Works matching DE "SOLDER joints"
Results: 985
Soldering reflow process optimization based on simulation.
- Published in:
- International Journal of Advanced Manufacturing Technology, 2025, v. 136, n. 7/8, p. 3163, doi. 10.1007/s00170-024-14944-3
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- Article
Effect of Mo Nanoparticles on the Microstructure Evolution and Tensile Strength of Sn58Bi/Cu Solder Joints.
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- Journal of Electronic Materials, 2025, v. 54, n. 3, p. 2308, doi. 10.1007/s11664-024-11621-9
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- Article
Multi-scale, Correlative Investigation of Thermo-mechanical Fatigue in SAC Solder Balls.
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- Microscopy & Microanalysis, 2024, v. 30, p. 1, doi. 10.1093/mam/ozae044.106
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- Article
Applying SEM, EPMA and EBSD Analytic Techniques on Solder Joint for Microelectronic Package Development.
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- 2019
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- Publication type:
- Abstract
Advancing surface mount technology quality: a computer-assisted approach for enhanced X-ray inspection of solder joints.
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- International Journal of Advanced Manufacturing Technology, 2024, v. 131, n. 12, p. 5897, doi. 10.1007/s00170-024-13343-y
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- Article
Improved performance of a heterogeneous weld joint of copper-steel AISI 1045 obtained by rotary friction using a metal powder insert.
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- International Journal of Advanced Manufacturing Technology, 2023, v. 124, n. 5/6, p. 1905, doi. 10.1007/s00170-022-10326-9
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- Publication type:
- Article
A review on numerical approach of reflow soldering process for copper pillar technology.
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- International Journal of Advanced Manufacturing Technology, 2022, v. 121, n. 7/8, p. 4325, doi. 10.1007/s00170-022-09724-w
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- Article
Effect of filling level and fillet profile on pin-through-hole solder joint.
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- International Journal of Advanced Manufacturing Technology, 2019, v. 102, n. 5-8, p. 1467, doi. 10.1007/s00170-018-03285-7
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- Article
SMT defect classification by feature extraction region optimization and machine learning.
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- International Journal of Advanced Manufacturing Technology, 2019, v. 101, n. 5-8, p. 1303, doi. 10.1007/s00170-018-3022-6
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- Publication type:
- Article
Avoiding inelastic strains in solder joint interconnections of space electronics.
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- ZAMM -- Journal of Applied Mathematics & Mechanics / Zeitschrift für Angewandte Mathematik und Mechanik, 2023, v. 103, n. 2, p. 1, doi. 10.1002/zamm.202200097
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- Article
Two hacksilver hoards and other finds discovered in Preedi village, Järvamaa County.
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- Archaeological Fieldwork in Estonia / Arheoloogilised Valitood Eestis, 2023, p. 89
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- Publication type:
- Article
Finite Element Analysis of SnAgCu(Zn, Co, Fe) Lead-free Solder Joints for Electronic Packaging.
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- International Journal of Nonlinear Sciences & Numerical Simulation, 2014, v. 15, n. 3/4, p. 197, doi. 10.1515/ijnsns-2012-0063
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- Publication type:
- Article
Reliability of Lead-free Solder Joints in WLCSP Device with Finite Element Simulation and Taguchi Method.
- Published in:
- International Journal of Nonlinear Sciences & Numerical Simulation, 2014, v. 15, n. 6, p. 405, doi. 10.1515/ijnsns-2014-0062
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- Publication type:
- Article
Dorn Creep Model and Finite Element Simulation of SnAgCu-CNT Solder Joints in FCBGA Device.
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- International Journal of Nonlinear Sciences & Numerical Simulation, 2014, v. 15, n. 5, p. 329, doi. 10.1515/ijnsns-2014-0020
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- Publication type:
- Article
Frontmatter.
- Published in:
- International Journal of Nonlinear Sciences & Numerical Simulation, 2014, v. 15, n. 3/4, p. i, doi. 10.1515/ijnsns-2014-frontmatter3-4
- Publication type:
- Article
FEM simulation of the size and constraining effect in lead free solder joints.
- Published in:
- Applied & Computational Mechanics, 2012, v. 6, n. 1, p. 17
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- Publication type:
- Article
Experimental Evaluation of the Effectiveness of the Printed Circuit Board Strain-Based Methodology in Space-Borne Electronics with Vertically Mounted Printed Circuit Boards.
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- Aerospace (MDPI Publishing), 2024, v. 11, n. 7, p. 562, doi. 10.3390/aerospace11070562
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- Publication type:
- Article
Experimental Evaluation of Vibrational Stability of SOPs in Aerospace Industry Using PCB Strain Effectiveness of a PCB-Strain-Based Design Methodology.
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- Aerospace (MDPI Publishing), 2023, v. 10, n. 6, p. 516, doi. 10.3390/aerospace10060516
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- Publication type:
- Article
Thermo-Mechanical Design and Validation of Spaceborne High-Speed Digital Receiver Unit for Synthetic Aperture Radar Application.
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- Aerospace (MDPI Publishing), 2021, v. 8, n. 10, p. 305, doi. 10.3390/aerospace8100305
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- Publication type:
- Article
New Version of High-Damping PCB with Multi-Layered Viscous Lamina.
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- Aerospace (MDPI Publishing), 2021, v. 8, n. 8, p. 202, doi. 10.3390/aerospace8080202
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- Publication type:
- Article
Industrial Fusion Cascade Detection of Solder Joint.
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- Computers, Materials & Continua, 2024, v. 81, n. 1, p. 1197, doi. 10.32604/cmc.2024.055893
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- Publication type:
- Article
Advanced Reliability Analysis of Mechatronic Packagings coupling ANSYS© and R.
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- International Journal for Simulation & Multidisciplinary Design Optimization, 2022, v. 13, p. 1, doi. 10.1051/smdo/2021038
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- Publication type:
- Article
Finite element modeling and random vibration analysis of BGA electronic package soldered using lead free solder alloy − Sn-1Cu-1Ni-1Ag.
- Published in:
- International Journal for Simulation & Multidisciplinary Design Optimization, 2019, v. 10, p. 1, doi. 10.1051/smdo/2019013
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- Publication type:
- Article
Optimization of solder joints in embedded mechatronic systems via Kriging-assisted CMA-ES algorithm.
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- International Journal for Simulation & Multidisciplinary Design Optimization, 2019, v. 10, p. 1, doi. 10.1051/smdo/2019002
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- Publication type:
- Article
高温高电流密度下 BGA 焊点电迁移损伤.
- Published in:
- Journal of Beijing University of Technology, 2021, v. 47, n. 11, p. 1264, doi. 10.11936/bjutxb2021040010
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- Publication type:
- Article
SABI333 焊点拉伸性能及晶界对焊点拉伸性能影响.
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- Journal of Beijing University of Technology, 2021, v. 47, n. 9, p. 1074, doi. 10.11936/bjutxb2019120025
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- Publication type:
- Article
基于价电子理论的 Ag-Sn 金属间化合物形成机理.
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- Journal of Beijing University of Technology, 2021, v. 47, n. 6, p. 655, doi. 10.11936/bjutxb2019100006
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- Publication type:
- Article
Effect of Power Cycling and Heat Aging on Reliability and IMC Growth of Sn-5Sb and Sn-10Sb Solder Joints.
- Published in:
- Advances in Materials Science & Engineering, 2018, p. 1, doi. 10.1155/2018/4829508
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- Article
Research Progress on the Solder Joint Reliability of Electronics Using in Deep Space Exploration.
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- Chinese Journal of Mechanical Engineering, 2023, v. 36, n. 1, p. 1, doi. 10.1186/s10033-023-00834-4
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- Publication type:
- Article
Backward Compatibility Solder Joint Formation at High Peak Reflow Temperature for Aerospace Applications.
- Published in:
- Arabian Journal for Science & Engineering (Springer Science & Business Media B.V. ), 2016, v. 41, n. 5, p. 1813, doi. 10.1007/s13369-015-1986-1
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- Publication type:
- Article
Reliability of PBGA Solder Joints under Random Vibration Load.
- Published in:
- International Journal of Performability Engineering, 2020, v. 16, n. 10, p. 1617, doi. 10.23940/ijpe.20.10.p13.16171626
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- Publication type:
- Article
S-N CURVE AND QUANTITATIVE RELATIONSHIP OF SINGLE-SPOT AND MULTI-SPOT WELDINGS.
- Published in:
- International Journal of Simulation Modelling (IJSIMM), 2020, v. 19, n. 3, p. 482, doi. 10.2507/IJSIMM19-3-CO11
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- Publication type:
- Article
Correction: Research on vibration reliability of solder joint based on modal experiment of PCBA.
- Published in:
- 2025
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- Correction Notice
Pulse electric current induced interfacial ductile phase on improving the mechanical properties of the Au20Sn/Cu solder joints.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2024, v. 35, n. 18, p. 1, doi. 10.1007/s10854-024-13002-8
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- Publication type:
- Article
Effects of aging time and temperature on shear properties of Sn–Zn and Sn–Ag–Cu solder joints.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2024, v. 35, n. 11, p. 1, doi. 10.1007/s10854-024-12440-8
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- Publication type:
- Article
Ceramic-to-metal bonding using rare-earth containing Sn–Bi solder.
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- Journal of Materials Science: Materials in Electronics, 2024, v. 35, n. 6, p. 1, doi. 10.1007/s10854-024-12176-5
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- Publication type:
- Article
Effects of solder ball size and reflow cycles on properties of Sn-3.0Ag-0.5Cu/Cu joints.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 33, p. 1, doi. 10.1007/s10854-023-11618-w
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- Publication type:
- Article
Comparative study of solder joint reliability assessment on fan-out CSP and flip-chip DCA package.
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- Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 32, p. 1, doi. 10.1007/s10854-023-11546-9
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- Publication type:
- Article
Performance and interfacial reaction mechanism of nano-IMC-mixed solder paste with variable melting point.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 12, p. 1, doi. 10.1007/s10854-023-10410-0
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- Publication type:
- Article
Microstructures and shear strengths of W-ball solder joints aged under isothermal and cyclic thermal conditions.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 8, p. 1, doi. 10.1007/s10854-023-10065-x
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- Publication type:
- Article
Effect of Zn nanoparticle doped flux on electromigration damages in SAC305 solder joint.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 5, p. 1, doi. 10.1007/s10854-022-09646-z
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- Publication type:
- Article
Effects of cobalt nanoparticle on microstructure of Sn58Bi solder joint.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 4, p. 1, doi. 10.1007/s10854-022-09465-2
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- Publication type:
- Article
Optimization of reflow profile for copper pillar with SAC305 solder cap FCCSP.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 3, p. 1, doi. 10.1007/s10854-022-09661-0
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- Publication type:
- Article
Tailoring thermal behavior and solid–liquid contact area of Sn/Cu composite solder during ultrasonic-assisted transient liquid phase process.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 3, p. 1, doi. 10.1007/s10854-022-09653-0
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- Publication type:
- Article
Comparative study of laser- and reflow-soldered Sn–3.0Ag–0.5Cu joints on thin Au/Pd/Ni(P) substrate.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 3, p. 1, doi. 10.1007/s10854-022-09632-5
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- Publication type:
- Article
Effects of Sn-Ag-x leveling layers on the microstructure and shear behavior of Sn-58Bi solder joint under thermal cycling.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 3, p. 1, doi. 10.1007/s10854-022-09590-y
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- Publication type:
- Article
Effect of different IMCs on the crystal orientation of IMCs/solder joint/Cu.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 3, p. 1, doi. 10.1007/s10854-022-09502-0
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- Publication type:
- Article
Insights into relationship between mechanical behavior and microstructure evolution of Sn-1.0Ag-0.5Cu-GNSs/Cu joint during thermal cycling.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 2, p. 1, doi. 10.1007/s10854-022-09488-9
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- Publication type:
- Article
Retraction Note to: Effect of grain size on the interface structure and shear behavior of lead-free solder joints.
- Published in:
- 2023
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- Publication type:
- Correction Notice
Correction: Effect of cobalt nanoparticles on mechanical properties of Sn–58Bi solder joint.
- Published in:
- 2022
- By:
- Publication type:
- Correction Notice