:

Jois, Chetan;
Chou, Pei-En;
Subbarayan, Ganesh

Publication type:

Article

Thermal and mechanical property of FCLED package component interconnected with Sn–MWCNT composite solder.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 14, p. 12869, doi. 10.1007/s10854-019-01648-8

By:

Lee, Choong-Jae;
Jeong, Haksan;
Jung, Kwang-Ho;
Min, Kyung Deuk;
Jung, Seung-Boo

Publication type:

Article

Effects of flux formulation temperature on printing and wetting properties of Sn–3.0Ag–0.5Cu solder.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 9, p. 8493, doi. 10.1007/s10854-019-01169-4

By:

Kwon, Soonyong;
Lee, Hoo-Jeong;
Yoo, Sehoon

Publication type:

Article

Rheological characterization and jet printing performance of Sn–58Bi solder pastes.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 6, p. 4575, doi. 10.1007/s10854-017-8408-y

By:

Li, Saipeng;
Wei, Mingzhen;
Hao, Jian;
Tian, Shuang;
Wang, Dapeng;
Zhou, Jian;
Xue, Feng

Publication type:

Article

Microstructure, hardness, and shear behavior of the as-soldered SnBi-SAC composite solder pastes.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 24, p. 19113, doi. 10.1007/s10854-017-7866-6

By:

Liu, Yang;
Fu, Haifeng;
Zhang, Hao;
Sun, Fenglian;
Wang, Xuan;
Zhang, Guoqi

Publication type:

Article

Solderability of SnBi-nano Cu solder pastes and microstructure of the solder joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 3, p. 2235, doi. 10.1007/s10854-015-4016-x

By:

Liu, Yang;
Zhang, Hao;
Sun, Fenglian

Publication type:

Article

Microstructural evolutions of the Ag nano-particle reinforced SnBiCu-xAg/Cu solder joints during liquid aging.

Published in:

Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 7, p. 1409, doi. 10.1007/s10854-011-0606-4

By:

Shen, Jun;
Peng, Changfei;
Zhao, Mali;
Wu, Cuiping

Publication type:

Article

配位剂对MSA 体系电镀锡-铟合金的影响及镀层的焊接可靠性.

Published in:

Electroplating & Finishing, 2023, v. 42, n. 5, p. 8, doi. 10.19289/j.1004-227x.2023.05.002

By:

许永姿;
杨瑶;
蔡珊珊;
彭巨擘;
王加俊

Publication type:

Article

锡粉粒度对SAC305 锡膏黏度和润湿性能的影响.

Published in:

Journal of Henan University of Science & Technology, Natural Science, 2022, v. 43, n. 6, p. 12, doi. 10.15926/j.cnki.issn1672-6871.2022.06.003

By:

许国栋;
闫焉服;
高婷婷;
李永康

Publication type:

Article

Ultra‐Thin Chips with Printed Interconnects on Flexible Foils.

Published in:

Advanced Electronic Materials, 2022, v. 8, n. 5, p. 1, doi. 10.1002/aelm.202101029

By:

Ma, Sihang;
Kumaresan, Yogeenth;
Dahiya, Abhishek Singh;
Dahiya, Ravinder

Publication type:

Article

Studies of the Thermal Conductivity and Thermal Resistance of Solder Layers with Lead-Free Pastes by the Photodeflection Method.

Published in:

Technical Physics Letters, 2023, v. 49, n. 12, p. 265, doi. 10.1134/S1063785023900200

By:

Glazov, A. L.;
Kalinovskii, V. S.;
Kontrosh, E. V.;
Muratikov, K. L.

Publication type:

Article

Detection of stencil printing direction in printed circuit boards assembly using solder paste inspection data.

Published in:

International Journal of Advanced Manufacturing Technology, 2025, v. 138, n. 1, p. 97, doi. 10.1007/s00170-024-14585-6

By:

Farrag, Abdelrahman;
Kim, Jaewoo;
Yoon, Sangwon;
Jin, Yu

Publication type:

Article

Stage-based neural network for reflow profile prediction and reflow recipe optimization for quality and energy-saving.

Published in:

International Journal of Advanced Manufacturing Technology, 2025, v. 137, n. 3, p. 1745, doi. 10.1007/s00170-025-15282-8

By:

Zhang, Zhenxuan;
Li, Yuanyuan;
Yoon, Sang Won;
Won, Daehan

Publication type:

Article

Surrogate-based optimization framework for enhancing SMT process quality and productivity in electronics manufacturing services.

Published in:

International Journal of Advanced Manufacturing Technology, 2025, v. 136, n. 11, p. 5103, doi. 10.1007/s00170-025-15032-w

By:

Lee, Ching-Hung;
Lin, Kai-Xiang;
Chou, Che-Wei

Publication type:

Article

Numerical simulation of SAC305/Cu friction inlay welding based on Coupled Eulerian–Lagrangian approach.

Published in:

International Journal of Advanced Manufacturing Technology, 2024, v. 135, n. 1/2, p. 119, doi. 10.1007/s00170-024-14569-6

By:

Zhao, Zhili;
Zhang, Liandong;
Wei, Jiandong;
Ren, Zeyu

Publication type:

Article

A pick-and-place process control based on the bootstrapping method for quality enhancement in surface mount technology.

Published in:

International Journal of Advanced Manufacturing Technology, 2024, v. 133, n. 1/2, p. 745, doi. 10.1007/s00170-024-13767-6

By:

Kim, Jaewoo;
Zhang, Zhenxuan;
Won, Daehan;
Yoon, Sangwon;
Jin, Yu

Publication type:

Article

Obtaining a low-temperature paste based on eutectic silumin for soldering special-purpose products.

Published in:

International Journal of Advanced Manufacturing Technology, 2022, v. 119, n. 5/6, p. 3857, doi. 10.1007/s00170-021-08619-6

By:

Uskov, Igor Vasilevich;
Gorokhov, Yuriy Vasilevich;
Gubanov, Ivan Yurievich;
Belyaev, Sergey Vladimirovich;
Kosovich, Aleksandr Aleksandrovich;
Lesiv, Elena Mikhailovna;
Konstantinov, Igor Lazarevich;
Gubanova, Marina Igorevna;
Kosyachenko, Ivan Sergeevich;
Pavlov, Nikita Evgenevich

Publication type:

Article

Extrusion molding of kaolin sorbents.

Published in:

Glass & Ceramics, 2007, v. 64, n. 7/8, p. 287, doi. 10.1007/s10717-007-0072-x

By:

Prokof’ev, V.;
Razgovorov, P.;
Smirnov, K.;
Shushkina, E.;
Il’in, A.

Publication type:

Article

Analyzing the Overfitting of Boosted Decision Trees for the Modelling of Stencil Printing.

Published in:

Periodica Polytechnica: Electrical Engineering & Computer Science, 2022, v. 66, n. 2, p. 132, doi. 10.3311/PPee.19274

By:

Martinek, Péter;
Krammer, Oliver

Publication type:

Article

IoT device fabrication using roll-to-roll printing process.

Published in:

Scientific Reports, 2021, v. 11, n. 1, p. 1, doi. 10.1038/s41598-021-99436-0

By:

Phung, Thanh Huy;
Gafurov, Anton Nailevich;
Kim, Inyoung;
Kim, Sung Yong;
Kim, Kyoung Min;
Lee, Taik-Min

Publication type:

Article

A guide to using EPIC/MEPIC igniters in pyrotechnic applications.

Published in:

Journal of Mines, Metals & Fuels, 2022, v. 70, n. 2, p. 95

By:

DHIA, AMINE

Publication type:

Article

Single‐Ion Conducting Soft Electrolytes for Semi‐Solid Lithium Metal Batteries Enabling Cell Fabrication and Operation under Ambient Conditions.

Published in:

Advanced Energy Materials, 2021, v. 11, n. 38, p. 1, doi. 10.1002/aenm.202101813

By:

Oh, Kyeong‐Seok;
Kim, Jung‐Hui;
Kim, Se‐Hee;
Oh, Dongrak;
Han, Sun‐Phil;
Jung, Kwangeun;
Wang, Zhuyi;
Shi, Liyi;
Su, Yongxiang;
Yim, Taeeun;
Yuan, Shuai;
Lee, Sang‐Young

Publication type:

Article

Effects of Zinc Oxide Nanoparticles on Properties of SAC0307 Lead-Free Solder Paste.

Published in:

Advances in Materials Science & Engineering, 2018, p. 1, doi. 10.1155/2018/3750742

By:

Kanlayasiri, Kannachai;
Meesathien, Nadee

Publication type:

Article

Influence of solder and flux composition on thermal stability of brazed PDC cutters.

Published in:

Welding International, 2021, v. 35, n. 1-3, p. 121, doi. 10.1080/09507116.2021.1963535

By:

Pashkov, I. N.;
Misnikov, V. E.;
Morozov, V. A.;
Gadzhiev, M.;
Bazlova, T. A.

Publication type:

Article

Composite gallium soldering pastes for low-temperature diffusion soldering of cermet sections.

Published in:

Welding International, 2012, v. 26, n. 1, p. 51, doi. 10.1080/09507116.2011.592714

By:

Temnykh, V.I.;
Kazakov, V.S.;
Mityaev, A.E.;
Temnykh, E.V.

Publication type:

Article

Effect on lead-free solder joint reliability caused by solder volume.

Published in:

Welding International, 2011, v. 25, n. 11, p. 851, doi. 10.1080/09507116.2011.590656

By:

Yamabe, Mitsuharu;
Fukumitsu, Masako;
Fukuchi, Yoshitoshi

Publication type:

Article

Isothermal Aging Effect on Sn-58Bi Solder Interconnect Mechanical Shear Stability.

Published in:

Journal of Electronic Materials, 2022, v. 51, n. 3, p. 1169, doi. 10.1007/s11664-021-09379-5

By:

Waduge, Gihan Dodanduwa;
Baty, Greg;
Lee, Young-woo;
Lee, Tae-Kyu

Publication type:

Article

Interfacial Solid–Liquid Reaction of Ni/In/Ni Structure During Isothermal Reflow Process.

Published in:

Journal of Electronic Materials, 2021, v. 50, n. 12, p. 6575, doi. 10.1007/s11664-021-09253-4

By:

Cheng, Yen-Jui;
Lu, Cheng-Hsin;
Ouyang, Fan-Yi

Publication type:

Article

Research on the Mechanical and Performance Effects of Flux on Solder Layer Interface Voids.

Published in:

Journal of Electronic Materials, 2021, v. 50, n. 12, p. 6629, doi. 10.1007/s11664-021-09157-3

By:

Zhai, Xinmeng;
Chen, Yue;
Li, Yuefeng;
Zou, Jun;
Shi, Mingming;
Yang, Bobo;
Guo, Chunfeng;
Hu, Rongrong;
Su, Xiaofeng

Publication type:

Article

Effects of Ag Flake Addition in Sn-3.0Ag-0.5Cu on Microstructure and Mechanical Properties with High-Temperature Storage Test.

Published in:

Journal of Electronic Materials, 2021, v. 50, n. 10, p. 5639, doi. 10.1007/s11664-021-09102-4

By:

Jang, Jun-Ho;
Min, Kyung Deuk;
Lee, Choong-Jae;
Hwang, Byeong-Uk;
Jung, Seung-Boo

Publication type:

Article

Fabrication of a Silicide Thermoelectric Module Employing Fractional Factorial Design Principles.

Published in:

Journal of Electronic Materials, 2021, v. 50, n. 7, p. 4041, doi. 10.1007/s11664-021-08902-y

By:

Graff, Joachim S.;
Schuler, Raphael;
Song, Xin;
Castillo-Hernandez, Gustavo;
Skomedal, Gunstein;
Enebakk, Erik;
Wright, Daniel Nilsen;
Stange, Marit;
de Boor, Johannes;
Løvvik, Ole Martin;
Schrade, Matthias

Publication type:

Article

Effect of Soldering Temperature on the Reliability of Sn-Ag-Cu Lead-Free Solder Joints.

Published in:

Journal of Electronic Materials, 2021, v. 50, n. 3, p. 869, doi. 10.1007/s11664-020-08715-5

By:

Xinmeng, Zhai;
Yuefeng, Li;
Jun, Zou;
Mingming, Shi;
Bobo, Yang;
Yang, Li;
Chunfeng, Guo;
Rongrong, Hu

Publication type:

Article

Investigation of the Effect of Temperature on the Properties of No-Clean Reflow Soldering Fluxes.

Published in:

Journal of Electronic Materials, 2020, v. 49, n. 11, p. 6727, doi. 10.1007/s11664-020-08407-0

By:

Gacs, JenŐ;
Kocsis, László;
Németh, Csaba;
Mátyási, Judit;
Szieberth, Dénes

Publication type:

Article

Failure Mechanism of the SnAgCu/SnPb Mixed Soldering Process in a Ball Grid Array Structure.

Published in:

Journal of Electronic Materials, 2020, v. 49, n. 10, p. 6223, doi. 10.1007/s11664-020-08372-8

By:

Gao, Li-Yin;
Cui, Xian-Wei;
Tian, Fei-Fei;
Liu, Zhi-Quan

Publication type:

Article

Experimental Study of the Solder Paste Jet Printing Process Using High Speed Photography and Rheological Methods.

Published in:

Journal of Electronic Materials, 2019, v. 48, n. 5, p. 2801, doi. 10.1007/s11664-019-06996-z

By:

Li, Saipeng;
Hao, Jian;
Zhou, Jian;
Xue, Feng

Publication type:

Article

Morphology and Shear Strength of Lead-Free Solder Joints with Sn3.0Ag0.5Cu Solder Paste Reinforced with Ceramic Nanoparticles.

Published in:

Journal of Electronic Materials, 2016, v. 45, n. 12, p. 6143, doi. 10.1007/s11664-016-4832-7

By:

Yakymovych, A.;
Plevachuk, Yu.;
Švec, P.;
Janičkovič, D.;
Šebo, P.;
Beronská, N.;
Roshanghias, A.;
Ipser, H.

Publication type:

Article

Interfacial Microstructure Evolution Between Sn-Zn Solders and Ag Substrate During Solid-State Annealing.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 12, p. 4594, doi. 10.1007/s11664-014-3358-0

By:

Wang, Chao-hong;
Li, Po-yi;
Li, Kuan-ting

Publication type:

Article

Effect of Cr Addition on Wetting Behavior Between Cu and High-Temperature Zn-25Sn-0.15Al-0.1Ga- xCr Pb-Free Solder.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 12, p. 4502, doi. 10.1007/s11664-014-3449-y

By:

Liu, Chin-Wei;
Lin, Kwang-Lung

Publication type:

Article

Mechanical Properties of Sintered Ag as a New Material for Die Bonding: Influence of the Density.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 12, p. 4510, doi. 10.1007/s11664-014-3458-x

By:

Caccuri, V.;
Milhet, X.;
Gadaud, P.;
Bertheau, D.;
Gerland, M.

Publication type:

Article

Interfacial Reaction Between Sn3.0Ag0.5Cu Solder and ENEPIG for Fine Pitch BGA by Stencil Printing.

Published in:

Journal of Electronic Materials, 2014, v. 43, n. 9, p. 3341, doi. 10.1007/s11664-014-3236-9

By:

Liu, Ziyu;
Cai, Jian;
Wang, Qian;
He, Xi;
Chen, Yu

Publication type:

Article

Effects of Ni Additions on the Growth of CuSn in High-Lead Solders.

Published in:

Journal of Electronic Materials, 2010, v. 39, n. 12, p. 2636, doi. 10.1007/s11664-010-1317-y

By:

Wang, Y.;
Chang, C.;
Chen, W.;
Kao, C.

Publication type:

Article

Wetting Properties and Interfacial Reactions of Mechanically Alloyed Cu<sub>5</sub>Zn<sub>8</sub>-Bearing Pb-Free Solders on a Copper Substrate.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 11, p. 2301, doi. 10.1007/s11664-009-0860-x

By:

Jung, Inyu;
Cho, Moon Gi;
Lee, Hyuck Mo

Publication type:

Article

Spreading Kinetics of Liquid Solders over an Intermetallic Solid Surface. Part 2: Lead-Free Solders.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 9, p. 1846, doi. 10.1007/s11664-009-0870-8

By:

H. Zhao;
H. Q. Wang;
Sekulic, D. P.;
Y. Y.Qian

Publication type:

Article

Intermetallic Compound Formation and Evolution in Solid-State Sn/Immersion-Ag/Cu Trilayer Interfacial Reactions on a Flexible Polymer Board.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 6, p. 908, doi. 10.1007/s11664-009-0778-3

By:

Lin, Chi-pu;
Chen, Chih-ming

Publication type:

Article

Inhibition of Whisker Growth on the Surface of Sn-3Ag-0.5Cu-0.5Ce Solder Alloyed with Zn.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 3, p. 420, doi. 10.1007/s11664-008-0606-1

By:

Chuang, Tung-Han;
Lin, Hsiu-Jen

Publication type:

Article

Factors That Govern the Performance of Thermal Interface Materials.

Published in:

Journal of Electronic Materials, 2009, v. 38, n. 1, p. 175, doi. 10.1007/s11664-008-0563-8

By:

Saeed Abadi, Parisa Pour Shahid;
Leong, Chia-Ken;
Chung, D.D.L.

Publication type:

Article

Effect of Migration and Condensation of Pre-existing Voids on Increase in Bump Resistance of Flip Chips on Flexible Substrates during Electromigration.

Published in:

Journal of Electronic Materials, 2008, v. 37, n. 7, p. 962, doi. 10.1007/s11664-008-0463-y

By:

Liang, S. W.;
Chang, Y. W.;
Chih Chen;
Preciado, Jackie;
Tu, K. N.

Publication type:

Article

Effect of SiC Nanoparticle Additions on Microstructure and Microhardness of Sn-Ag-Cu Solder Alloy.

Published in:

Journal of Electronic Materials, 2008, v. 37, n. 6, p. 574, doi. 10.1007/s11664-007-0366-3

By:

Ping Liu;
Pei Yao;
Jim Liu

Publication type:

Article

Demonstration and Characterization of Sn-3.0Ag-0.5Cu/Sn-57Bi-1Ag Combination Solder for 3-D Multistack Packaging.

Published in:

Journal of Electronic Materials, 2008, v. 37, n. 1, p. 110, doi. 10.1007/s11664-007-0296-0

By:

Yun-Hwan Jo;
Joo Won Lee;
Sun-Kyoung Seo;
Hyuck Mo Lee;
Hun Han;
Dong Chun Lee

Publication type:

Article