Works matching DE "SOLDER joints"

Results: 1018

Enhancing Reliability and Durability of Solder Joints Using a Novel Sn-Ag-Bi-Ni Alloy.

Published in:

JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2025, v. 77, n. 6, p. 4215, doi. 10.1007/s11837-025-07269-3

By:

Lin, Wei-Ting;
Li, Kelvin;
Lin, Kuo-Shu;
Wang, Chang-Meng;
Wu, Albert T.

Publication type:

Article

Effect of Bi Addition on Melting Behavior, Solder Joint Strength, and Thermal Aging Resistance of Sn-3.5Ag/Cu Joints.

Published in:

JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2025, v. 77, n. 6, p. 4206, doi. 10.1007/s11837-025-07268-4

By:

Shen, Yu-An;
Chen, Fang-Yu;
Gao, Ruhuna;
Ho, Cheng-En;
Nishikawa, Hiroshi;
Chen, Chih-Ming

Publication type:

Article

A multimodal fusion method for soldering quality online inspection.

Published in:

Journal of Intelligent Manufacturing, 2025, v. 36, n. 5, p. 3271, doi. 10.1007/s10845-024-02413-3

By:

Xie, Jian;
Guo, Yu;
Liu, Daoyuan;
Huang, Shaohua;
Zheng, Kaiwen;
Tao, Yaning

Publication type:

Article

驱动电机换位连续波绕组及其交流损耗分析.

Published in:

Electric Machines & Control / Dianji Yu Kongzhi Xuebao, 2025, v. 29, n. 3, p. 109, doi. 10.15938/j.emc.2025.03.010

By:

边旭;
景冠睿;
李雪;
梁艳萍

Publication type:

Article

Enhancing Ball Grid Array (BGA) Component on Printed Circuit Board (PCB) Solder Joint Integrity with Antimony Element.

Published in:

Journal of Failure Analysis & Prevention, 2025, v. 25, n. 2, p. 813, doi. 10.1007/s11668-025-02144-4

By:

Jalar, Azman;
Lim, Ee May;
Abu Bakar, Maria;
Ismail, Adlil Aizat;
Che Ani, Fakhrozi;
Tan, Choo Par

Publication type:

Article

Retraction Note: Estimation of Thermomechanical Fatigue Lifetime of Ball Grid Solder Joints in Electronic Devices Using a Machine Learning Approach.

Published in:

2025

By:

Chen, Tzu-Chia;
Opulencia, Maria Jade Catalan;
Majdi, Hasan Sh.;
Hammid, Ali Thaeer;
Sharma, Himanshu;
Sajjadifar, Sami;
Surendar, Aravindhan

Publication type:

Correction Notice

Performance and reliability of nanoparticle-reinforced lead-free solder composite joints.

Published in:

Journal of Materials Science, 2025, v. 60, n. 17, p. 7091, doi. 10.1007/s10853-025-10882-x

By:

Liang, Kaiming;
Wan, Wenqiang;
Ding, Xiangdong;
He, Peng;
Zhang, Shuye

Publication type:

Article

Performance and interfacial reaction mechanism of nano-IMC-mixed solder paste with variable melting point.

Published in:

Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 12, p. 1, doi. 10.1007/s10854-023-10410-0

By:

Gao, He;
Liu, Wei;
Wang, Chunqing

Publication type:

Article

Microstructures and shear strengths of W-ball solder joints aged under isothermal and cyclic thermal conditions.

Published in:

Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 8, p. 1, doi. 10.1007/s10854-023-10065-x

By:

Wang, Wenhui;
Zhao, Xingke;
Zhao, Zenglei;
Rong, Yuhan

Publication type:

Article

Effect of Zn nanoparticle doped flux on electromigration damages in SAC305 solder joint.

Published in:

Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 5, p. 1, doi. 10.1007/s10854-022-09646-z

By:

Bashir, M. Nasir;
Khan, Abdul Faheem;
Bashir, Shahid;
Bashir, Mohamed Bashir Ali;
Jamshaid, Muhammad;
Javed, Iqra;
Ali, Imran

Publication type:

Article

Effects of cobalt nanoparticle on microstructure of Sn58Bi solder joint.

Published in:

Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 4, p. 1, doi. 10.1007/s10854-022-09465-2

By:

Bashir, Muhammad Nasir;
Haseeb, A. S. M. A.;
Naher, Sumsun;
Ali, Muhammad Mahmood;
Ali Bashir, Mohamed Bashir;
Zaidi, Asad A.;
Jamshaid, Muhammad;
Javed, Iqra

Publication type:

Article

Optimization of reflow profile for copper pillar with SAC305 solder cap FCCSP.

Published in:

Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 3, p. 1, doi. 10.1007/s10854-022-09661-0

By:

Zainudin, Wan Zamir Zakwan Wan;
Yong, Tan Chou;
Hui, Tan Cai;
Kar, Yap Boon;
Hoong, Wong Yew

Publication type:

Article

Tailoring thermal behavior and solid–liquid contact area of Sn/Cu composite solder during ultrasonic-assisted transient liquid phase process.

Published in:

Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 3, p. 1, doi. 10.1007/s10854-022-09653-0

By:

Pan, Hao;
Lu, Dashi;
Zhu, Lihua;
Li, Mingyu;
Ji, Hongjun

Publication type:

Article

Comparative study of laser- and reflow-soldered Sn–3.0Ag–0.5Cu joints on thin Au/Pd/Ni(P) substrate.

Published in:

Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 3, p. 1, doi. 10.1007/s10854-022-09632-5

By:

Lee, Dong-Hwan;
Jeong, Min-Seong;
Yoon, Jeong-Won

Publication type:

Article

Effects of Sn-Ag-x leveling layers on the microstructure and shear behavior of Sn-58Bi solder joint under thermal cycling.

Published in:

Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 3, p. 1, doi. 10.1007/s10854-022-09590-y

By:

Chen, Huifeng;
Liu, Yang;
Zhang, Shuang;
Cao, Rongxing;
Xue, Yuxiong

Publication type:

Article

Effect of different IMCs on the crystal orientation of IMCs/solder joint/Cu.

Published in:

Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 3, p. 1, doi. 10.1007/s10854-022-09502-0

By:

Han, Jing;
Meng, Zhou;
Jin, Xuelun;
Ma, Limin;
Guo, Fu;
Wang, Yishu;
Zhou, Wei;
An, Tong

Publication type:

Article

Insights into relationship between mechanical behavior and microstructure evolution of Sn-1.0Ag-0.5Cu-GNSs/Cu joint during thermal cycling.

Published in:

Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 2, p. 1, doi. 10.1007/s10854-022-09488-9

By:

Wu, Jie;
Huang, Guoqiang;
Wu, Yiping;
Huang, Xiwu;
Yu, Rui;
Yang, Xuqi;
Chen, Guangyao;
Xu, Yong

Publication type:

Article

Retraction Note to: Effect of grain size on the interface structure and shear behavior of lead-free solder joints.

Published in:

2023

By:

Xinmeng, Zhai;
Yue, Chen;
Yuefeng, Li;
Jun, Zou;
Mingming, Shi;
Bobo, Yang;
Jie, Yang;
Qi, Qian;
Cheng, Zhang

Publication type:

Correction Notice

Correction: Effect of cobalt nanoparticles on mechanical properties of Sn–58Bi solder joint.

Published in:

2022

By:

Bashir, M. Nasir;
Saad, Hafiz Muhammad;
Rizwan, Muhammad;
Bingöl, Sedat;
Channa, Iftikhar Ahmed;
Gul, Mustabshirha;
Haseeb, A. S. M. A.;
Naher, Sumsun

Publication type:

Correction Notice

A dual-scale elasto-viscoplastic self-consistent model for the cyclic behavior of polycrystalline materials considering combined nonlinear kinematic hardening.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 34, p. 26050, doi. 10.1007/s10854-022-09294-3

By:

He, Xu;
Liu, Lu;
Yao, Yao

Publication type:

Article

Interconnection method based on Cu-foam/Sn composite preform for high-temperature applications.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 34, p. 25964, doi. 10.1007/s10854-022-09287-2

By:

Lv, Ziwen;
Wang, Jianqiang;
Wang, Fengyi;
Wang, Jintao;
Duan, Fangcheng;
Zhang, Weiwei;
Hang, Chunjin;
Chen, Hongtao

Publication type:

Article

Microstructure evolution, IMC growth, and microhardness of Cu, Ni, Ag-microalloyed Sn–5Sb/Cu solder joints under isothermal aging.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 33, p. 25025, doi. 10.1007/s10854-022-09210-9

By:

Xin, Meiling;
Wang, Xiuqi;
Sun, Fenglian

Publication type:

Article

Shear performance of Cu/Sn–3.0Ag–0.5Cu/Cu joints with same solder volume and different heights at increasing current density.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 32, p. 24906, doi. 10.1007/s10854-022-09200-x

By:

Gong, Yubing;
Liu, Longgen;
He, Siliang;
Yan, Haidong;
Li, Wangyun;
Qin, Hongbo

Publication type:

Article

Effect of cobalt nanoparticles on mechanical properties of Sn–58Bi solder joint.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 28, p. 22573, doi. 10.1007/s10854-022-09035-6

By:

Nasir Bashir, M.;
Saad, Hafiz Muhammad;
Rizwan, Muhammad;
Bingöl, Sedat;
Channa, Iftikhar Ahmed;
Gul, Mustabshirha;
Haseeb, A. S. M. A.;
Naher, Sumsun

Publication type:

Article

Effects of tin particles addition on structural and mechanical properties of eutectic Sn–58Bi solder joint.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 28, p. 22499, doi. 10.1007/s10854-022-09028-5

By:

Bashir, M. Nasir;
Saad, Hafiz Muhammad;
Rizwan, Muhammad;
Quazi, M. M.;
Ali, Muhammad Mahmood;
Ahmed, Arslan;
Zaidi, Asad A.;
Soudagar, Manzoore Elahi M.;
Haseeb, A. S. M. A.;
Naher, Sumsun

Publication type:

Article

The effect of microstructure on shear tensile properties and microhardness profile of trace germanium added Cu/Sn–5Sb–0.7Cu lead-free solder joint.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 26, p. 21137, doi. 10.1007/s10854-022-08918-y

By:

Pooshgan, Hoda;
Naffakh-Moosavy, Homam

Publication type:

Article

Interface behavior and performance of Sn–Ag–Cu lead-free solder bearing Tb.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 26, p. 20769, doi. 10.1007/s10854-022-08886-3

By:

Yuan, Zeyu;
He, Yujie;
Wu, Ruize;
Xu, Ming;
Zhang, Jun;
Zhu, Yunqing;
Wang, Qiaoli;
Xie, Weibin;
Chen, Huiming

Publication type:

Article

Effect of Ni and Co nanoparticle-doped flux on microstructure of SAC305 solder matrix.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 25, p. 20106, doi. 10.1007/s10854-022-08827-0

By:

Bashir, M. Nasir;
Haseeb, A. S. M. A.;
Wakeel, Saif;
Khan, Muhammad Ali;
Quazi, M. M.;
Khan, Niaz Bahadur;
Ahmed, Arslan;
Soudagar, Manzoore Elahi M.

Publication type:

Article

Solid–liquid interdiffusion bonding of Cu/In/Ni microjoints.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 23, p. 18751, doi. 10.1007/s10854-022-08723-7

By:

Wang, Y. W.;
Wu, G. W.;
Tseng, T. T.;
Liang, H. T.

Publication type:

Article

Microstructure and mechanical properties of Sn–Bi solder joints reinforced with Zn@Sn core–shell particles.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 22, p. 17745, doi. 10.1007/s10854-022-08637-4

By:

Wang, Fengyi;
Wang, Xinjie;
Xu, Kexin;
Wang, Jintao;
Zhang, Weiwei;
Hang, Chunjin;
Chen, Hongtao;
Li, Mingyu

Publication type:

Article

Effect of trace Ge on interfacial reaction and shear strength of Sn-0.7Cu solder joints during isothermal aging and thermal cycling.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 21, p. 17137, doi. 10.1007/s10854-022-08589-9

By:

Yang, Weiran;
Ding, Yu;
Liao, Mingqing;
Wang, Fengjiang

Publication type:

Article

Effects of solder volume and size on microstructures and mechanical properties of Sn-3.0Ag-0.5Cu solder joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 20, p. 16700, doi. 10.1007/s10854-022-08567-1

By:

Seo, Young-Jin;
Yoon, Jeong-Won

Publication type:

Article

Creep performance of phase-inhomogeneous Cu/Sn–58Bi/Cu solder joints with increasing current density.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 20, p. 16167, doi. 10.1007/s10854-022-08507-z

By:

Li, Xingmin;
Wang, Jian;
Qin, Hongbo;
He, Siliang;
Li, Wangyun;
Wei, Song

Publication type:

Article

Effects of immersion silver (ImAg) and immersion tin (ImSn) surface finish on the microstructure and joint strength of Sn-3.0Ag-0.5Cu solder.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 17, p. 14249, doi. 10.1007/s10854-022-08353-z

By:

Amli, S. F. Muhd;
Salleh, M. A. A. Mohd;
Ramli, M. I. I.;
Aziz, M. S. Abdul;
Yasuda, H.;
Chaiprapa, J.;
Nogita, K.

Publication type:

Article

Grain size stability of interfacial intermetallic compound in Ni and Co nanoparticle-doped SAC305 solder joints under electromigration.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 17, p. 14240, doi. 10.1007/s10854-022-08352-0

By:

Bashir, M. Nasir;
Haseeb, A. S. M. A.

Publication type:

Article

Early transient creep of single crystal SnAgCu solder joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 17, p. 13657, doi. 10.1007/s10854-022-08300-y

By:

Das, Ronit;
Thekkut, Sanoop;
Sivasubramony, Rajesh Sharma;
Alghoul, Thaer;
Mahmood, Atif;
Joshi, Shantanu;
Arroyo, Carlos;
Sharma, Gaurav;
Borgesen, Peter

Publication type:

Article

Microstructure and shear strength of Au-20wt%Sn solder joints fabricated by thermo-compression bonding for LED packages.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 14, p. 11002, doi. 10.1007/s10854-022-08079-y

By:

Lee, Dong-hun;
Jang, Jae-il;
Kim, Young-Ho

Publication type:

Article

Effect of Ni-coated carbon nanotubes addition on the wettability, microhardness, and shear strength of Sn-3.0Ag-0.5Cu/Cu lead-free solder joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 14, p. 10866, doi. 10.1007/s10854-022-08067-2

By:

Qu, Min;
Gao, Zixuan;
Chen, Jin;
Cui, Yan

Publication type:

Article

On the study of morphological characteristics and growth mechanism of intermetallic compounds in ultrasonically fabricated Cu–Sn solder joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 13, p. 10677, doi. 10.1007/s10854-022-08051-w

By:

Han, Xu;
Li, Xiaoyan;
Ji, Gang

Publication type:

Article

Thermo-compression bonding process characteristics and shape control of Cu-pillar microbump joints by optimizing of solder melting.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 13, p. 10471, doi. 10.1007/s10854-022-08034-x

By:

Fang, Mingang;
Tang, Chu;
Chen, Yiming;
Li, Junhui;
Chen, Zhuo;
Wang, Fuliang;
Zhu, Wenhui

Publication type:

Article

Growth mechanisms of intermetallic compounds and Bi-rich layer in ball grid array structure Cu/Sn-58Bi/Cu solder joints during solid–solid and liquid–solid electromigration.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 13, p. 10297, doi. 10.1007/s10854-022-08018-x

By:

Huang, Jiaqiang;
Wang, Xudong;
Chen, Junyu;
Wei, Weichun;
Liu, Fengmei;
Qin, Binhao;
Wang, Haiyan;
Zhang, Yupeng

Publication type:

Article

Effect of soldering time on the microstructure and mechanical properties of SnBi/SACBN/Cu solder joint.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 10, p. 8270, doi. 10.1007/s10854-022-07981-9

By:

Liu, Yang;
Chang, Jian;
Xue, Yuxiong;
Cao, Rongxing;
Li, Hongxia;
Zheng, Shu;
Zeng, Xianghua

Publication type:

Article

Thermomigration behavior of Sn–Bi joints under different substrate.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 10, p. 8127, doi. 10.1007/s10854-022-07962-y

By:

Wu, Jun;
Wang, Kaipeng;
Wang, Fengjiang;
Liao, Mingqing

Publication type:

Article

Comparative study of interfacial reaction and bonding property of laser- and reflow-soldered Sn–Ag–Cu/Cu joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 10, p. 7983, doi. 10.1007/s10854-022-07948-w

By:

Lee, Dong-Hwan;
Jeong, Min-Seong;
Yoon, Jeong-Won

Publication type:

Article

Influence of 0.05 wt% Pr addition on interfacial microstructure and mechanical properties of Sn–0.3Ag–0.7Cu/Cu solder joint during thermal shocking.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 9, p. 7099, doi. 10.1007/s10854-022-07892-9

By:

Zhang, Peng;
Xue, Songbai;
Qian, Cheng;
Wang, Jianhao;
Liu, Lu;
Wu, Jie

Publication type:

Article

Synthesis of Bi–Pb–Sn–Cd solder particles for joining Ag-plated PZT ceramics at 100 °C.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 8, p. 5899, doi. 10.1007/s10854-022-07771-3

By:

Ye, Lingmin;
Liu, Yusheng;
He, Hongliang;
Zhang, Mu;
Zhu, Qi;
Sun, Xudong;
Li, Xiaodong

Publication type:

Article

A high-temperature-resistant die attach material based on Cu@In@Ag particles for high-power devices.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 8, p. 5599, doi. 10.1007/s10854-022-07747-3

By:

Mao, Xingchao;
Liu, Jiahao;
Yu, Fuwen;
Fu, Xing;
Hang, Chunjin;
Chen, Hongtao;
Li, Mingyu

Publication type:

Article

Shear performance of microscale ball grid array structure Sn–3.0Ag–0.5Cu solder joints with different surface finish combinations under electro-thermo-mechanical coupled loads.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 8, p. 4924, doi. 10.1007/s10854-021-07682-9

By:

Wang, Bo;
Li, Wangyun;
Pan, Kailin

Publication type:

Article

EDS analysis on effect of low dosage gamma radiation and micromechanical properties of SnAg<sub>3</sub>Cu<sub>0.5</sub> solder.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 7, p. 4225, doi. 10.1007/s10854-021-07617-4

By:

Lehan, Nur Farisa Nadia Mohmad;
Yusoff, Wan Yusmawati Wan;
Sobri, Normidatul Salwa;
Ahmad, Ku Zarina Ku;
Abdullah, Mohamad Faizal;
Amat, Azuraida;
Jalar, Azman;
Rahman, Irman Abdul;
Salleh, Emee Marina

Publication type:

Article

Investigating the physical, mechanical, and reliability study of high entropy alloy reinforced Sn–3.0Ag–0.5Cu solder using 1608 chip capacitor/ENIG joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 7, p. 3687, doi. 10.1007/s10854-021-07562-2

By:

Rajendran, Sri Harini;
Jung, Do Hyun;
Jung, Jae Pil

Publication type:

Article