Works matching DE "SOLDER joints"

Results: 1035

Beiträge. Machine learning-based prediction of remaining useful lifetime for solder joints based on real mission profile data.

Published in:

Technisches Messen, 2025, v. 92, n. 1, p. 56, doi. 10.1515/teme-2025-0056

By:

Bhat, Darshankumar;
Münch, Stefan;
Röllig, Mike;
Härtling, Thomas

Publication type:

Article

A Machine Learning Framework with Shapley's Additive Explanations to Assess Solder Joint Reliability for Electronic Packaging.

Published in:

Journal of Electronic Materials, 2025, v. 54, n. 9, p. 7586, doi. 10.1007/s11664-025-12101-4

By:

Qasaimeh, Qais;
Li, Haoran;
Hamasha, Saad;
Liu, Jia

Publication type:

Article

TECHNICAL ABSTRACTS Spring 2019.

Published in:: Texas Journal of Microscopy, 2020, v. 51, n. 1, p. 21
Publication type:: Article

Enhancing Reliability and Durability of Solder Joints Using a Novel Sn-Ag-Bi-Ni Alloy.

Published in:

JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2025, v. 77, n. 6, p. 4215, doi. 10.1007/s11837-025-07269-3

By:

Lin, Wei-Ting;
Li, Kelvin;
Lin, Kuo-Shu;
Wang, Chang-Meng;
Wu, Albert T.

Publication type:

Article

Effect of Bi Addition on Melting Behavior, Solder Joint Strength, and Thermal Aging Resistance of Sn-3.5Ag/Cu Joints.

Published in:

JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2025, v. 77, n. 6, p. 4206, doi. 10.1007/s11837-025-07268-4

By:

Shen, Yu-An;
Chen, Fang-Yu;
Gao, Ruhuna;
Ho, Cheng-En;
Nishikawa, Hiroshi;
Chen, Chih-Ming

Publication type:

Article

A Comprehensive Methodological Approach Towards the Micromechanical Characterization of Lead-Free Solder Joints: A Comprehensive Methodological Approach Towards the Micromechanical Characterization of Lead-Free Solder Joints: Buchebner, Keckes, Maier-Kiener, Imrich, and Kiener

Published in:

JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2025, v. 77, n. 5, p. 3526, doi. 10.1007/s11837-025-07289-z

By:

Buchebner, Nadine;
Keckes, Julius F.;
Maier-Kiener, Verena;
Imrich, Peter-Julian;
Kiener, Daniel

Publication type:

Article

Facets Formation of Ag3Sn Intermetallic in Sn-Bi-Ag Alloys: An EBSD and First-Principles Study.

Published in:

JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2024, v. 76, n. 6, p. 2741, doi. 10.1007/s11837-024-06500-x

By:

Liao, J. L.;
Hu, X. J.;
Wang, Y. R.;
Sun, W.;
Mi, G. Y.;
Xian, J. W.;
Zeng, G.

Publication type:

Article

Power Cycling Reliability with Temperature Deviation of Pressureless Silver Sintered Joint for Silicon Carbide Power Module.

Published in:

JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2024, v. 76, n. 6, p. 2763, doi. 10.1007/s11837-024-06398-5

By:

Hong, Won Sik;
Kim, Mi Song

Publication type:

Article

Correction: Thermal Fatigue Evaluation of Pb-Free Solder Joints: Results, Lessons Learned, and Future Trends.

Published in:

2023

By:

Coyle, Richard J.;
Sweatman, Keith;
Arfaei, Babak

Publication type:

Correction Notice

Microstructure and Properties of SiC Whisker Reinforced Sn-0.3Ag-0.7Cu Solder Alloy.

Published in:

JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2023, v. 75, n. 6, p. 1864, doi. 10.1007/s11837-023-05748-z

By:

Zhang, Hehe;
Yang, Man;
Yin, Limeng;
Zhang, Long;
Cai, Xinan;
Chai, Sensen;
Zhang, Liping;
Wang, Gang;
Xiao, Yuchen

Publication type:

Article

Liquid/Solid Interaction of Sn-58Bi/Sn-3.0Ag-0.5Cu Dissimilar Joints during Soldering at Low Temperature by In-Situ Synchrotron Imaging.

Published in:

JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2022, v. 74, n. 7, p. 2760, doi. 10.1007/s11837-022-05229-9

By:

Ramli, M. I. I.;
Salleh, M. A. A. Mohd;
Nishimura, T.;
Yasuda, H.;
Zaimi, N. S. Mohamad;
Nogita, K.

Publication type:

Article

The Variation of the Electrical Resistance and Microstructure of SnBi based Solder Joints with Current Stressing.

Published in:

JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2022, v. 74, n. 5, p. 2139, doi. 10.1007/s11837-022-05255-7

By:

Hadian, Faramarz;
Flores, Javier;
Cotts, Eric

Publication type:

Article

The Effects of Temperature and Solute Diffusion on Volume Change in Sn-Bi Solder Alloys.

Published in:

JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2022, v. 74, n. 4, p. 1739, doi. 10.1007/s11837-021-05145-4

By:

Hao, Qichao;
Tan, Xin F.;
Gu, Qinfen;
Sweatman, Keith;
McDonald, Stuart D.;
Nogita, Kazuhiro

Publication type:

Article

Formation of a Diffusion Barrier-Like Intermetallic Compound to Suppress the Formation of Micro-voids at the Sn-0.7Cu/Cu Interface by Optimal Ga Additions.

Published in:

JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2020, v. 72, n. 10, p. 3538, doi. 10.1007/s11837-020-04302-5

By:

Yang, Ting-Li;
Liu, Yu-chen;
Yang, Chih-han;
Kuo, Yi-kai;
Lin, Shih-kang

Publication type:

Article

Solder Joint Lifetime Modeling Under Random Vibrational Load Collectives.

Published in:

JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2020, v. 72, n. 2, p. 898, doi. 10.1007/s11837-019-03947-1

By:

Maniar, Youssef;
Konstantin, Georg;
Sharma, Anuj;
Binkele, Peter;
Schmauder, Siegfried

Publication type:

Article

Flexural Response of an Aluminum Foam Core/Stainless Steel Facesheet Sandwich Composite.

Published in:

JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2019, v. 71, n. 11, p. 4024, doi. 10.1007/s11837-019-03488-7

By:

Shunmugasamy, Vasanth Chakravarthy;
Mansoor, Bilal

Publication type:

Article

Advances in Electronic Interconnection Materials.

Published in:

JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2019, v. 71, n. 1, p. 131, doi. 10.1007/s11837-018-3267-4

By:

Gourlay, C. M.;
Arfaei, B.

Publication type:

Article

Three Dimensional Characterization of Tin Crystallography and CuSn Intermetallics in Solder Joints by Multiscale Tomography.

Published in:

JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2016, v. 68, n. 11, p. 2879, doi. 10.1007/s11837-016-2042-7

By:

Kirubanandham, A.;
Lujan-Regalado, I.;
Vallabhaneni, R.;
Chawla, N.

Publication type:

Article

Nucleation and Growth of Tin in Pb-Free Solder Joints.

Published in:

JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2015, v. 67, n. 10, p. 2383, doi. 10.1007/s11837-015-1582-6

By:

Gourlay, C.;
Belyakov, S.;
Ma, Z.;
Xian, J.

Publication type:

Article

Thermal Fatigue Evaluation of Pb-Free Solder Joints: Results, Lessons Learned, and Future Trends.

Published in:

JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2015, v. 67, n. 10, p. 2394, doi. 10.1007/s11837-015-1595-1

By:

Coyle, Richard;
Sweatman, Keith;
Arfaei, Babak

Publication type:

Article

Emerging Interconnects and Pb-free Materials for Advanced Electronic Packaging.

Published in:

2015

By:

Cotts, Eric;
Arfaei, Babak

Publication type:

Editorial

Topics in Lead-Free Solders: Restriction of Hazardous Substances Recast (RoHS2).

Published in:

2013

By:

Chada, Srinivas

Publication type:

Editorial

Characterization of Solder Joint Reliability Using Cyclic Mechanical Fatigue Testing.

Published in:

JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2013, v. 65, n. 10, p. 1362, doi. 10.1007/s11837-013-0720-2

By:

Kim, Choong-Un;
Bang, Woong-Ho;
Xu, Huili;
Lee, Tae-Kyu

Publication type:

Article

Experiment and Simulation in Design of the Board-Level Drop Testing Tower Apparatus.

Published in:

Experimental Techniques, 2012, v. 36, n. 2, p. 60, doi. 10.1111/j.1747-1567.2011.00755.x

By:

Chen, C.I.;
Chen, Y.T.;
Wu, S.C.;
Liu, D.S.;
Ni, C.Y.

Publication type:

Article

Thermal conductance at Sn-0.5mass%Al solder alloy/substrate interface as a factor for tailoring cellular/dendritic growth.

Published in:

Journal of Thermal Analysis & Calorimetry, 2022, v. 147, n. 8, p. 4945, doi. 10.1007/s10973-021-10755-w

By:

Oliveira, Ricardo;
Cruz, Clarissa;
Barros, André;
Bertelli, Felipe;
Spinelli, José Eduardo;
Garcia, Amauri;
Cheung, Noé

Publication type:

Article

Performance and reliability of nanoparticle-reinforced lead-free solder composite joints.

Published in:

Journal of Materials Science, 2025, v. 60, n. 17, p. 7091, doi. 10.1007/s10853-025-10882-x

By:

Liang, Kaiming;
Wan, Wenqiang;
Ding, Xiangdong;
He, Peng;
Zhang, Shuye

Publication type:

Article

Effect of electric pulse auxiliary reflow soldering on the microstructure and properties of Sn58Bi/Cu solder joints.

Published in:

Journal of Materials Science, 2025, v. 60, n. 2, p. 922, doi. 10.1007/s10853-024-10549-z

By:

Zhao, Jin;
Ji, Xiao-liang;
He, Jin-jiang;
Hou, Zhi-chao;
Song, Yao;
Zhu, Hong-lei;
Liu, Bing-rui;
Jia, Qiang;
Wang, Yi-shu

Publication type:

Article

Evaluating the role of nickel-coated carbon fiber in improving high-temperature capabilities of Sn–3.0Ag–0.5Cu solder joints.

Published in:

Journal of Materials Science, 2024, v. 59, n. 48, p. 22250, doi. 10.1007/s10853-024-10472-3

By:

Du, Yihui;
Ji, Xiaoliang;
Liu, Aiwei;
Wang, Yishu;
Guo, Fu

Publication type:

Article

Effect of ZnO nanoparticle addition on the wettability, microstructure and mechanical properties of In-45.6Sn-5Bi low temperature solder.

Published in:

Journal of Materials Science, 2024, v. 59, n. 31, p. 14661, doi. 10.1007/s10853-024-10038-3

By:

Ye, Lingmin;
Liu, Yusheng;
He, Hongliang;
Zhang, Mu;
zhu, Qi;
Sun, Xudong;
Li, Xiaodong

Publication type:

Article

Microstructure evolution and shear behavior of Pb–16Sn–7.5Sb–xAg/Cu joints.

Published in:

Journal of Materials Science, 2024, v. 59, n. 28, p. 13133, doi. 10.1007/s10853-024-09938-1

By:

Zhang, Xiaodi;
Wang, Richu;
Peng, Chaoqun;
Cai, Zhiyong;
Peng, Xiang;
Peng, Jian

Publication type:

Article

Role of Cu microstructure during isothermal aging of Cu/Sn/Cu micro solder joints.

Published in:

Journal of Materials Science, 2024, v. 59, n. 18, p. 7984, doi. 10.1007/s10853-024-09651-z

By:

Wei, H.;
Zhang, Z. J.;
Shi, Q.;
Zhou, X.;
Liang, W. R.

Publication type:

Article

Inhibition of roof-type Cu6Sn5 grains on migration of Cu atoms under temperature gradient.

Published in:

Journal of Materials Science, 2024, v. 59, n. 2, p. 669, doi. 10.1007/s10853-023-09225-5

By:

Li, Yuan;
Xu, Lianyong;
Zhao, Lei;
Hao, Kangda;
Han, Yongdian

Publication type:

Article

Thermomigration-induced failure in ball grid array solder joint under high current stressing.

Published in:

Journal of Materials Science, 2023, v. 58, n. 26, p. 10753, doi. 10.1007/s10853-023-08678-y

By:

Liu, Peng;
Cong, Sen;
Wang, Shaobin;
Wu, Ping

Publication type:

Article

Orientation transformation of Cu6Sn5 grains by Ag addition in Cu/Sn-xAg/Cu micro solder joints under temperature gradient.

Published in:

Journal of Materials Science, 2023, v. 58, n. 11, p. 5010, doi. 10.1007/s10853-023-08310-z

By:

Qiao, Yuanyuan;
Liang, Hongwei;
Zhao, Ning

Publication type:

Article

Retarding microstructural evolution of multiple-elemental SnAgCu solder joints during thermal cycling by strengthening Sn matrix.

Published in:

Journal of Materials Science, 2023, v. 58, n. 9, p. 4199, doi. 10.1007/s10853-023-08280-2

By:

Wang, Xuechi;
Ji, Xiaoliang;
Du, Yihui;
Wang, Yishu;
Guo, Fu

Publication type:

Article

The effect of solvents on thermal stability of solder pastes in reflow process.

Published in:

Journal of Materials Science, 2023, v. 58, n. 5, p. 2347, doi. 10.1007/s10853-023-08162-7

By:

Wang, Jiajun;
Peng, Jubo;
Cai, Shanshan;
Wang, Xiaojing

Publication type:

Article

Effect of electric current stressing on mechanical performance of solders and solder joints: A review.

Published in:

Journal of Materials Science, 2022, v. 57, n. 37, p. 17533, doi. 10.1007/s10853-022-07715-6

By:

Wang, Bo;
Li, Wangyun;
Zhang, Shuye;
Li, Xingmin;
Pan, Kailin

Publication type:

Article

Fabrication and properties of NiO-modified Al2O3 reinforced Sn1.0Ag0.5Cu composite solder and soldering performance.

Published in:

Journal of Materials Science, 2022, v. 57, n. 36, p. 17491, doi. 10.1007/s10853-022-07729-0

By:

Wang, Bingying;
Wu, Yongjin;
Wu, Wan;
Wang, Huigai;
Zhang, Keke

Publication type:

Article

Effects of GNSs addition on the electromigration of Sn58Bi and Cu-core Sn58Bi joint.

Published in:

Journal of Materials Science, 2022, v. 57, n. 32, p. 15598, doi. 10.1007/s10853-022-07590-1

By:

Liu, Peng;
Guo, Weiqi;
Wu, Ping

Publication type:

Article

Experimental studies on application of silver paste in thermosonic flip-chip bonding.

Published in:

Journal of Low Frequency Noise, Vibration & Active Control, 2023, v. 42, n. 1, p. 80, doi. 10.1177/14613484221118144

By:

Yang, Hui;
Zhan, Zhengbang

Publication type:

Article

汽车车门外露焊点压痕深度的综合优化.

Published in:

Metal Working (1674-165X), 2025, n. 1, p. 38

By:

颜丹丹;
彭其飞;
潘远安

Publication type:

Article

PBGA封装回流焊翘曲变形仿真与验证.

Published in:

Journal of Guangdong University of Technology, 2020, v. 37, n. 2, p. 94, doi. 10.12052/gdutxb.190047

By:

王晓锋;
何小琦;
尧彬

Publication type:

Article

Microstructure and Mechanical Properties of Lead-Free Solder Joints.

Published in:

Acta Physica Polonica: A, 2015, v. 128, n. 4, p. 750, doi. 10.12693/APhysPolA.128.750

By:

HARCUBA, P.;
TRŠKO, L.

Publication type:

Article

Mechanical performances of lead-free solder joint connections with applications in the aerospace domain.

Published in:

INCAS Bulletin, 2016, v. 8, n. 1, p. 131, doi. 10.13111/2066-8201.2016.8.1.12

By:

PADURARU, Georgiana;
TUDOR, Andrei;
PETRESCU, Alina;
PLOTOG, Ioan

Publication type:

Article

Effect of Sn grain orientation on microstructure and mechanical properties of pure Sn solder joints under thermoelectric coupling.

Published in:

Scientific Reports, 2025, v. 15, n. 1, p. 1, doi. 10.1038/s41598-025-12625-z

By:

Zhao, Wenjia;
Zhang, Keke;
Zhang, Yanzhen;
Liu, Zhu;
Zhang, Haizhou;
Zhang, Chao

Publication type:

Article

AI-driven point cloud framework for predicting solder joint reliability using 3D FEA data.

Published in:

Scientific Reports, 2025, v. 15, n. 1, p. 1, doi. 10.1038/s41598-025-06902-0

By:

Akhtar, Mohd Zubair;
Schmid, Maximilian;
Elger, Gordon

Publication type:

Article

AI-driven point cloud framework for predicting solder joint reliability using 3D FEA data.

Published in:

Scientific Reports, 2025, v. 15, n. 1, p. 1, doi. 10.1038/s41598-025-06902-0

By:

Akhtar, Mohd Zubair;
Schmid, Maximilian;
Elger, Gordon

Publication type:

Article

FEM simulation of the size and constraining effect in lead free solder joints.

Published in:

Applied & Computational Mechanics, 2012, v. 6, n. 1, p. 17

By:

Lederer, M.;
Khatibi, G.;
Weiss, B.

Publication type:

Article

Evaluation of the Quality of Solder Joints within Silicon Solar Modules Using Magnetic Field Imaging.

Published in:

Physica Status Solidi. A: Applications & Materials Science, 2021, v. 218, n. 6, p. 1, doi. 10.1002/pssa.202000292

By:

Kaufmann, Kai;
Lausch, Dominik;
Lin, Chia-Mei;
Rudolph, Maik;
Hahn, Daniel;
Patzold, Markus

Publication type:

Article

Reliability Investigations of a Sensor System Embedded into Printed Circuits Boards.

Published in:

Physica Status Solidi. A: Applications & Materials Science, 2021, v. 218, n. 4, p. 1, doi. 10.1002/pssa.202000622

By:

Janeczek, Kamil;
Araźna, Aneta;
Stęplewski, Wojciech;
Kościelski, Marek;
Lipiec, Krzysztof;
Liszewska, Dorota;
Sitek, Anna

Publication type:

Article