Works about SOLDER & soldering
Results: 2910
Effects of Bi and In Addition on Microstructure and Properties of Sn-0.7Cu Solder.
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- Metals (2075-4701), 2025, v. 15, n. 2, p. 157, doi. 10.3390/met15020157
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- Article
Methods and Means of Eddy Current Testing of Soldered Lap Joints of Electrical Machines.
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- Applied Sciences (2076-3417), 2025, v. 15, n. 4, p. 2036, doi. 10.3390/app15042036
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Development of hypoeutectic SnBi alloy solder reinforced with WO<sub>3</sub> nanoparticles for connecting Cu substrates via thermal bonding.
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- Scientific Reports, 2025, v. 15, n. 1, p. 1, doi. 10.1038/s41598-025-89729-z
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Microstructure and Mechanical Properties of In-Doped Low-Temperature SnPb Solders.
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- Materials (1996-1944), 2025, v. 18, n. 4, p. 886, doi. 10.3390/ma18040886
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- Article
Electrically Tunable Metasurface for Multi-Polarized Reflection.
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- Remote Sensing, 2025, v. 17, n. 4, p. 700, doi. 10.3390/rs17040700
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Reliability Analysis of Complex PCB Assemblies Under Temperature Cycling and Random Vibration.
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- Micromachines, 2025, v. 16, n. 2, p. 212, doi. 10.3390/mi16020212
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Comparison of Implant-Abutment Interface Misfits After Casting and Soldering Procedures.
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- Journal of Oral Implantology, 2014, v. 40, n. 2, p. 129, doi. 10.1563/AAID-JOI-D-11-00070
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Using wet chemistry for etching under-bump metal.
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- Solid State Technology, 2001, v. 44, n. 10, p. 89
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Electrochemically deposited solder bumps for wafer-level packaging.
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- Solid State Technology, 2001, v. 44, n. 4, p. 83
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Thermal-mechanical stress analysis of a silicon-based system-in-a-package.
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- Solid State Technology, 2000, v. 43, n. 7, p. 279
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A MATHEMATICAL MODEL FOR A PSEUDO-PLASTIC WELDING JOINT.
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- Analysis & Applications, 2009, v. 7, n. 3, p. 243, doi. 10.1142/S0219530509001372
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- Article
Contents: (Adv. Funct. Mater. 34/2013).
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- Advanced Functional Materials, 2014, v. 23, n. 34, p. 4167, doi. 10.1002/adfm.201370172
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- Article
Room-Temperature Nanosoldering of a Very Long Metal Nanowire Network by Conducting-Polymer-Assisted Joining for a Flexible Touch-Panel Application.
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- Advanced Functional Materials, 2014, v. 23, n. 34, p. 4171, doi. 10.1002/adfm.201203802
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- Article
Metastable CoSn formation induced by minor Ga addition and effective suppression effect on the IMC growth in solid-state Sn-Ga/Co reactions.
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- Journal of Materials Science, 2016, v. 51, n. 15, p. 7309, doi. 10.1007/s10853-016-0013-6
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- Article
Ternary intermetallic compounds in Au-Sn soldering systems-structure and properties.
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- Journal of Materials Science, 2015, v. 50, n. 23, p. 7808, doi. 10.1007/s10853-015-9352-y
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- Article
Interfacially engineered liquid-phase-sintered Cu-In composite solders for thermal interface material applications.
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- Journal of Materials Science, 2014, v. 49, n. 22, p. 7844, doi. 10.1007/s10853-014-8495-6
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- Article
Effects of zinc on the interfacial reactions of tin-indium solder joints with copper.
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- Journal of Materials Science, 2014, v. 49, n. 10, p. 3805, doi. 10.1007/s10853-014-8092-8
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Solid-state interfacial reaction of eutectic Sn3.5Ag and pure tin solders with polycrystalline Cu substrate.
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- Journal of Materials Science, 2014, v. 49, n. 10, p. 3652, doi. 10.1007/s10853-014-8069-7
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Effect of structural transition in an amorphous NiP alloy on the wetting by a eutectic Sn-Bi solder.
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- Journal of Materials Science, 2014, v. 49, n. 7, p. 2932, doi. 10.1007/s10853-013-8004-3
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- Article
Creep deformation behavior of Sn-Zn solder alloys.
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- Journal of Materials Science, 2014, v. 49, n. 5, p. 2127, doi. 10.1007/s10853-013-7905-5
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Low temperature TLP bonding of AlO-ceramics using eutectic Au-(Ge, Si) alloys.
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- Journal of Materials Science, 2013, v. 48, n. 20, p. 7115, doi. 10.1007/s10853-013-7526-z
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Fracture behavior of Cu-cored solder joints.
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- Journal of Materials Science, 2011, v. 46, n. 21, p. 6897, doi. 10.1007/s10853-011-5654-x
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Effects of Co additions on electromigration behaviors in Sn-3.0 Ag-0.5 Cu-based solder joint.
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- Journal of Materials Science, 2011, v. 46, n. 14, p. 4896, doi. 10.1007/s10853-011-5401-3
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Tensile properties and wettability of SAC0307 and SAC105 low Ag lead-free solder alloys.
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- Journal of Materials Science, 2011, v. 46, n. 10, p. 3424, doi. 10.1007/s10853-010-5231-8
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- Article
Effects of electromigration on resistance changes in eutectic SnBi solder joints.
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- Journal of Materials Science, 2011, v. 46, n. 10, p. 3544, doi. 10.1007/s10853-011-5265-6
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AFM indentation method used for elastic modulus characterization of interfaces and thin layers.
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- Journal of Materials Science, 2010, v. 45, n. 12, p. 3190, doi. 10.1007/s10853-010-4326-6
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Microstructural evolutions in dissimilar welds between AISI 310 austenitic stainless steel and Inconel 657.
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- Journal of Materials Science, 2010, v. 45, n. 10, p. 2564, doi. 10.1007/s10853-010-4227-8
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Effects of temperature and strain rate on the mechanical properties of lead-free solders.
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- Journal of Materials Science, 2010, v. 45, n. 9, p. 2351, doi. 10.1007/s10853-009-4200-6
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Electromigration-enhanced intermetallic growth and phase evolution in Cu/Sn–58Bi/Cu solder joints.
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- Journal of Materials Science, 2010, v. 45, n. 4, p. 929, doi. 10.1007/s10853-009-4022-6
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Electromigration-induced Bi-rich whisker growth in Cu/Sn–58Bi/Cu solder joints.
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- Journal of Materials Science, 2010, v. 45, n. 2, p. 334, doi. 10.1007/s10853-009-3939-0
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Mechanical behavior of Au–In intermetallics for low temperature solder diffusion bonding.
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- Journal of Materials Science, 2009, v. 44, n. 22, p. 6155, doi. 10.1007/s10853-009-3851-7
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Interfacial interaction of solid cobalt with liquid Pb-free Sn–Bi–In–Zn–Sb soldering alloys.
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- Journal of Materials Science, 2009, v. 44, n. 22, p. 5960, doi. 10.1007/s10853-009-3717-z
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Constitutive models of creep for lead-free solders.
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- Journal of Materials Science, 2009, v. 44, n. 14, p. 3841, doi. 10.1007/s10853-009-3521-9
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- Article
The effect of ball milling on the melting behavior of Sn–Cu–Ag eutectic alloy.
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- Journal of Materials Science, 2009, v. 44, n. 9, p. 2257, doi. 10.1007/s10853-008-3146-4
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- Article
Effect of small amount of rare earth addition on electromigration in eutectic SnBi solder reaction couple.
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- Journal of Materials Science, 2009, v. 44, n. 8, p. 2089, doi. 10.1007/s10853-009-3276-3
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Modeling of an oblique impact of solder droplet onto a groove with the impact point to be offset from the groove surfaces interface.
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- Journal of Materials Science, 2009, v. 44, n. 7, p. 1772, doi. 10.1007/s10853-009-3253-x
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A review of mechanical properties of lead-free solders for electronic packaging.
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- Journal of Materials Science, 2009, v. 44, n. 5, p. 1141, doi. 10.1007/s10853-008-3125-9
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- Article
Mechanical behavior of NiTi shape memory alloy fiber reinforced Sn matrix “smart” composites.
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- Journal of Materials Science, 2009, v. 44, n. 3, p. 700, doi. 10.1007/s10853-008-3188-7
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- Article
Very long-term aging of 52In–48Sn (at.%) solder joints on Cu-plated stainless steel substrates.
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- Journal of Materials Science, 2009, v. 44, n. 2, p. 545, doi. 10.1007/s10853-008-3083-2
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- Article
Mechanical assessment of autogenous gas tungsten arc weldments of a super alpha-2 alloy.
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- Journal of Materials Science, 2008, v. 43, n. 12, p. 4001, doi. 10.1007/s10853-007-2395-y
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- Article
Microstructural and mechanical properties of Sn–Ag–Cu lead-free solders with minor addition of Ni and/or Co.
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- Journal of Materials Science, 2008, v. 43, n. 10, p. 3643, doi. 10.1007/s10853-008-2580-7
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- Article
Diffusion soldering using a Gallium metallic paste as solder alloy: study of the phase formation systematics.
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- Journal of Materials Science, 2007, v. 42, n. 23, p. 9707, doi. 10.1007/s10853-007-1940-z
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- Article
Impression creep of monolithic and composite lead free solders.
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- Journal of Materials Science, 2007, v. 42, n. 17, p. 7592, doi. 10.1007/s10853-006-1326-7
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- Article
Effect of current stressing on the reliability of 63Sn37Pb solder joints.
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- Journal of Materials Science, 2007, v. 42, n. 17, p. 7415, doi. 10.1007/s10853-007-1836-y
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- Article
Standardization of a shear test method for lead-free solder paste chip joints.
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- Journal of Materials Science, 2007, v. 42, n. 17, p. 7451, doi. 10.1007/s10853-007-1627-5
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- Article
Role of Ti diffusion on the formation of phases in the Al<sub>2</sub>O<sub>3</sub>–Al<sub>2</sub>O<sub>3</sub> brazed interface.
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- Journal of Materials Science, 2007, v. 42, n. 14, p. 5556, doi. 10.1007/s10853-006-1092-6
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Multiple reflow study of ball grid array (BGA) solder joints on Au/Ni metallization.
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- Journal of Materials Science, 2007, v. 42, n. 13, p. 5239, doi. 10.1007/s10853-006-1234-x
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- Article
Materials behaviour and intermetallics characteristics in the reaction between SnAgCu and Sn–Pb solder alloys.
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- Journal of Materials Science, 2007, v. 42, n. 11, p. 4076, doi. 10.1007/s10853-006-1335-6
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Fatigue behaviour of AISI 304 steel to AISI 4340 steel welded by friction welding.
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- Journal of Materials Science, 2006, v. 41, n. 11, p. 3233, doi. 10.1007/s10853-005-5478-7
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Intermetallic compounds evolution between lead-free solder and cu-based lead frame alloys during isothermal aging.
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- Journal of Materials Science, 2006, v. 41, n. 8, p. 2359, doi. 10.1007/s10853-006-4501-y
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