Works matching DE "SOLDER %26 soldering testing"
1
- Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 24, p. 18515, doi. 10.1007/s10854-017-7799-0
- Xu, Tao;
- Hu, Xiaowu;
- Li, Yulong;
- Jiang, Xiongxin
- Article
2
- Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 24, p. 19181, doi. 10.1007/s10854-017-7877-3
- Sobhy, M.;
- Mahmoud, M.;
- Fayek, S.;
- Fawzy, J.;
- Fawzy, A.;
- Saad, G.
- Article
3
- Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 9, p. 3742, doi. 10.1007/s10854-014-2084-y
- Li, Xuemei;
- Sun, Fenglian;
- Liu, Yang;
- Zhang, Hao;
- Xin, Tong
- Article
4
- Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 9, p. 3816, doi. 10.1007/s10854-014-2094-9
- Li, Yi;
- Zhao, XiuChen;
- Liu, Ying;
- Wang, Yuan;
- Wang, Yong
- Article
5
- Materials Science & Technology, 2019, v. 35, n. 6, p. 680, doi. 10.1080/02670836.2019.1582192
- Benke, Marton;
- Salyi, Zsolt;
- Takats, Viktor;
- Csik, Attila;
- Rugoczky, Peter;
- Kaptay, George
- Article
6
- Advanced Engineering Materials, 2015, v. 17, n. 8, p. 1168, doi. 10.1002/adem.201500089
- Mayer, Carl R.;
- Lotfian, Saeid;
- Molina‐Aldareguia, Jon;
- Chawla, Nikhilesh
- Article
7
- Journal of Materials Science, 2013, v. 48, n. 2, p. 857, doi. 10.1007/s10853-012-6807-2
- Tseng, Chien-Fu;
- Duh, Jenq-Gong
- Article
8
- Journal of Electronic Materials, 2014, v. 43, n. 11, p. 4158, doi. 10.1007/s11664-014-3359-z
- Mokhtari, Omid;
- Nishikawa, Hiroshi
- Article
9
- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2573, doi. 10.1007/s11664-012-2167-6
- Ito, Takeyasu;
- Ogura, Tomo;
- Hirose, Akio
- Article
10
- Journal of Electronic Materials, 2012, v. 41, n. 9, p. 2631, doi. 10.1007/s11664-012-2145-z
- Shnawah, Dhafer;
- Said, Suhana;
- Sabri, Mohd;
- Badruddin, Irfan;
- Che, Fa
- Article
