Works matching DE "SOLDER %26 soldering"

Results: 2971

Electric field-assisted soldering of glass and copper with Zn-10Al-12Sn solder.

Published in:

2025

By:

Zhao, Ruoxuan;
Hu, Lifang;
Zheng, Zhi;
Hou, Zhiyong;
Liu, Wenbin;
Mi, Xiaoyue;
Li, Jiapeng

Publication type:

Conference Paper/Materials

Effects of Ultra-High Cooling Rates on the Tensile and Cyclic Stress–Strain Behavior of Nanoscale Solder Materials.

Published in:

Journal of Electronic Materials, 2025, v. 54, n. 8, p. 6828, doi. 10.1007/s11664-025-12048-6

By:

Fardin, Sadib;
Moresalein, Md. Jawarul;
Motalab, Mohammad;
Faiyad, Abrar;
Paul, Ratul

Publication type:

Article

Cu particle-reinforced Sn58Bi filler for soldering SiC to Cu at a temperature below 200 °C.

Published in:

Journal of Materials Science, 2025, v. 60, n. 26, p. 10898, doi. 10.1007/s10853-025-11088-x

By:

Zhao, Yu;
Zhou, Yiteng;
Ramaraghavulu, Rajavaram;
Wang, Gang

Publication type:

Article

Hart- und Weichlöten.

Published in:: Praktiker, 2025, n. 6, p. 38
Publication type:: Article

Landes- und Bezirksverbände.

Published in:: Praktiker, 2025, n. 6, p. 57
Publication type:: Article

„Löttechnik im Wandel – Wie die LÖT 2025 Forschung, Praxis und Zukunft vereint“.

Published in:: 2025
Publication type:: Interview

Internationale Fachkonferenz zur Zukunft der Löttechni.

Published in:: Praktiker, 2025, n. 6, p. 40
Publication type:: Article

Wenn Lötdämpfe zur Belastung werden.

Published in:

Praktiker, 2025, n. 6, p. 21

By:

Paul, Waldemar

Publication type:

Article

Löten – alt bewährt, aber stets herausfordernd, innovativ und aussichtsreich.

Published in:

2025

By:

Möhwald, Kai

Publication type:

Editorial

Microstructural and thermal property modifications of Sn-43Bi solder alloys via selective alloying with Se, In, Zn, and Al.

Published in:

Advances in Science & Technology Research Journal, 2025, v. 19, n. 8, p. 273, doi. 10.12913/22998624/205223

By:

Dawood, Feryal;
Al-Bawee, Abbas;
Alrubaiy, Ahmed A. A. G.

Publication type:

Article

Corrosion Behavior Analysis of Novel Sn-2.5Ag-1.0Bi-0.8Cu-0.05Ni and Sn-1.8Bi-0.75Cu-0.065Ni Pb-Free Solder Alloys via Potentiodynamic Polarization Test.

Published in:

Metals (2075-4701), 2025, v. 15, n. 6, p. 670, doi. 10.3390/met15060670

By:

Jung, Sang Hoon;
Lee, Jong-Hyun

Publication type:

Article

Accelerated method for testing soldering tendency of core pins.

Published in:

International Journal of Cast Metals Research, 2010, v. 23, n. 5, p. 296, doi. 10.1179/136404610X12693537270217

By:

Han, Q.;
Xu, H.;
Ried, P. P.;
Olson, P.

Publication type:

Article

APPLICATION OF WAVELET-BASED SINGULARITY DETECTION TECHNIQUE IN AUTOMATIC INSPECTION SYSTEM.

Published in:

International Journal of Wavelets, Multiresolution & Information Processing, 2006, v. 4, n. 2, p. 285, doi. 10.1142/S0219691306001245

By:

HUIQIN JIANG;
LING MA;
HONGYU JIANG;
RINOSHIKA, AKIRA

Publication type:

Article

NANOMECHANICAL PROPERTIES OF A Sn-Ag-Cu SOLDER REINFORCED WITH Ni-COATED CARBON NANOTUBES.

Published in:

International Journal of Nanoscience, 2010, v. 9, n. 4, p. 283, doi. 10.1142/S0219581X10006818

By:

HAN, Y. D.;
JING, H. Y.;
NAI, S. M. L.;
XU, L. Y.;
TAN, C. M.;
WEI, J.

Publication type:

Article

EFFECT OF SURFACE FINISHES ON THE THICKNESS AND MORPHOLOGY OF THE INTERMETALLIC LAYER IN LEAD-FREE SOLDER JOINTS.

Published in:

International Journal of Nanoscience, 2004, v. 3, n. 6, p. 803, doi. 10.1142/S0219581X04002607

By:

Spowage, A. C.;
Thong, C. M.;
Collier, P. A.;
Li, G.Y.

Publication type:

Article

Experimental Calibration of Sn‐Related Varshni Parameters for High Sn Content GeSn Layers.

Published in:

Annalen der Physik, 2019, v. 531, n. 6, p. N.PAG, doi. 10.1002/andp.201800396

By:

Bertrand, Mathieu;
Thai, Quang‐Minh;
Chrétien, Jérémie;
Pauc, Nicolas;
Aubin, Joris;
Milord, Laurent;
Gassenq, Alban;
Hartmann, Jean‐Michel;
Chelnokov, Alexei;
Calvo, Vincent;
Reboud, Vincent

Publication type:

Article

Contents: (Adv. Funct. Mater. 34/2013).

Published in:: Advanced Functional Materials, 2014, v. 23, n. 34, p. 4167, doi. 10.1002/adfm.201370172
Publication type:: Article

Room-Temperature Nanosoldering of a Very Long Metal Nanowire Network by Conducting-Polymer-Assisted Joining for a Flexible Touch-Panel Application.

Published in:

Advanced Functional Materials, 2014, v. 23, n. 34, p. 4171, doi. 10.1002/adfm.201203802

By:

Lee, Jinhwan;
Lee, Phillip;
Lee, Ha Beom;
Hong, Sukjoon;
Lee, Inhwa;
Yeo, Junyeob;
Lee, Seung Seob;
Kim, Taek‐Soo;
Lee, Dongjin;
Ko, Seung Hwan

Publication type:

Article

Effects of reflow atmosphere and flux on Sn whisker growth of Sn-Ag-Cu solders.

Published in:

Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 10, p. 1066, doi. 10.1007/s10854-010-0099-6

By:

Baated, Alongheng;
Keun-Soo Kim;
Suganuma, Katsuaki;
Huang, Sharon;
Jurcik, Benjamin;
Nozawa, Shigeyoshi;
Ueshima, Minoru

Publication type:

Article

Effect of YO particles on microstructure formation and shear properties of Sn-58Bi solder.

Published in:

Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 10, p. 1046, doi. 10.1007/s10854-009-0025-y

By:

Xiaoying Liu;
Mingliang Huang;
Wu, C. M. L.;
Lai Wang

Publication type:

Article

Sn-rich phase coarsening during isothermal annealing for as-soldered Sn-Ag-Cu solder.

Published in:

Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 10, p. 1083, doi. 10.1007/s10854-009-0032-z

By:

Saud, N.;
Jalar, A.

Publication type:

Article

Investigation of rare earth-doped BiAg high-temperature solders.

Published in:

Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 9, p. 875, doi. 10.1007/s10854-009-0010-5

By:

Yaowu Shi;
Weiping Fang;
Zhidong Xia;
Yongping Lei;
Fu Guo;
Xiaoyan Li

Publication type:

Article

Synthesis and DSC study on Sn3.5Ag alloy nanoparticles used for lower melting temperature solder.

Published in:

Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 9, p. 868, doi. 10.1007/s10854-009-0009-y

By:

Changdong Zou;
Yulai Gao;
Bin Yang;
Qijie Zhai

Publication type:

Article

Impact of joint materials on the reliability of double-side packaged SiC power devices during high temperature aging.

Published in:

Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 9, p. 917, doi. 10.1007/s10854-009-0018-x

By:

Lang, Fengqun;
Nakagawa, Hiroshi;
Aoyagi, Masahiro;
Ohashi, Hiromichi;
Yamaguchi, Hiroshi

Publication type:

Article

Reliability studies of Sn–9Zn/Cu and Sn–9Zn–0.3Ag/Cu soldered joints with aging treatment.

Published in:

Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 8, p. 779, doi. 10.1007/s10854-009-9993-1

By:

Wen-Xue Chen;
Song-Bai Xue;
Hui Wang;
Yu-Hua Hu

Publication type:

Article

Effects of trace rare earth Nd addition on microstructure and properties of SnAgCu solder.

Published in:

Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 7, p. 643, doi. 10.1007/s10854-009-9970-8

By:

Lili Gao;
Songbai Xue;
Liang Zhang;
Zhong Sheng;
Guang Zeng;
Feng Ji

Publication type:

Article

Effects of rare earth Ce on properties of Sn–9Zn lead-free solder.

Published in:

Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 7, p. 719, doi. 10.1007/s10854-009-9984-2

By:

WenXue Chen;
Songbai Xue;
Hui Wang;
YuHua Hu;
Jianxin Wang

Publication type:

Article

Properties of SnAgCu/SnAgCuCe soldered joints for electronic packaging.

Published in:

Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 6, p. 635, doi. 10.1007/s10854-009-9969-1

By:

Liang Zhang;
Song-bai Xue;
Li-li Gao;
Zhong Sheng;
Guang Zeng;
Yan Chen;
Sheng-lin Yu

Publication type:

Article

Cobalt: a universal barrier metal for solderable under bump metallisations.

Published in:

Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 6, p. 584, doi. 10.1007/s10854-009-9961-9

By:

Humpston, Giles

Publication type:

Article

Effects of Ag on microstructures, wettabilities of Sn–9Zn–xAg solders as well as mechanical properties of soldered joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 5, p. 461, doi. 10.1007/s10854-009-9939-7

By:

Wen Xue Chen;
Song Bai Xue;
Hui Wang;
Jian Xin Wang;
Zong Jie Han;
Li Li Gao

Publication type:

Article

Investigation on properties of Ga to Sn–9Zn lead-free solder.

Published in:

Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 5, p. 496, doi. 10.1007/s10854-009-9945-9

By:

Wenxue Chen;
Songbai Xue;
Hui Wang;
Jianxin Wang;
Zongjie Han

Publication type:

Article

A review on the interfacial intermetallic compounds between Sn–Ag–Cu based solders and substrates.

Published in:

Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 5, p. 421, doi. 10.1007/s10854-010-0086-y

By:

Guang Zeng;
Songbai Xue;
Liang Zhang;
Lili Gao;
Wei Dai;
Jiadong Luo

Publication type:

Article

Impression creep of the rare-earth doped Sn–2%Bi lead-free solder alloy.

Published in:

Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 3, p. 262, doi. 10.1007/s10854-009-9903-6

By:

Mahmudi, R.;
Geranmayeh, A. R.;
Salehi, M.;
Pirayesh, H.

Publication type:

Article

Study on creep characterization of nano-sized Ag particle-reinforced Sn–Pb composte solder joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 3, p. 256, doi. 10.1007/s10854-009-9902-7

By:

Yaowu Shi;
Jianping Liu;
Zhidong Xia;
Yongping Lei;
Fu Guo;
Xiaoyan Li

Publication type:

Article

Effects of Ga, Al, Ag, and Ce multi-additions on the properties of Sn–9Zn lead-free solder.

Published in:

Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 2, p. 111, doi. 10.1007/s10854-009-9877-4

By:

Hui Wang;
Songbai Xue;
Feng Zhao;
Wenxue Chen

Publication type:

Article

Development of Sn–Zn lead-free solders bearing alloying elements.

Published in:

Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 1, p. 1, doi. 10.1007/s10854-009-0014-1

By:

Liang Zhang;
Song-bai Xue;
Li-li Gao;
Zhong Sheng;
Huan Ye;
Zheng-xiang Xiao;
Guang Zeng;
Yan Chen;
Sheng-lin Yu

Publication type:

Article

Temperature measurement at flip chip solder joint during electromigration test.

Published in:

Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 1, p. 53, doi. 10.1007/s10854-009-9868-5

By:

Yamanaka, Kimihiro;
Ooyoshi, Takafumi;
Nejime, Takayuki

Publication type:

Article

Effect of rare earth element additions on the impression creep of Sn–9Zn solder alloy.

Published in:

Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 1, p. 58, doi. 10.1007/s10854-009-9870-y

By:

Mahmudi, R.;
Geranmayeh, A. R.;
Zahiri, B.;
Marvasti, M. H.

Publication type:

Article

Effects of trace amount addition of rare earth on properties and microstructure of Sn–Ag–Cu alloys.

Published in:

Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 12, p. 1193, doi. 10.1007/s10854-008-9850-7

By:

Liang Zhang;
Song-bai Xue;
Li-li Gao;
Yan Chen;
Sheng-lin Yu;
Zhong Sheng;
Guang Zeng

Publication type:

Article

Effects of Ga–Ag, Ga–Al and Al–Ag additions on the wetting characteristics of Sn–9Zn–X–Y lead-free solders.

Published in:

Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 12, p. 1239, doi. 10.1007/s10854-009-9859-6

By:

Hui Wang;
Songbai Xue;
Wenxue Chen;
Feng Zhao

Publication type:

Article

Rate-dependent deformation of Sn–3.5Ag lead-free solder.

Published in:

Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 11, p. 1083, doi. 10.1007/s10854-008-9830-y

By:

Sefton, D. E.;
Rist, M. A.;
Gungor, S.

Publication type:

Article

Influence of minor Bi additions on the interfacial morphology between Sn–Zn– xBi solders and a Cu layer.

Published in:

Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 11, p. 1112, doi. 10.1007/s10854-008-9835-6

By:

Jie Chen;
Jun Shen;
Dong Min;
Changfei Peng

Publication type:

Article

Effects of small amounts of Ni/P/Ce element additions on the microstructure and properties of Sn3.0Ag0.5Cu solder alloy.

Published in:

Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 10, p. 1008, doi. 10.1007/s10854-008-9826-7

By:

Wenxing Dong;
Yaowu Shi;
Yongping Lei;
Zhidong Xia;
Fu Guo

Publication type:

Article

Formation of interfacial structure of Sn–3.7Ag–0.9Zn eutectic solder with different Al additions.

Published in:

Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 9, p. 861, doi. 10.1007/s10854-008-9807-x

By:

Wei, C.;
Liu, Y. C.;
Wan, J. B.

Publication type:

Article

Effects of rare earths on properties and microstructures of lead-free solder alloys.

Published in:

Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 8, p. 685, doi. 10.1007/s10854-009-9895-2

By:

Liang Zhang;
Song-bai Xue;
Li-li Gao;
Guang Zeng;
Zhong Sheng;
Yan Chen;
Sheng-lin Yu

Publication type:

Article

The formation and evolution of intermetallic compounds formed between Sn–Ag–Zn–In lead-free solder and Ni/Cu substrate.

Published in:

Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 7, p. 675, doi. 10.1007/s10854-008-9785-z

By:

Xu, R. L.;
Liu, Y. C.;
Han, Y. J.;
Wei, C.;
Wang, X.;
Yu, L. M.

Publication type:

Article

Low temperature sintering and dielectric properties of Ba2Ti3Nb4O18 ceramics for silver co-sintering application.

Published in:

Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 6, p. 582, doi. 10.1007/s10854-008-9769-z

By:

Dong Guo;
Zhiyuan Ling;
Xing Hu

Publication type:

Article

Development of lead-free Sn-3.5Ag/SnO2 nanocomposite solders.

Published in:

Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 6, p. 571, doi. 10.1007/s10854-008-9767-1

By:

Babaghorbani, P.;
Nai, S.;
Gupta, M.

Publication type:

Article

Investigation on impact strength of the as-soldered Sn37Pb and Sn3.8Ag0.7Cu solder joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 6, p. 499, doi. 10.1007/s10854-008-9757-3

By:

Ning Zhang;
Yaowu Shi;
Zhidong Xia;
Yongping Lei;
Fu Guo;
Xiaoyan Li

Publication type:

Article

Fluxless bonding of silicon wafers to molybdenum substrates using electroplated tin-rich solder.

Published in:

Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 4, p. 334, doi. 10.1007/s10854-008-9731-0

By:

Wang, Pin J.;
Kim, Jong S.;
Dongwook Kim;
Lee, Chin C.

Publication type:

Article