Works matching DE "SOLDER joints"

Results: 1022

Effect of Ti Particles on Microstructural Evolution and Mechanical Properties of Ultrasonic‐Assisted Al2O3 Ceramic/Zn5Al‐xCu/2024Al Solder Joints.

Published in:

Advanced Engineering Materials, 2025, v. 27, n. 12, p. 1, doi. 10.1002/adem.202402621

By:

Chen, Chao;
Xu, Ke;
Gao, Xiaolei;
Li, Haijun

Publication type:

Article

Thermal Fatigue Behaviors of BGA Packages with an Optimized Solder Joint Layout.

Published in:

Electronics (2079-9292), 2025, v. 14, n. 11, p. 2286, doi. 10.3390/electronics14112286

By:

Abdel Razzaq, Mohammed;
Meilunas, Michael;
Cao, Xian A.;
Wilcox, Jim;
Ramini, Abdallah

Publication type:

Article

Vision-Based Structural Adhesive Detection for Electronic Components on PCBs.

Published in:

Electronics (2079-9292), 2025, v. 14, n. 10, p. 2045, doi. 10.3390/electronics14102045

By:

Zhang, Ruzhou;
Yan, Tengfei;
Zhang, Jian

Publication type:

Article

Retraction Note: Estimation of Thermomechanical Fatigue Lifetime of Ball Grid Solder Joints in Electronic Devices Using a Machine Learning Approach.

Published in:

2025

By:

Chen, Tzu-Chia;
Opulencia, Maria Jade Catalan;
Majdi, Hasan Sh.;
Hammid, Ali Thaeer;
Sharma, Himanshu;
Sajjadifar, Sami;
Surendar, Aravindhan

Publication type:

Correction Notice

Effects of Minor Addition of Cu and Ni on the Microstructure, Thermal and Mechanical Properties, and Wettability of Sn-58Bi Solder Alloys.

Published in:

Journal of Electronic Materials, 2025, v. 54, n. 5, p. 4154, doi. 10.1007/s11664-025-11861-3

By:

Sungkhaphaitoon, Phairote;
Chantaramanee, Suchart

Publication type:

Article

Time-Lapse Imaging of Bismuth Precipitation and Coarsening on the Surface of Sn-Ag-Cu-Bi Solder Joints After Thermal Cycling: Time-Lapse Imaging of Bismuth Precipitation and Coarsening on the Surface of Sn-Ag-Cu-Bi...: C.-L. Hsieh et al.

Published in:

Journal of Electronic Materials, 2025, v. 54, n. 4, p. 2657, doi. 10.1007/s11664-025-11747-4

By:

Hsieh, Chen-Lin;
Coyle, Richard J.;
Gourlay, Christopher M.

Publication type:

Article

The Effect of Gallium Addition on the Microstructure and Superconducting Properties of In-Bi-Sn Solder Alloys.

Published in:

Journal of Electronic Materials, 2025, v. 54, n. 4, p. 2628, doi. 10.1007/s11664-024-11584-x

By:

Zhou, Jiye;
Shahbazi, Mahboobeh;
Poitras, Jordan T.;
Tan, Xin Fu;
McDonald, Stuart D.;
Nogita, Kazuhiro

Publication type:

Article

Effect of Mo Nanoparticles on the Microstructure Evolution and Tensile Strength of Sn58Bi/Cu Solder Joints.

Published in:

Journal of Electronic Materials, 2025, v. 54, n. 3, p. 2308, doi. 10.1007/s11664-024-11621-9

By:

Zhao, Yuwen;
Yang, Jiyou;
Xu, Liming;
Zhao, Yueqi;
Li, Kun;
Yang, Linmei

Publication type:

Article

Misorientations and Subgrains in Sn-Ag and Sn-Ag-Cu Solder Balls After Solidification.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 12, p. 8024, doi. 10.1007/s11664-024-11447-5

By:

Sun, Sihan;
Xian, Jingwei;
Hsieh, Chen-Lin;
Gourlay, Christopher M.

Publication type:

Article

Effects of Mixed Percentage on the Microstructure and Mechanical Properties of Sn-52In/Sn-3.0Ag-0.5Cu Hybrid Solder Joints.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 10, p. 6463, doi. 10.1007/s11664-024-11350-z

By:

Zhao, W. T.;
Ren, J.;
Huang, M. L.

Publication type:

Article

The Evolution of Micro-Voids in Sn37Pb Solder Joints Under Electromechanical Coupling Loading.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 10, p. 6448, doi. 10.1007/s11664-024-11313-4

By:

Wang, Shaobin;
Liu, Peng;
Cong, Sen;
Guo, Weiqi;
Zhang, Weiwei

Publication type:

Article

The Comprehensive Effect of Electronic Irradiation and Thermal Cycling on the Thermal and Mechanical Properties of Sn-3.0Ag-0.5Cu Solder Joints.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 9, p. 5534, doi. 10.1007/s11664-024-11294-4

By:

Wu, Chencheng;
Liu, Yang;
Xue, Yuxiong;
Zhao, Xuewei;
Li, Nannan;
Zhu, Zhengqiang;
Xing, Chaoyang

Publication type:

Article

The Effect of Thermal Aging on the Mechanical Properties of Gold-Containing Solder Joints.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 9, p. 5460, doi. 10.1007/s11664-024-11264-w

By:

Bi, Yinghao;
Guo, Weiqi;
Wang, Shaobin;
Zhang, Weiwei;
Wu, Ping

Publication type:

Article

Simulation and Prediction of Creep Rate, Activation Energy, and Rupture Time of Sn94Sb5Ag1 Lead-Free Solder Alloy Using Artificial Neural Network Modeling.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 9, p. 5486, doi. 10.1007/s11664-024-11235-1

By:

Lebda, H. I.;
Habashy, D. M.;
Mousa, M. M.

Publication type:

Article

Enhanced Shear Strength of Sn-Bi/(111)Cu Joints by Refined Distribution of Bi in the Composite Solder.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 8, p. 4539, doi. 10.1007/s11664-024-11169-8

By:

Zhang, Dan;
Ma, Haoran;
Dong, Chong;
Guo, Tianhao;
Ma, Haitao;
Wang, Yunpeng

Publication type:

Article

In-Line Test Structures and Non-destructive Characterization of Electromigration-Driven Phase Evolution in Microscale Solder Joints.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 6, p. 3070, doi. 10.1007/s11664-024-11043-7

By:

Jois, Chetan;
Chou, Pei-En;
Subbarayan, Ganesh

Publication type:

Article

Study on Microstructure and Joint Strength of Sn-0.7Cu-0.8Zn/Cu Solder Joints by Bi Addition Modification.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 6, p. 3049, doi. 10.1007/s11664-024-11029-5

By:

Tu, Wenbin;
Wang, Hanbing;
Wang, Shanlin;
Chen, Yuhua;
Wei, Mingwei;
Zhang, Timing;
Xie, Jilin

Publication type:

Article

Thermal Cycling–Electric Current Coupling Damage Mechanisms of SnAgCu/Cu Solder Joints Under Different Temperature Ranges.

Published in:

Journal of Electronic Materials, 2024, v. 53, n. 5, p. 2544, doi. 10.1007/s11664-024-10975-4

By:

Zhang, Q. K.;
An, C. W.;
Song, Z. L.

Publication type:

Article

The interfacial Cu–Sn intermetallic compounds (IMCs) growth behavior of Cu/Sn/Cu sandwich structure via induction heating method.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 20, p. 18878, doi. 10.1007/s10854-019-02244-6

By:

Sun, Fenglian;
Yin, Zuozhu

Publication type:

Article

Effects of TiO2 nanoparticles addition on physical and soldering properties of Sn–xTiO2 composite solder.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 20, p. 18828, doi. 10.1007/s10854-019-02239-3

By:

Liu, Zhiyuan;
Ma, Haoran;
Shang, Shengyan;
Wang, Yunpeng;
Li, Xiaogan;
Ma, Haitao

Publication type:

Article

Influences of Ag and In alloying on Sn-Bi eutectic solder and SnBi/Cu solder joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 20, p. 18524, doi. 10.1007/s10854-019-02206-y

By:

Wang, Z.;
Zhang, Q. K.;
Chen, Y. X.;
Song, Z. L.

Publication type:

Article

Wettability, interfacial reaction and mechanical properties of Sn/Sn–CuZnAl solder and Cu sheet during solid–liquid diffusion.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 20, p. 18462, doi. 10.1007/s10854-019-02200-4

By:

Sun, Lei;
Chen, Ming-he;
Zhang, Liang;
Xie, Lan-sheng;
Wei, Chun-chun

Publication type:

Article

Shear strength, fracture mechanism and plastic performance of Cu/Sn5Sb–xCuNiAg/Cu solder joints during thermal aging.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 20, p. 18342, doi. 10.1007/s10854-019-02188-x

By:

Han, Bangyao;
Sun, Fenglian;
Li, Tianhui;
Liu, Yang

Publication type:

Article

Microstructure and shear property of In-Sn-xAg solder joints fabricated by TLP bonding.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 19, p. 18211, doi. 10.1007/s10854-019-02175-2

By:

Yang, Li;
Xiong, Yifeng;
Zhang, Yaocheng;
Jiang, Wei;
Wei, Di

Publication type:

Article

Void fraction of a Sn–Ag–Cu solder joint underneath a chip resistor and its effect on joint strength and thermomechanical reliability.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 17, p. 15889, doi. 10.1007/s10854-019-01935-4

By:

Seo, Wonil;
Ko, Yong-Ho;
Kim, Young-Ho;
Yoo, Sehoon

Publication type:

Article

Microstructures and properties of SnAgCu lead-free solders bearing CuZnAl particles.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 16, p. 15054, doi. 10.1007/s10854-019-01878-w

By:

Zhao, Meng;
Zhang, Liang;
Liu, Zhi-quan;
Xiong, Ming-yue;
Sun, Lei;
Jiang, Nan;
Xu, Kai-kai

Publication type:

Article

Influence of Ni and Cu electrodeposits on the interfacial reaction between SAC305 solder and the Bi2(Te,Se)3 thermoelectric material.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 15, p. 14791, doi. 10.1007/s10854-019-01852-6

By:

Cheng, Jinxuan;
Hu, Xiaowu;
Li, Qinglin

Publication type:

Article

Effect of Cu6Sn5 nanoparticles size on the properties of Sn0.3Ag0.7Cu nano-composite solders and joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 15, p. 14726, doi. 10.1007/s10854-019-01844-6

By:

Min, Zhixian;
Qiu, Yu;
Hu, Xiaowu;
Wang, Haozhong

Publication type:

Article

Microstructure and shear behavior of solder joint with Sn58Bi/Sn3.0Ag0.5Cu/Cu superposition structure.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 15, p. 14077, doi. 10.1007/s10854-019-01773-4

By:

Liu, Yang;
Xu, Ruisheng;
Zhang, Hao;
Sun, Fenglian

Publication type:

Article

Leveraging prior strain rates effect during stress relaxation of Sn–1.7Ag–0.7Cu lead-free alloys with microalloying of Te and Co for microelectronics applications.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 14, p. 13757, doi. 10.1007/s10854-019-01758-3

By:

El-Daly, A. A.;
Zohdy, K. M.;
Abdo, M. A.;
Eid, N. A. M.

Publication type:

Article

The microstructure and shear behavior of Zn–25Sn–xTi solder joints with Ni substrate.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 14, p. 13090, doi. 10.1007/s10854-019-01672-8

By:

Chang, Che-Wei;
Lin, Kwang-Lung

Publication type:

Article

Effects of Ni layer thickness of thin-ENEPIG surface finishes on the interfacial reactions and shear strength of Sn-3.0Ag–0.5Cu solder joints during aging.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 14, p. 12911, doi. 10.1007/s10854-019-01653-x

By:

Kim, Jungsoo;
Back, Jong-Hoon;
Jung, Seung-Boo;
Yoon, Jeong-Won

Publication type:

Article

Effect of flux doped with Cu6Sn5 nanoparticles on the interfacial reaction of lead-free solder joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 12, p. 11552, doi. 10.1007/s10854-019-01512-9

By:

Wang, Haozhong;
Hu, Xiaowu;
Li, Qinglin;
Qu, Min

Publication type:

Article

The reliability of lead-free solder joint subjected to special environment: a review.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 10, p. 9065, doi. 10.1007/s10854-019-01333-w

By:

Wang, Jianhao;
Xue, Songbai;
Zhang, Peng;
Zhai, Peizhuo;
Tao, Yu

Publication type:

Article

Novel insights in growth of intermetallic compounds between Sn–3.0Ag–0.5Cu solder and flexible PCB substrates under strain.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 10, p. 9410, doi. 10.1007/s10854-019-01271-7

By:

Zhang, Xudong;
Hu, Xiaowu;
Jiang, Xiongxin;
Li, Qinglin;
Zhou, Liuru

Publication type:

Article

Effects of γ-ray irradiation on microstructure and mechanical property of AuSn20 solder joint.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 10, p. 9489, doi. 10.1007/s10854-019-01280-6

By:

Wen, Li;
Xue, Songbai;
Wang, JianXin;
Long, Weimin;
Zhong, Shujuan

Publication type:

Article

Electromigration reliability of Sn–3.0Ag–0.5Cu/Cu–Zn solder joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 8, p. 7645, doi. 10.1007/s10854-019-01080-y

By:

Park, Jae-Yong;
Lee, Taeyoung;
Seo, Wonil;
Yoo, Sehoon;
Kim, Young-Ho

Publication type:

Article

Thermal fatigue life of Sn–3.0Ag–0.5Cu solder joint under temperature cycling coupled with electric current.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 8, p. 7654, doi. 10.1007/s10854-019-01081-x

By:

Long, Xu;
Liu, Yongchao;
Jia, Fengrui;
Wu, Yanpei;
Fu, Yonghui;
Zhou, Cheng

Publication type:

Article

Electromigration behavior of Cu/Sn3.0Ag0.5Cu/Cu ball grid array solder joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 6, p. 6224, doi. 10.1007/s10854-019-00925-w

By:

Jiang, Yiming;
Li, Hailong;
Chen, Gang;
Mei, Yunhui;
Wang, Meiyu

Publication type:

Article

Unique interfacial reaction and so-induced change in mechanical performance of Sn-3.0Ag-0.5Cu/Cu solder joints formed during undercooled and eutectic liquid soldering processes.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 5, p. 4770, doi. 10.1007/s10854-019-00771-w

By:

Zhou, M. B.;
Zhao, X. F.;
Yue, W.;
Zhang, X. P.

Publication type:

Article

Lead-free Sn-based/MW-CNTs nanocomposite soldering: effects of reinforcing content, Ni-coating modification, and isothermal ageing treatment.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 5, p. 4737, doi. 10.1007/s10854-019-00767-6

By:

Javid, N. Shahamat;
Sayyadi, R.;
Khodabakhshi, F.

Publication type:

Article

Size effect on interface reaction of Sn-xCu/Cu solder joints during multiple reflows.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 5, p. 4359, doi. 10.1007/s10854-019-00758-7

By:

Huang, Ru;
Ma, Haoran;
Shang, Shengyan;
Kunwar, Anil;
Wang, Yunpeng;
Ma, Haitao

Publication type:

Article

Piezoelectricity, piezoresistivity and dielectricity discovered in solder.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 5, p. 4462, doi. 10.1007/s10854-019-00735-0

By:

Xi, Xiang;
Chung, D. D. L.

Publication type:

Article

Influence of nano-metric Al2O3 particles addition on thermal behavior, microstructural and tensile characteristics of hypoeutectic Sn-5.0Zn-0.3Cu Pb-free solder alloy.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 4, p. 4326, doi. 10.1007/s10854-019-00726-1

By:

Eid, E. A.;
El-Basaty, A. B.;
Deghady, A. M.;
Kaytbay, Saleh;
Nassar, Abbass

Publication type:

Article

Recent progress on the development of Sn-Bi based low-temperature Pb-free solders.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 4, p. 3222, doi. 10.1007/s10854-019-00701-w

By:

Wang, Fengjiang;
Chen, Hong;
Huang, Ying;
Liu, Luting;
Zhang, Zhijie

Publication type:

Article

Relationship between free solder thickness to the solderability of Sn-0.7Cu-0.05Ni solder coating during soldering.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 4, p. 3669, doi. 10.1007/s10854-018-00647-5

By:

Ramli, M. I. I.;
Mohd Salleh, M. A. A.;
Mohd Sobri, F. A.;
Narayanan, P.;
Sweatman, K.;
Nogita, K.

Publication type:

Article

The fast formation of full Cu3Sn solder joints in Cu/Sn/Cu system by thermal gradient bonding.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 3, p. 2146, doi. 10.1007/s10854-018-0486-y

By:

Yin, Zuozhu;
Sun, Fenglian;
Guo, Mengjiao

Publication type:

Article

Effect of Ni addition into the Cu substrate on the interfacial IMC growth during the liquid-state reaction with Sn-58Bi solder.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 2, p. 1907, doi. 10.1007/s10854-018-0464-4

By:

Hu, Xiaowu;
Qiu, Hongyu;
Jiang, Xiongxin

Publication type:

Article

Growth behavior of IMCs layer of the Sn-35Bi-1Ag on Cu, Ni-P/Cu and Ni-Co-P/Cu substrates during aging.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 2, p. 1519, doi. 10.1007/s10854-018-0423-0

By:

Li, Yulong;
Wang, Zhiliang;
Li, Xuewen;
Hu, Xiaowu;
Lei, Min

Publication type:

Article

Synergetic effect of strain rate and electroplated Cu film for shear strength of solder/Kovar joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 2, p. 1434, doi. 10.1007/s10854-018-0413-2

By:

Hu, Xiaowu;
Bao, Nifa;
Min, Zhixian

Publication type:

Article