Works matching DE "SOLDER pastes"
Results: 192
Numerical simulation of SAC305/Cu friction inlay welding based on Coupled Eulerian–Lagrangian approach.
- Published in:
- International Journal of Advanced Manufacturing Technology, 2024, v. 135, n. 1/2, p. 119, doi. 10.1007/s00170-024-14569-6
- By:
- Publication type:
- Article
A pick-and-place process control based on the bootstrapping method for quality enhancement in surface mount technology.
- Published in:
- International Journal of Advanced Manufacturing Technology, 2024, v. 133, n. 1/2, p. 745, doi. 10.1007/s00170-024-13767-6
- By:
- Publication type:
- Article
Obtaining a low-temperature paste based on eutectic silumin for soldering special-purpose products.
- Published in:
- International Journal of Advanced Manufacturing Technology, 2022, v. 119, n. 5/6, p. 3857, doi. 10.1007/s00170-021-08619-6
- By:
- Publication type:
- Article
A novel placement method for mini-scale passive components in surface mount technology.
- Published in:
- International Journal of Advanced Manufacturing Technology, 2021, v. 115, n. 5/6, p. 1475, doi. 10.1007/s00170-021-07147-7
- By:
- Publication type:
- Article
Three-dimensional CFD simulation of the stencil printing performance of solder paste.
- Published in:
- International Journal of Advanced Manufacturing Technology, 2020, v. 108, n. 9/10, p. 3351, doi. 10.1007/s00170-020-05636-9
- By:
- Publication type:
- Article
Increasing the Strength of Soldered Joints by Introducing Carbon Nanotubes into Soldering Pastes.
- Published in:
- Journal of Engineering Physics & Thermophysics, 2022, v. 95, n. 6, p. 1437, doi. 10.1007/s10891-022-02612-w
- By:
- Publication type:
- Article
New Version of High-Damping PCB with Multi-Layered Viscous Lamina.
- Published in:
- Aerospace (MDPI Publishing), 2021, v. 8, n. 8, p. 202, doi. 10.3390/aerospace8080202
- By:
- Publication type:
- Article
Re‐Evaluation of a Dual‐Feed Linear Polarized 2‐by‐2 Circular Patch Array Antenna for 60‐GHz‐Band Digital Beamforming Applications.
- Published in:
- 2021
- By:
- Publication type:
- Letter to the Editor
Effects of Zinc Oxide Nanoparticles on Properties of SAC0307 Lead-Free Solder Paste.
- Published in:
- Advances in Materials Science & Engineering, 2018, p. 1, doi. 10.1155/2018/3750742
- By:
- Publication type:
- Article
Performance and interfacial reaction mechanism of nano-IMC-mixed solder paste with variable melting point.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 12, p. 1, doi. 10.1007/s10854-023-10410-0
- By:
- Publication type:
- Article
Microstructures and shear strengths of W-ball solder joints aged under isothermal and cyclic thermal conditions.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 8, p. 1, doi. 10.1007/s10854-023-10065-x
- By:
- Publication type:
- Article
Effect of Zn nanoparticle doped flux on electromigration damages in SAC305 solder joint.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 5, p. 1, doi. 10.1007/s10854-022-09646-z
- By:
- Publication type:
- Article
Effects of cobalt nanoparticle on microstructure of Sn58Bi solder joint.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 4, p. 1, doi. 10.1007/s10854-022-09465-2
- By:
- Publication type:
- Article
Optimization of reflow profile for copper pillar with SAC305 solder cap FCCSP.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 3, p. 1, doi. 10.1007/s10854-022-09661-0
- By:
- Publication type:
- Article
Comparative study of laser- and reflow-soldered Sn–3.0Ag–0.5Cu joints on thin Au/Pd/Ni(P) substrate.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 3, p. 1, doi. 10.1007/s10854-022-09632-5
- By:
- Publication type:
- Article
The effect of microstructure on shear tensile properties and microhardness profile of trace germanium added Cu/Sn–5Sb–0.7Cu lead-free solder joint.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 26, p. 21137, doi. 10.1007/s10854-022-08918-y
- By:
- Publication type:
- Article
Microstructure and mechanical properties of Sn–Bi solder joints reinforced with Zn@Sn core–shell particles.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 22, p. 17745, doi. 10.1007/s10854-022-08637-4
- By:
- Publication type:
- Article
Synthesis of Bi–Pb–Sn–Cd solder particles for joining Ag-plated PZT ceramics at 100 °C.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 8, p. 5899, doi. 10.1007/s10854-022-07771-3
- By:
- Publication type:
- Article
The doping of SZC solders with bismuth to improve their thermal and tensile characteristics for microelectronic applications.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 8, p. 4831, doi. 10.1007/s10854-021-07672-x
- By:
- Publication type:
- Article
EDS analysis on effect of low dosage gamma radiation and micromechanical properties of SnAg<sub>3</sub>Cu<sub>0.5</sub> solder.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 7, p. 4225, doi. 10.1007/s10854-021-07617-4
- By:
- Publication type:
- Article
Enhancing the properties of the SAC305-soldered joint: heat treatment of the nickel-plated copper substrate before reflow soldering.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 7, p. 3535, doi. 10.1007/s10854-021-07545-3
- By:
- Publication type:
- Article
Main application limitations of lead-free composite solder doped with foreign reinforcements.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 20, p. 24644, doi. 10.1007/s10854-021-06938-8
- By:
- Publication type:
- Article
Interfacial reaction, wettability, and shear strength of ultrasonic-assisted lead-free solder joints prepared using Cu–GNSs-doped flux.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 19, p. 24507, doi. 10.1007/s10854-021-06929-9
- By:
- Publication type:
- Article
Effect of grain size on the interface structure and shear behavior of lead-free solder joints.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 16, p. 21620, doi. 10.1007/s10854-021-06673-0
- By:
- Publication type:
- Article
Microstructure and properties of a vacuum-tempered glass with low-temperature-sintered silver paste.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 12, p. 16230, doi. 10.1007/s10854-021-06171-3
- By:
- Publication type:
- Article
Multi-Objective Optimization of Mn-Doped Tio<sub>2</sub> Content for Wettability, Printability and Intermetallic Layer of Sac305 Pb-Free Solder Paste on a Cu Substrate.
- Published in:
- Journal of Advanced Manufacturing Systems, 2021, v. 20, n. 4, p. 771, doi. 10.1142/S0219686721500372
- By:
- Publication type:
- Article
Studies of the Thermal Conductivity and Thermal Resistance of Solder Layers with Lead-Free Pastes by the Photodeflection Method.
- Published in:
- Technical Physics Letters, 2023, v. 49, n. 12, p. 265, doi. 10.1134/S1063785023900200
- By:
- Publication type:
- Article
Anisotropic constitutive model coupled with damage for Sn-rich solder: Application to SnAgCuSb solder under tensile conditions.
- Published in:
- International Journal of Damage Mechanics, 2022, v. 31, n. 4, p. 582, doi. 10.1177/10567895211045111
- By:
- Publication type:
- Article
Airborne contact dermatitis to colophony in soldering flux.
- Published in:
- Contact Dermatitis (01051873), 1987, v. 17, n. 2, p. 89, doi. 10.1111/j.1600-0536.1987.tb02667.x
- By:
- Publication type:
- Article
Microstructural Optimization of Sn-58Bi Low-Temperature Solder Fabricated by Intense Pulsed Light (IPL) Irradiation.
- Published in:
- Crystals (2073-4352), 2024, v. 14, n. 5, p. 465, doi. 10.3390/cryst14050465
- By:
- Publication type:
- Article
Residual Stress Testing and Simulation Analysis of Crystal Structures of Electronic Device Materials.
- Published in:
- Crystals (2073-4352), 2023, v. 13, n. 10, p. 1462, doi. 10.3390/cryst13101462
- By:
- Publication type:
- Article
XRF analyzers measure traces of lead in solders.
- Published in:
- Advanced Materials & Processes, 2005, v. 163, n. 2, p. 23
- Publication type:
- Article
Attributional and Consequential Environmental Assessment of the Shift to Lead-Free Solders.
- Published in:
- International Journal of Life Cycle Assessment, 2006, v. 11, n. 5, p. 344, doi. 10.1065/lca2005.05.208
- By:
- Publication type:
- Article
Active Soldering of ZnS–SiO2 Sputtering Targets to Copper Backing Plates Using an Sn56Bi4Ti(Ce, Ga) Filler.
- Published in:
- Materials & Manufacturing Processes, 2006, v. 21, n. 8, p. 761, doi. 10.1080/03602550600728349
- By:
- Publication type:
- Article
Effect of Rapid Solidification on Structure and Properties of Some Lead-Free Solder Alloys.
- Published in:
- Materials & Manufacturing Processes, 2006, v. 21, n. 8, p. 736, doi. 10.1080/10426910600727890
- By:
- Publication type:
- Article
Impact of processing conditions and solder materials on surface mount assembly defects.
- Published in:
- JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2011, v. 63, n. 10, p. 47, doi. 10.1007/s11837-011-0174-3
- By:
- Publication type:
- Article
Optimization of Solder Volume in Printed Circuit Board Assembly Through an Operating Window Experiment-A Case Study.
- Published in:
- Experimental Techniques, 2017, v. 41, n. 3, p. 309, doi. 10.1007/s40799-017-0168-3
- By:
- Publication type:
- Article
Extrusion molding of kaolin sorbents.
- Published in:
- Glass & Ceramics, 2007, v. 64, n. 7/8, p. 287, doi. 10.1007/s10717-007-0072-x
- By:
- Publication type:
- Article
锡粉粒度对SAC305 锡膏黏度和润湿性能的影响.
- Published in:
- Journal of Henan University of Science & Technology, Natural Science, 2022, v. 43, n. 6, p. 12, doi. 10.15926/j.cnki.issn1672-6871.2022.06.003
- By:
- Publication type:
- Article
Ultra‐Thin Chips with Printed Interconnects on Flexible Foils.
- Published in:
- Advanced Electronic Materials, 2022, v. 8, n. 5, p. 1, doi. 10.1002/aelm.202101029
- By:
- Publication type:
- Article
Analyzing the Overfitting of Boosted Decision Trees for the Modelling of Stencil Printing.
- Published in:
- Periodica Polytechnica: Electrical Engineering & Computer Science, 2022, v. 66, n. 2, p. 132, doi. 10.3311/PPee.19274
- By:
- Publication type:
- Article
Wettability of Sn-3.0Ag-0.5Cu Solder Reinforced with TiO 2 and Al 2 O 3 Nanoparticles at Different Reflow Times.
- Published in:
- Nanomaterials (2079-4991), 2023, v. 13, n. 20, p. 2811, doi. 10.3390/nano13202811
- By:
- Publication type:
- Article
CoSn 3 Intermetallic Nanoparticles for Electronic Packaging.
- Published in:
- Nanomaterials (2079-4991), 2022, v. 12, n. 22, p. 4083, doi. 10.3390/nano12224083
- By:
- Publication type:
- Article
Application of ZnO Nanoparticles in Sn99Ag0.3Cu0.7-Based Composite Solder Alloys.
- Published in:
- Nanomaterials (2079-4991), 2021, v. 11, n. 6, p. 1545, doi. 10.3390/nano11061545
- By:
- Publication type:
- Article
Soldering of Passive Components Using Sn Nanoparticle Reinforced Solder Paste: Influence on Microstructure and Joint Strength.
- Published in:
- Nanomaterials (2079-4991), 2019, v. 9, n. 10, p. 1478, doi. 10.3390/nano9101478
- By:
- Publication type:
- Article
Board Level Drop Test for Evaluating the Reliability of High-Strength Sn–Bi Composite Solder Pastes with Thermosetting Epoxy.
- Published in:
- Crystals (2073-4352), 2022, v. 12, n. 7, p. N.PAG, doi. 10.3390/cryst12070924
- By:
- Publication type:
- Article
Study on the Reliability of Sn–Bi Composite Solder Pastes with Thermosetting Epoxy under Thermal Cycling and Humidity Treatment.
- Published in:
- Crystals (2073-4352), 2021, v. 11, n. 7, p. 733, doi. 10.3390/cryst11070733
- By:
- Publication type:
- Article
Cu Pillar Electroplating Using a Synthetic Polyquaterntum Leveler and Its Coupling Effect on SAC305/Cu Solder Joint Voiding.
- Published in:
- Materials (1996-1944), 2024, v. 17, n. 22, p. 5405, doi. 10.3390/ma17225405
- By:
- Publication type:
- Article
A Novel Approach for Temperature-Induced Ball Grid Array Collapse Observation.
- Published in:
- Materials (1996-1944), 2024, v. 17, n. 11, p. 2693, doi. 10.3390/ma17112693
- By:
- Publication type:
- Article
Study of the Solder Characteristics of IGBT Modules Based on Thermal–Mechanical Coupling Simulation.
- Published in:
- Materials (1996-1944), 2023, v. 16, n. 9, p. 3504, doi. 10.3390/ma16093504
- By:
- Publication type:
- Article