Works matching DE "SOLDER pastes"

Results: 201

Enhancing Ball Grid Array (BGA) Component on Printed Circuit Board (PCB) Solder Joint Integrity with Antimony Element.

Published in:

Journal of Failure Analysis & Prevention, 2025, v. 25, n. 2, p. 813, doi. 10.1007/s11668-025-02144-4

By:

Jalar, Azman;
Lim, Ee May;
Abu Bakar, Maria;
Ismail, Adlil Aizat;
Che Ani, Fakhrozi;
Tan, Choo Par

Publication type:

Article

Performance and interfacial reaction mechanism of nano-IMC-mixed solder paste with variable melting point.

Published in:

Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 12, p. 1, doi. 10.1007/s10854-023-10410-0

By:

Gao, He;
Liu, Wei;
Wang, Chunqing

Publication type:

Article

Microstructures and shear strengths of W-ball solder joints aged under isothermal and cyclic thermal conditions.

Published in:

Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 8, p. 1, doi. 10.1007/s10854-023-10065-x

By:

Wang, Wenhui;
Zhao, Xingke;
Zhao, Zenglei;
Rong, Yuhan

Publication type:

Article

Effect of Zn nanoparticle doped flux on electromigration damages in SAC305 solder joint.

Published in:

Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 5, p. 1, doi. 10.1007/s10854-022-09646-z

By:

Bashir, M. Nasir;
Khan, Abdul Faheem;
Bashir, Shahid;
Bashir, Mohamed Bashir Ali;
Jamshaid, Muhammad;
Javed, Iqra;
Ali, Imran

Publication type:

Article

Effects of cobalt nanoparticle on microstructure of Sn58Bi solder joint.

Published in:

Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 4, p. 1, doi. 10.1007/s10854-022-09465-2

By:

Bashir, Muhammad Nasir;
Haseeb, A. S. M. A.;
Naher, Sumsun;
Ali, Muhammad Mahmood;
Ali Bashir, Mohamed Bashir;
Zaidi, Asad A.;
Jamshaid, Muhammad;
Javed, Iqra

Publication type:

Article

Optimization of reflow profile for copper pillar with SAC305 solder cap FCCSP.

Published in:

Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 3, p. 1, doi. 10.1007/s10854-022-09661-0

By:

Zainudin, Wan Zamir Zakwan Wan;
Yong, Tan Chou;
Hui, Tan Cai;
Kar, Yap Boon;
Hoong, Wong Yew

Publication type:

Article

Comparative study of laser- and reflow-soldered Sn–3.0Ag–0.5Cu joints on thin Au/Pd/Ni(P) substrate.

Published in:

Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 3, p. 1, doi. 10.1007/s10854-022-09632-5

By:

Lee, Dong-Hwan;
Jeong, Min-Seong;
Yoon, Jeong-Won

Publication type:

Article

The effect of microstructure on shear tensile properties and microhardness profile of trace germanium added Cu/Sn–5Sb–0.7Cu lead-free solder joint.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 26, p. 21137, doi. 10.1007/s10854-022-08918-y

By:

Pooshgan, Hoda;
Naffakh-Moosavy, Homam

Publication type:

Article

Microstructure and mechanical properties of Sn–Bi solder joints reinforced with Zn@Sn core–shell particles.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 22, p. 17745, doi. 10.1007/s10854-022-08637-4

By:

Wang, Fengyi;
Wang, Xinjie;
Xu, Kexin;
Wang, Jintao;
Zhang, Weiwei;
Hang, Chunjin;
Chen, Hongtao;
Li, Mingyu

Publication type:

Article

Synthesis of Bi–Pb–Sn–Cd solder particles for joining Ag-plated PZT ceramics at 100 °C.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 8, p. 5899, doi. 10.1007/s10854-022-07771-3

By:

Ye, Lingmin;
Liu, Yusheng;
He, Hongliang;
Zhang, Mu;
Zhu, Qi;
Sun, Xudong;
Li, Xiaodong

Publication type:

Article

The doping of SZC solders with bismuth to improve their thermal and tensile characteristics for microelectronic applications.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 8, p. 4831, doi. 10.1007/s10854-021-07672-x

By:

Deghady, A. M.;
Fadel, M. M.;
Eid, E. A.

Publication type:

Article

EDS analysis on effect of low dosage gamma radiation and micromechanical properties of SnAg<sub>3</sub>Cu<sub>0.5</sub> solder.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 7, p. 4225, doi. 10.1007/s10854-021-07617-4

By:

Lehan, Nur Farisa Nadia Mohmad;
Yusoff, Wan Yusmawati Wan;
Sobri, Normidatul Salwa;
Ahmad, Ku Zarina Ku;
Abdullah, Mohamad Faizal;
Amat, Azuraida;
Jalar, Azman;
Rahman, Irman Abdul;
Salleh, Emee Marina

Publication type:

Article

Enhancing the properties of the SAC305-soldered joint: heat treatment of the nickel-plated copper substrate before reflow soldering.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 7, p. 3535, doi. 10.1007/s10854-021-07545-3

By:

Li, Yulong;
Deng, Xiang;
Lei, Min;
Li, Xuewen;
Ouyang, Hua

Publication type:

Article

Main application limitations of lead-free composite solder doped with foreign reinforcements.

Published in:

Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 20, p. 24644, doi. 10.1007/s10854-021-06938-8

By:

Chen, Guang;
Wu, Yaofeng

Publication type:

Article

Interfacial reaction, wettability, and shear strength of ultrasonic-assisted lead-free solder joints prepared using Cu–GNSs-doped flux.

Published in:

Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 19, p. 24507, doi. 10.1007/s10854-021-06929-9

By:

Gui, Zixiao;
Hu, Xiaowu;
Jiang, Xiongxin;
Li, Yulong;
Wang, Haozhong

Publication type:

Article

Effect of grain size on the interface structure and shear behavior of lead-free solder joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 16, p. 21620, doi. 10.1007/s10854-021-06673-0

By:

Xinmeng, Zhai;
Yue, Chen;
Yuefeng, Li;
Jun, Zou;
Mingming, Shi;
Bobo, Yang;
Jie, Yang;
Qi, Qian;
Cheng, Zhang

Publication type:

Article

Microstructure and properties of a vacuum-tempered glass with low-temperature-sintered silver paste.

Published in:

Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 12, p. 16230, doi. 10.1007/s10854-021-06171-3

By:

Sun, Qin;
Sun, Guoji;
Liu, Yihan;
Li, Yufeng;
Chen, Hongtao;
Li, Mingyu;
Hang, Chunjin;
Zhu, Wenbo

Publication type:

Article

Microstructure and growth kinetic study in Sn–Cu transient liquid phase sintering solder paste.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 14, p. 11077, doi. 10.1007/s10854-020-03657-4

By:

Mohd Said, R.;
Mohd Salleh, M. A. A.;
Saud, N.;
Ramli, M. I. I.;
Yasuda, H.;
Nogita, K.

Publication type:

Article

Effect of Ag-decorated MWCNT on the mechanical and thermal property of Sn58Bi solder joints for FCLED package.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 13, p. 10170, doi. 10.1007/s10854-020-03562-w

By:

Lee, Choong-Jae;
Myung, Woo-Ram;
Park, Bum-Geun;
Jung, Seung-Boo

Publication type:

Article

Thermal and mechanical property of FCLED package component interconnected with Sn–MWCNT composite solder.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 14, p. 12869, doi. 10.1007/s10854-019-01648-8

By:

Lee, Choong-Jae;
Jeong, Haksan;
Jung, Kwang-Ho;
Min, Kyung Deuk;
Jung, Seung-Boo

Publication type:

Article

Effects of flux formulation temperature on printing and wetting properties of Sn–3.0Ag–0.5Cu solder.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 9, p. 8493, doi. 10.1007/s10854-019-01169-4

By:

Kwon, Soonyong;
Lee, Hoo-Jeong;
Yoo, Sehoon

Publication type:

Article

Rheological characterization and jet printing performance of Sn–58Bi solder pastes.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 6, p. 4575, doi. 10.1007/s10854-017-8408-y

By:

Li, Saipeng;
Wei, Mingzhen;
Hao, Jian;
Tian, Shuang;
Wang, Dapeng;
Zhou, Jian;
Xue, Feng

Publication type:

Article

Microstructure, hardness, and shear behavior of the as-soldered SnBi-SAC composite solder pastes.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 24, p. 19113, doi. 10.1007/s10854-017-7866-6

By:

Liu, Yang;
Fu, Haifeng;
Zhang, Hao;
Sun, Fenglian;
Wang, Xuan;
Zhang, Guoqi

Publication type:

Article

Solderability of SnBi-nano Cu solder pastes and microstructure of the solder joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 3, p. 2235, doi. 10.1007/s10854-015-4016-x

By:

Liu, Yang;
Zhang, Hao;
Sun, Fenglian

Publication type:

Article

Microstructural evolutions of the Ag nano-particle reinforced SnBiCu-xAg/Cu solder joints during liquid aging.

Published in:

Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 7, p. 1409, doi. 10.1007/s10854-011-0606-4

By:

Shen, Jun;
Peng, Changfei;
Zhao, Mali;
Wu, Cuiping

Publication type:

Article

Detection of stencil printing direction in printed circuit boards assembly using solder paste inspection data.

Published in:

International Journal of Advanced Manufacturing Technology, 2025, v. 138, n. 1, p. 97, doi. 10.1007/s00170-024-14585-6

By:

Farrag, Abdelrahman;
Kim, Jaewoo;
Yoon, Sangwon;
Jin, Yu

Publication type:

Article

Stage-based neural network for reflow profile prediction and reflow recipe optimization for quality and energy-saving.

Published in:

International Journal of Advanced Manufacturing Technology, 2025, v. 137, n. 3, p. 1745, doi. 10.1007/s00170-025-15282-8

By:

Zhang, Zhenxuan;
Li, Yuanyuan;
Yoon, Sang Won;
Won, Daehan

Publication type:

Article

Surrogate-based optimization framework for enhancing SMT process quality and productivity in electronics manufacturing services.

Published in:

International Journal of Advanced Manufacturing Technology, 2025, v. 136, n. 11, p. 5103, doi. 10.1007/s00170-025-15032-w

By:

Lee, Ching-Hung;
Lin, Kai-Xiang;
Chou, Che-Wei

Publication type:

Article

Numerical simulation of SAC305/Cu friction inlay welding based on Coupled Eulerian–Lagrangian approach.

Published in:

International Journal of Advanced Manufacturing Technology, 2024, v. 135, n. 1/2, p. 119, doi. 10.1007/s00170-024-14569-6

By:

Zhao, Zhili;
Zhang, Liandong;
Wei, Jiandong;
Ren, Zeyu

Publication type:

Article

A pick-and-place process control based on the bootstrapping method for quality enhancement in surface mount technology.

Published in:

International Journal of Advanced Manufacturing Technology, 2024, v. 133, n. 1/2, p. 745, doi. 10.1007/s00170-024-13767-6

By:

Kim, Jaewoo;
Zhang, Zhenxuan;
Won, Daehan;
Yoon, Sangwon;
Jin, Yu

Publication type:

Article

Obtaining a low-temperature paste based on eutectic silumin for soldering special-purpose products.

Published in:

International Journal of Advanced Manufacturing Technology, 2022, v. 119, n. 5/6, p. 3857, doi. 10.1007/s00170-021-08619-6

By:

Uskov, Igor Vasilevich;
Gorokhov, Yuriy Vasilevich;
Gubanov, Ivan Yurievich;
Belyaev, Sergey Vladimirovich;
Kosovich, Aleksandr Aleksandrovich;
Lesiv, Elena Mikhailovna;
Konstantinov, Igor Lazarevich;
Gubanova, Marina Igorevna;
Kosyachenko, Ivan Sergeevich;
Pavlov, Nikita Evgenevich

Publication type:

Article

A novel placement method for mini-scale passive components in surface mount technology.

Published in:

International Journal of Advanced Manufacturing Technology, 2021, v. 115, n. 5/6, p. 1475, doi. 10.1007/s00170-021-07147-7

By:

He, Jingxi;
Cen, Yuqiao;
Li, Yuanyuan;
Alelaumi, Shrouq M.;
Won, Daehan

Publication type:

Article

Three-dimensional CFD simulation of the stencil printing performance of solder paste.

Published in:

International Journal of Advanced Manufacturing Technology, 2020, v. 108, n. 9/10, p. 3351, doi. 10.1007/s00170-020-05636-9

By:

Rusdi, M. S.;
Abdullah, M. Z.;
Ishak, M. H. H.;
Aziz, M. S. Abdul;
Abdullah, M. K.;
Rethinasamy, P.;
Jalar, A.

Publication type:

Article

配位剂对MSA 体系电镀锡-铟合金的影响及镀层的焊接可靠性.

Published in:

Electroplating & Finishing, 2023, v. 42, n. 5, p. 8, doi. 10.19289/j.1004-227x.2023.05.002

By:

许永姿;
杨瑶;
蔡珊珊;
彭巨擘;
王加俊

Publication type:

Article

Preparation and reflow soldering characteristics of solder paste containing submicron Sn powders synthesised via chemical reduction.

Published in:

Research on Chemical Intermediates, 2014, v. 40, n. 7, p. 2463, doi. 10.1007/s11164-014-1655-0

By:

Chee, Sang-Soo;
Lee, Jong-Hyun

Publication type:

Article

Selective electrochemical etching of the Sn-3Ag-0.5Cu/0.07 wt% graphene nanoparticle composite solder.

Published in:

Arabian Journal of Chemistry, 2021, v. 14, n. 10, p. N.PAG, doi. 10.1016/j.arabjc.2021.103392

By:

Ahmad, Ibrahym;
Firdaus Mohd Nazeri, Muhammad;
Azmira Salleh, Nor;
Kheawhom, Soorathep;
Mustafa Erer, Ahmet;
Kurt, Adem;
Azmin Mohamad, Ahmad

Publication type:

Article

Influence of solder and flux composition on thermal stability of brazed PDC cutters.

Published in:

Welding International, 2021, v. 35, n. 1-3, p. 121, doi. 10.1080/09507116.2021.1963535

By:

Pashkov, I. N.;
Misnikov, V. E.;
Morozov, V. A.;
Gadzhiev, M.;
Bazlova, T. A.

Publication type:

Article

Calorimetric investigation of the Cu-Sn-Bi lead-free solder system.

Published in:

Journal of Thermal Analysis & Calorimetry, 2008, v. 92, n. 1, p. 227, doi. 10.1007/s10973-007-8814-0

By:

Amore, S.;
Delsante, S.;
Parodi, N.;
Borzone, G.

Publication type:

Article

Effect of metakaolin pozzolanic activity in the early stages of cement type II paste and mortar hydration.

Published in:

Journal of Thermal Analysis & Calorimetry, 2008, v. 92, n. 1, p. 115, doi. 10.1007/s10973-007-8749-5

By:

da Cunha, A. L. Cherem;
Gonçalves, J. P.;
Büchler, P. M.;
Dweck, J.

Publication type:

Article

锡粉粒度对SAC305 锡膏黏度和润湿性能的影响.

Published in:

Journal of Henan University of Science & Technology, Natural Science, 2022, v. 43, n. 6, p. 12, doi. 10.15926/j.cnki.issn1672-6871.2022.06.003

By:

许国栋;
闫焉服;
高婷婷;
李永康

Publication type:

Article

Cover Image.

Published in:

Progress in Photovoltaics, 2025, v. 33, n. 2, p. i, doi. 10.1002/pip.3889

By:

Wang, Qinqin;
Guo, Kaiyuan;
Gu, Siwen;
Huang, Wei;
Wu, Wangping;
Ding, Jianning

Publication type:

Article

有机酸对SAC305焊锡膏焊接性能的影响.

Published in:

Journal of Xi'an Polytechnic University, 2025, v. 39, n. 1, p. 97, doi. 10.13338/j.issn.1674-649x.2025.01.012

By:

付翀;
李振阳;
李旭;
肖冬;
周小伟

Publication type:

Article

基于有限元的Mini-LED灭灯分析.

Published in:

Chinese Journal of Liquid Crystal & Displays, 2020, v. 35, n. 1, p. 53, doi. 10.3788/YJYXS20203501.0053

By:

刘硕;
吴仁杰;
杨贤;
刘阳;
马可;
朱红丽;
周昊;
孙海威

Publication type:

Article

Head-on-Pillow Defect Detection: X-Ray Inspection Limitations.

Published in:

Journal of Microelectronic & Electronic Packaging, 2019, v. 16, n. 2, p. 91, doi. 10.4071/imaps.871613

By:

Bruno, Lars;
Gustafson, Benny

Publication type:

Article

Thermal Stability of Intermetallic Cu-Sn Interconnections for High Temperature Applications.

Published in:

Journal of Microelectronic & Electronic Packaging, 2018, v. 15, n. 1, p. 35, doi. 10.4071/imaps.529384

By:

Novikov, A.;
Nowottnick, M.

Publication type:

Article

Tin Nanoparticle-Based Solder Paste for Low Temperature Processing.

Published in:

Journal of Microelectronic & Electronic Packaging, 2013, v. 10, n. 4, p. 129, doi. 10.4071/imaps.386

By:

Diaz, Alfredo J.;
Ma, David;
Zinn, Alfred;
Quintero, Pedro O.

Publication type:

Article

Electrical and Mechanical Performance of Quilt Packaging with Solder Paste by Pin Transfer.

Published in:

Journal of Microelectronic & Electronic Packaging, 2012, v. 9, n. 4, p. 160, doi. 10.4071/imaps.359

By:

Quanling Zheng;
Khan, M. Ashraf;
Kriman, Alfred M.;
Bernstein, Gary H.

Publication type:

Article

Solder paste inspection using region-based defect detection.

Published in:

International Journal of Advanced Manufacturing Technology, 2009, v. 42, n. 7/8, p. 725, doi. 10.1007/s00170-008-1639-6

By:

Tak-Wai Hui;
Grantham Pang

Publication type:

Article

Construction of 3D solder paste surfaces using multi-projection images.

Published in:

International Journal of Advanced Manufacturing Technology, 2006, v. 31, n. 5/6, p. 509, doi. 10.1007/s00170-005-0221-8

By:

Chung-Hsien Kuo;
Fang-Chung Yang;
Jein-Jong Wing;
Ching-Kun Yang

Publication type:

Article

Influence of Aging Processes on the Characteristics of Power LEDs Soldered Using Composite Solder Pastes.

Published in:

Applied Sciences (2076-3417), 2025, v. 15, n. 1, p. 324, doi. 10.3390/app15010324

By:

Górecki, Krzysztof;
Ptak, Przemysław;
Skwarek, Agata

Publication type:

Article