Works matching DE "SOLDER %26 soldering"

Results: 2955

Effect of Bi Addition on Melting Behavior, Solder Joint Strength, and Thermal Aging Resistance of Sn-3.5Ag/Cu Joints.

Published in:

JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2025, v. 77, n. 6, p. 4206, doi. 10.1007/s11837-025-07268-4

By:

Shen, Yu-An;
Chen, Fang-Yu;
Gao, Ruhuna;
Ho, Cheng-En;
Nishikawa, Hiroshi;
Chen, Chih-Ming

Publication type:

Article

Microstructural Investigation of Sn-Based Solder Reactions with FeCoNiCrMn High-Entropy Alloy at Various Temperatures.

Published in:

JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2025, v. 77, n. 6, p. 4161, doi. 10.1007/s11837-025-07204-6

By:

Wang, Chao-hong;
Li, Yue-han

Publication type:

Article

A Review: Effect of Nanoparticle Additions on the Physical, Microstructural, Interfacial and Mechanical Properties of Low Temperature SnBi Solder Alloys.

Published in:

JOM: The Journal of The Minerals, Metals & Materials Society (TMS), 2025, v. 77, n. 6, p. 4226, doi. 10.1007/s11837-025-07201-9

By:

Singh, Amares;
Choo, Hui Leng;
Tan, Wei Hong;
Durairaj, Rajkumar;
Janasekaran, Shamini;
Saravanan, M. S. Senthil

Publication type:

Article

Landes- und Bezirksverbände.

Published in:

Praktiker, 2025, n. 5, p. 58

By:

Heering, Christoph

Publication type:

Article

Enhancing Ball Grid Array (BGA) Component on Printed Circuit Board (PCB) Solder Joint Integrity with Antimony Element.

Published in:

Journal of Failure Analysis & Prevention, 2025, v. 25, n. 2, p. 813, doi. 10.1007/s11668-025-02144-4

By:

Jalar, Azman;
Lim, Ee May;
Abu Bakar, Maria;
Ismail, Adlil Aizat;
Che Ani, Fakhrozi;
Tan, Choo Par

Publication type:

Article

Diyarbakır Arkeoloji Müzesinde Bulunan Hamailler (Muskalar).

Published in:

Journal of Academic Inquiries / Akademik Incelemeler Dergisi, 2025, v. 20, n. 1, p. 85, doi. 10.17550/akademikincelemeler.1588696

By:

Yariş, Sahure

Publication type:

Article

Performance and reliability of nanoparticle-reinforced lead-free solder composite joints.

Published in:

Journal of Materials Science, 2025, v. 60, n. 17, p. 7091, doi. 10.1007/s10853-025-10882-x

By:

Liang, Kaiming;
Wan, Wenqiang;
Ding, Xiangdong;
He, Peng;
Zhang, Shuye

Publication type:

Article

Investigation of Sn–3.0Ag–0.5Cu Bump Arrays Prepared by the Pulsated Orifice Ejection Method.

Published in:

Advanced Engineering Materials, 2025, v. 27, n. 9, p. 1, doi. 10.1002/adem.202402605

By:

Dong, Wei;
Liu, Jianing;
Liu, Haoyang;
Xu, Fumin

Publication type:

Article

Tip from Sue Hoffman.

Published in:: African Violet Magazine, 2012, v. 65, n. 4, p. 60
Publication type:: Article

Using wet chemistry for etching under-bump metal.

Published in:

Solid State Technology, 2001, v. 44, n. 10, p. 89

By:

Beret, Marvin;
Solomon, Gary

Publication type:

Article

Electrochemically deposited solder bumps for wafer-level packaging.

Published in:

Solid State Technology, 2001, v. 44, n. 4, p. 83

By:

Solomon, Gary

Publication type:

Article

Thermal-mechanical stress analysis of a silicon-based system-in-a-package.

Published in:

Solid State Technology, 2000, v. 43, n. 7, p. 279

By:

Goetz, Martin P.

Publication type:

Article

Fracture Toughness Evaluation of Adjacent Flow Weld Line in Polystyrene by the SENB Method.

Published in:

Polymer Engineering & Science, 2005, v. 45, n. 8, p. 1059, doi. 10.1002/pen.20362

By:

Yamada, Koji;
Tomari, Kiyotaka;
Ishiaku, Umaru Semo;
Hamada, Hiroyuki

Publication type:

Article

Laser power effects on properties of laser brazing diamond coating.

Published in:

Surface Engineering, 2020, v. 36, n. 12, p. 1315, doi. 10.1080/02670844.2020.1758292

By:

Long, Weimin;
Liu, Dashuang;
Dong, Xian;
Wu, Aiping

Publication type:

Article

Characterisation of lead free solderability of immersion Sn finish on PWBs using wetting balance technique.

Published in:

Surface Engineering, 2008, v. 24, n. 5, p. 337, doi. 10.1179/174329408X281821

By:

Hong, S. J.;
Park, B-H.;
Seo, D. S.;
Ryu, C.-R.

Publication type:

Article

Room-Temperature Nanosoldering of a Very Long Metal Nanowire Network by Conducting-Polymer-Assisted Joining for a Flexible Touch-Panel Application.

Published in:

Advanced Functional Materials, 2014, v. 23, n. 34, p. 4171, doi. 10.1002/adfm.201203802

By:

Lee, Jinhwan;
Lee, Phillip;
Lee, Ha Beom;
Hong, Sukjoon;
Lee, Inhwa;
Yeo, Junyeob;
Lee, Seung Seob;
Kim, Taek‐Soo;
Lee, Dongjin;
Ko, Seung Hwan

Publication type:

Article

Contents: (Adv. Funct. Mater. 34/2013).

Published in:: Advanced Functional Materials, 2014, v. 23, n. 34, p. 4167, doi. 10.1002/adfm.201370172
Publication type:: Article

Effect of introducing high temperature gradients on IMC growth and shear properties in hourglass-shaped microbump joints during thermocompression bonding.

Published in:

Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 8, p. 1, doi. 10.1007/s10854-023-10124-3

By:

Tang, Chu;
Chen, Zhuo;
Zhu, Wenhui

Publication type:

Article

Frictional metallurgy induced formation and evolution of solder/Cu column interconnect microstructure and properties.

Published in:

Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 3, p. 1, doi. 10.1007/s10854-022-09675-8

By:

Zhao, Zhili;
Xiao, Kai;
Quan, Wenlei;
Hu, Mingdeng;
Li, Jiazhe

Publication type:

Article

Optimization of reflow profile for copper pillar with SAC305 solder cap FCCSP.

Published in:

Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 3, p. 1, doi. 10.1007/s10854-022-09661-0

By:

Zainudin, Wan Zamir Zakwan Wan;
Yong, Tan Chou;
Hui, Tan Cai;
Kar, Yap Boon;
Hoong, Wong Yew

Publication type:

Article

Tailoring thermal behavior and solid–liquid contact area of Sn/Cu composite solder during ultrasonic-assisted transient liquid phase process.

Published in:

Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 3, p. 1, doi. 10.1007/s10854-022-09653-0

By:

Pan, Hao;
Lu, Dashi;
Zhu, Lihua;
Li, Mingyu;
Ji, Hongjun

Publication type:

Article

Comparative study of laser- and reflow-soldered Sn–3.0Ag–0.5Cu joints on thin Au/Pd/Ni(P) substrate.

Published in:

Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 3, p. 1, doi. 10.1007/s10854-022-09632-5

By:

Lee, Dong-Hwan;
Jeong, Min-Seong;
Yoon, Jeong-Won

Publication type:

Article

Effects of Sn-Ag-x leveling layers on the microstructure and shear behavior of Sn-58Bi solder joint under thermal cycling.

Published in:

Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 3, p. 1, doi. 10.1007/s10854-022-09590-y

By:

Chen, Huifeng;
Liu, Yang;
Zhang, Shuang;
Cao, Rongxing;
Xue, Yuxiong

Publication type:

Article

The effect of Ge on the microstructure, thermal behavior, and mechanical properties of lead-free Sn-5Sb-0.7Cu solder alloy.

Published in:

Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 1, p. 1, doi. 10.1007/s10854-022-09496-9

By:

Pooshgan, Hoda;
Naffakh-Moosavy, Homam

Publication type:

Article

Effects of phosphorus and germanium on oxidation microstructure of Sn–0.7Cu lead-free solders.

Published in:

Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 1, p. 1, doi. 10.1007/s10854-022-09445-6

By:

Liu, Chen;
Peng, Jubo;
Hu, Juntao;
Cai, Shanshan;
Wang, Xiaojing

Publication type:

Article

Correction to: New concept of electret-based capacitance, as shown for solder and other conductors.

Published in:

2022

By:

Chung, D. D. L.;
Xi, Xiang

Publication type:

Correction Notice

New concept of electret-based capacitance, as shown for solder and other conductors.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 36, p. 27022, doi. 10.1007/s10854-022-09366-4

By:

Chung, D. D. L.;
Xi, Xiang

Publication type:

Article

The dynamic and static mechanical characteristics of Sn-7Zn-based solder alloy modified with microalloying of In, Fe and Co elements.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 36, p. 26728, doi. 10.1007/s10854-022-09340-0

By:

Lotfy, I. H.;
Mansour, S. A.;
El-Taher, A. M.

Publication type:

Article

Voids formation and Cu3Sn growth mechanisms in Cu/Cu3Sn/Cu6Sn5 system under air in Cu/SnAg joints for microelectronic packaging.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 35, p. 26190, doi. 10.1007/s10854-022-09305-3

By:

Barik, El Mostafa;
Gillot, Charlotte;
Hodaj, Fiqiri

Publication type:

Article

Development of growth model on interfacial intermetallic compound at circular Cu/Sn3.5Ag interface.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 34, p. 25580, doi. 10.1007/s10854-022-09256-9

By:

Yeh, C. Y.;
Wang, J. Y.;
Wu, C. Y.;
Chiu, C. Y.;
Lee, C. H.;
Huang, B. R.;
Fu, K. L.;
Chang, J. S.;
Yen, T. H.;
Lee, Y. F.;
Liu, C. Y.

Publication type:

Article

Shear performance of Cu/Sn–3.0Ag–0.5Cu/Cu joints with same solder volume and different heights at increasing current density.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 32, p. 24906, doi. 10.1007/s10854-022-09200-x

By:

Gong, Yubing;
Liu, Longgen;
He, Siliang;
Yan, Haidong;
Li, Wangyun;
Qin, Hongbo

Publication type:

Article

Structure and properties of low-Ag SAC solders for electronic packaging.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 29, p. 22668, doi. 10.1007/s10854-022-09091-y

By:

Lu, Xiao;
Zhang, Liang;
Xi, Wang;
Li, Mu-lan

Publication type:

Article

The effect of microstructure on shear tensile properties and microhardness profile of trace germanium added Cu/Sn–5Sb–0.7Cu lead-free solder joint.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 26, p. 21137, doi. 10.1007/s10854-022-08918-y

By:

Pooshgan, Hoda;
Naffakh-Moosavy, Homam

Publication type:

Article

Interface behavior and performance of Sn–Ag–Cu lead-free solder bearing Tb.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 26, p. 20769, doi. 10.1007/s10854-022-08886-3

By:

Yuan, Zeyu;
He, Yujie;
Wu, Ruize;
Xu, Ming;
Zhang, Jun;
Zhu, Yunqing;
Wang, Qiaoli;
Xie, Weibin;
Chen, Huiming

Publication type:

Article

Effect of Ni and Co nanoparticle-doped flux on microstructure of SAC305 solder matrix.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 25, p. 20106, doi. 10.1007/s10854-022-08827-0

By:

Bashir, M. Nasir;
Haseeb, A. S. M. A.;
Wakeel, Saif;
Khan, Muhammad Ali;
Quazi, M. M.;
Khan, Niaz Bahadur;
Ahmed, Arslan;
Soudagar, Manzoore Elahi M.

Publication type:

Article

Investigation of Sn–Bi–In ternary solders with compositions varying from Sn–Bi eutectic point to 76 °C ternary eutectic.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 22, p. 17453, doi. 10.1007/s10854-022-08571-5

By:

Mang, Sung-Ryul;
Choi, Hoon;
Lee, Hoo-Jeong

Publication type:

Article

Effect of trace Ge on interfacial reaction and shear strength of Sn-0.7Cu solder joints during isothermal aging and thermal cycling.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 21, p. 17137, doi. 10.1007/s10854-022-08589-9

By:

Yang, Weiran;
Ding, Yu;
Liao, Mingqing;
Wang, Fengjiang

Publication type:

Article

Effects of solder volume and size on microstructures and mechanical properties of Sn-3.0Ag-0.5Cu solder joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 20, p. 16700, doi. 10.1007/s10854-022-08567-1

By:

Seo, Young-Jin;
Yoon, Jeong-Won

Publication type:

Article

Research on Bi contents addition into Sn–Cu-based lead-free solder alloy.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 19, p. 15586, doi. 10.1007/s10854-022-08464-7

By:

Huang, Hai;
Chen, Bin;
Hu, Xiaowu;
Jiang, Xiongxin;
Li, Qinglin;
Che, Yinhui;
Zu, Shuai;
Liu, Dingjun

Publication type:

Article

Effects of immersion silver (ImAg) and immersion tin (ImSn) surface finish on the microstructure and joint strength of Sn-3.0Ag-0.5Cu solder.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 17, p. 14249, doi. 10.1007/s10854-022-08353-z

By:

Amli, S. F. Muhd;
Salleh, M. A. A. Mohd;
Ramli, M. I. I.;
Aziz, M. S. Abdul;
Yasuda, H.;
Chaiprapa, J.;
Nogita, K.

Publication type:

Article

Manufacturing and characterization of Sn–Cu/SiO2np lead-free nanocomposite solder by accumulative roll bonding (ARB) process.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 17, p. 13516, doi. 10.1007/s10854-022-08286-7

By:

Hosseini, Milad;
Niroumand, Behzad;
Maleki, Ali;
Issa, Hasan Kaser

Publication type:

Article

Interfacial reactions between pure indium solder and Au/Ni metallization.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 16, p. 13143, doi. 10.1007/s10854-022-08253-2

By:

Huang, Li-Chi;
Zhang, Yan-Ping;
Chen, Chih-Ming;
Hung, Liang-Yih;
Wang, Yu-Po

Publication type:

Article

Effect of Ni foam addition on the microstructure and mechanical properties of In–48Sn eutectic alloy.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 16, p. 12594, doi. 10.1007/s10854-022-08209-6

By:

Liu, Kai;
Li, Jiaqi;
Zhang, Jian;
Xiao, Yong

Publication type:

Article

Reaction mechanism for liquid-state interfacial reactions of Co with In and eutectic In–48at.%Sn solders.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 15, p. 12321, doi. 10.1007/s10854-022-08190-0

By:

Wang, Chao-hong;
Chang, Tai-Yu

Publication type:

Article

Correction to: Investigating the physical, mechanical, and reliability study of high entropy alloy reinforced Sn–3.0Ag–0.5Cu solder using 1608 chip capacitor/ENIG joints.

Published in:

2022

By:

Rajendran, Sri Harini;
Jung, Do Hyun;
Jung, Jae Pil

Publication type:

Correction Notice

Improved understanding of the enhancement of sintering of mixtures of Cu microparticles and sn nanoparticles for electronic packaging.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 14, p. 11467, doi. 10.1007/s10854-022-08119-7

By:

Yang, Guannan;
Lin, Wei;
Lai, Haiqi;
Zhong, Chaobin;
Zhang, Yu;
Cui, Chengqiang

Publication type:

Article

Effect of Ni-coated carbon nanotubes addition on the wettability, microhardness, and shear strength of Sn-3.0Ag-0.5Cu/Cu lead-free solder joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 14, p. 10866, doi. 10.1007/s10854-022-08067-2

By:

Qu, Min;
Gao, Zixuan;
Chen, Jin;
Cui, Yan

Publication type:

Article

On the study of morphological characteristics and growth mechanism of intermetallic compounds in ultrasonically fabricated Cu–Sn solder joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 13, p. 10677, doi. 10.1007/s10854-022-08051-w

By:

Han, Xu;
Li, Xiaoyan;
Ji, Gang

Publication type:

Article

Growth mechanisms of intermetallic compounds and Bi-rich layer in ball grid array structure Cu/Sn-58Bi/Cu solder joints during solid–solid and liquid–solid electromigration.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 13, p. 10297, doi. 10.1007/s10854-022-08018-x

By:

Huang, Jiaqiang;
Wang, Xudong;
Chen, Junyu;
Wei, Weichun;
Liu, Fengmei;
Qin, Binhao;
Wang, Haiyan;
Zhang, Yupeng

Publication type:

Article

Comparative study of tripropylamine and naphthylamine as additives in wave solder flux: investigation of solderability and corrosion effects.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 13, p. 10234, doi. 10.1007/s10854-022-08012-3

By:

Li, Feng;
Jellesen, Morten Stendahl;
Ambat, Rajan

Publication type:

Article