Works matching DE "SOLDER joint fractures"
Results: 7
A critical review of constitutive models for solders in electronic packaging.
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- Advances in Mechanical Engineering (Sage Publications Inc.), 2017, v. 9, n. 8, p. 1, doi. 10.1177/1687814017714976
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- Article
Interface singular field analysis and thermal fatigue failure of solder joint in a stacked electronic modules.
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- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 8, p. 8299, doi. 10.1007/s10854-016-4838-1
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- Article
Creep behavior of SnAgCu solders containing nano-Al particles.
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- Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 6, p. 3615, doi. 10.1007/s10854-015-2876-8
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- Article
Mechanical strength and fracture mode transition of Sn-58Bi epoxy solder joints under high-speed shear test.
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- Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 8, p. 1515, doi. 10.1007/s10854-012-0621-0
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- Article
Creep Behavior of 95.8Sn-3.5Ag-0.7Cu Solder Joints, and a Modified Constitutive Model for the Joints.
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- Journal of Electronic Materials, 2015, v. 44, n. 7, p. 2440, doi. 10.1007/s11664-015-3773-x
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- Article
Effects of Microstructure and Loading on Fracture of Sn-3.8Ag-0.7Cu Joints on Cu Substrates with ENIG Surface Finish.
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- Journal of Electronic Materials, 2014, v. 43, n. 12, p. 4485, doi. 10.1007/s11664-014-3441-6
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- Article
Predicting fracture of solder joints with different constraint factors.
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- Fatigue & Fracture of Engineering Materials & Structures, 2019, v. 42, n. 2, p. 425, doi. 10.1111/ffe.12920
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- Article