Works matching DE "SOLDER joint fractures"
1
- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 8, p. 8299, doi. 10.1007/s10854-016-4838-1
- Huang, Xiao-guang;
- Han, Zhong-ying
- Article
2
- Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 6, p. 3615, doi. 10.1007/s10854-015-2876-8
- Zhang, Liang;
- Han, Ji-guang;
- Guo, Yong-huan;
- Sun, Lei
- Article
3
- Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 8, p. 1515, doi. 10.1007/s10854-012-0621-0
- Cho, Ilje;
- Ahn, Jee-Hyuk;
- Yoon, Jeong-Won;
- Shin, Young-Eui;
- Jung, Seung-Boo
- Article
4
- Advances in Mechanical Engineering (Sage Publications Inc.), 2017, v. 9, n. 8, p. 1, doi. 10.1177/1687814017714976
- Chen, Gang;
- Zhao, Xiaochen;
- Wu, Hao
- Article
5
- Fatigue & Fracture of Engineering Materials & Structures, 2019, v. 42, n. 2, p. 425, doi. 10.1111/ffe.12920
- Nourani, Amir;
- Mirmehdi, Sadegh;
- Farrahi, Gholamhossein;
- Soroush, Farid
- Article
6
- Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2440, doi. 10.1007/s11664-015-3773-x
- Tang, Y.;
- Li, G.;
- Luo, S.;
- Wang, K.;
- Zhou, B.
- Article
7
- Journal of Electronic Materials, 2014, v. 43, n. 12, p. 4485, doi. 10.1007/s11664-014-3441-6
- Huang, Z.;
- Kumar, P.;
- Dutta, I.;
- Sidhu, R.;
- Renavikar, M.;
- Mahajan, R.
- Article
