Works matching DE "SOIL densification"
1
- Advanced Functional Materials, 2016, v. 26, n. 16, p. 2617, doi. 10.1002/adfm.201503971
- Novak, Tyler;
- Seelbinder, Benjamin;
- Twitchell, Celina M.;
- van Donkelaar, Corrinus C.;
- Voytik‐Harbin, Sherry L.;
- Neu, Corey P.
- Article
2
- Advanced Functional Materials, 2014, v. 24, n. 22, p. 3392, doi. 10.1002/adfm.201302845
- Taylor, Nathan J.;
- Pottebaum, Andrew J.;
- Uz, Veli;
- Laine, Richard M.
- Article
3
- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 16, p. 14977, doi. 10.1007/s10854-019-01870-4
- Tang, Hongbo;
- Li, Qiuyue;
- Zhou, Jian
- Article
4
- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 11, p. 10352, doi. 10.1007/s10854-019-01374-1
- Yan, Tingnan;
- Zhang, Weijun;
- Chen, Xingyu;
- Wang, Fenglin;
- Bai, Shuxin
- Article
5
- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 6, p. 5327, doi. 10.1007/s10854-019-00875-3
- Rabha, Susmita;
- Dobbidi, Pamu
- Article
6
- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 4, p. 3611, doi. 10.1007/s10854-018-00639-5
- Shi, Hao;
- Fu, Qiuyun;
- Wang, Geng;
- Tian, Fan;
- Guo, Pengju;
- Yang, Tao
- Article
7
- Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 14, p. 10277, doi. 10.1007/s10854-017-6795-8
- Wang, Zhefei;
- Yao, Jingyi;
- Yin, Shilong;
- Wang, Xuhong;
- Yu, Lei
- Article
8
- Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 11, p. 8160, doi. 10.1007/s10854-017-6524-3
- Liu, Fei;
- Huang, Xianpei;
- Yuan, ChangLai;
- Chen, Guohua;
- Feng, Qin;
- Qu, Jingjing
- Article
9
- Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 9, p. 6461, doi. 10.1007/s10854-017-6332-9
- Chen, Wen-Shiush;
- Yu, Cheng-Chi;
- Hsu, Cheng-Hsing;
- Tsai, Shang-Hung
- Article
10
- Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 5, p. 4154, doi. 10.1007/s10854-016-6035-7
- Lin, Shih-Hung;
- Chen, Yuan-Bin
- Article
11
- Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 5, p. 4328, doi. 10.1007/s10854-016-6057-1
- Wang, Xu;
- Fu, Renli;
- Xu, Yue
- Article
12
- Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 4, p. 3725, doi. 10.1007/s10854-016-5980-5
- Chen, Ching-Fong;
- Brennecka, Geoff;
- King, Graham;
- Tegtmeier, Eric;
- Holesinger, Terry;
- Ivy, Jacob;
- Yang, Pin
- Article
13
- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 10, p. 10934, doi. 10.1007/s10854-016-5207-9
- Kravchuk, Oleksandr;
- Reichenberger, Marcus
- Article
14
- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 8, p. 8105, doi. 10.1007/s10854-016-4811-z
- Zang, Xiangrong;
- Ma, Weibing;
- Niu, Benben;
- Li, Na;
- Wang, Yanyun
- Article
15
- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 7, p. 6902, doi. 10.1007/s10854-016-4643-x
- Duan, Shuxin;
- Li, Enzhu;
- Chen, Hetuo;
- Tang, Bin;
- Yuan, Ying;
- Zhou, Xiaohua
- Article
16
- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 3, p. 2455, doi. 10.1007/s10854-015-4045-5
- Li, Bo;
- Qing, Zhenjun;
- Li, Yingxiang;
- Li, Hao;
- Zhang, Shuren
- Article
17
- Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 8, p. 6051, doi. 10.1007/s10854-015-3182-1
- Zhao, Jiaojiao;
- Pu, Yongping;
- Wu, Yurong;
- Zhang, Panpan
- Article
18
- Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 5, p. 2737, doi. 10.1007/s10854-015-2752-6
- Yu, Jun;
- Shen, Chunying;
- Qiu, Tai
- Article
19
- Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 5, p. 2820, doi. 10.1007/s10854-015-2763-3
- Chen, HuaWen;
- Su, Hua;
- Zhang, HuaiWu;
- Gui, YiMin;
- Zuo, HuaiZhi;
- Yang, Lei;
- Tang, Xiaoli
- Article
20
- Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 9, p. 3695, doi. 10.1007/s10854-014-2077-x
- Ma, Jianqiang;
- Ma, Weibing;
- Li, Qiang;
- Meng, Xueyuan;
- Niu, Benben;
- Guo, Yaoxian
- Article
21
- Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 9, p. 3712, doi. 10.1007/s10854-014-2079-8
- Guo, Mei;
- Li, Yuxia;
- Dou, Gang;
- Lin, Jinuan
- Article
22
- Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 5, p. 2220, doi. 10.1007/s10854-014-1862-x
- Yan, Xiaobin;
- Gao, Feng;
- Peng, Biaolin;
- Liu, Zhengtang
- Article
23
- Journal of Materials Science: Materials in Electronics, 2013, v. 24, n. 10, p. 3985, doi. 10.1007/s10854-013-1351-7
- Liu, Ming;
- Zhou, Hongqing;
- Xu, Xiaoying;
- Yue, Zhenxing;
- Liu, Min;
- Zhu, Haikui
- Article
24
- Journal of Materials Science: Materials in Electronics, 2013, v. 24, n. 5, p. 1495, doi. 10.1007/s10854-012-0961-9
- Mahesh, K.;
- Anas, S.;
- Rahul, S.;
- Ananthakumar, S.
- Article
25
- Journal of Materials Science: Materials in Electronics, 2013, v. 24, n. 5, p. 1601, doi. 10.1007/s10854-012-0982-4
- Dou, Gang;
- Zhou, Dongxiang;
- Gong, Shuping;
- Guo, Mei
- Article
26
- Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 12, p. 2162, doi. 10.1007/s10854-012-0733-6
- Ji, Xun;
- Zuo, Ruzhong;
- Zuo, Wenwu;
- Wang, Xiaohui;
- Li, Longtu
- Article
27
- Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 12, p. 2181, doi. 10.1007/s10854-012-0747-0
- Ma, Huina;
- Yang, Zhimin;
- Du, Jun
- Article
28
- Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 10, p. 1875, doi. 10.1007/s10854-012-0677-x
- Wang, Shuang;
- He, Hao;
- Su, Hao
- Article
29
- Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 8, p. 1599, doi. 10.1007/s10854-012-0635-7
- Chen, Kai;
- Pu, Yongping;
- Xu, Ning;
- Luo, Xu
- Article
30
- International Journal of Advanced Manufacturing Technology, 2019, v. 103, n. 9-12, p. 3813, doi. 10.1007/s00170-019-03706-1
- Wang, Xiaolong;
- Wang, Aimin;
- Li, Yuebo
- Article
31
- International Journal of Advanced Manufacturing Technology, 2019, v. 103, n. 5-8, p. 2227, doi. 10.1007/s00170-019-03698-y
- Kekana, Neo;
- Shongwe, Mxolisi B.;
- Johnson, Oluwagbenga T.;
- Babalola, Bukola J.
- Article
32
- International Journal of Advanced Manufacturing Technology, 2019, v. 101, n. 5-8, p. 1573, doi. 10.1007/s00170-018-3062-y
- Babalola, Bukola Joseph;
- Shongwe, Mxolisi Brendon;
- Obadele, Babatunde Abiodun;
- Olubambi, Peter Apata
- Article
33
- International Journal of Advanced Manufacturing Technology, 2018, v. 97, n. 5-8, p. 2687, doi. 10.1007/s00170-018-2144-1
- Yang, Yuying;
- Gong, Yadong;
- Qu, Shuoshuo;
- Rong, Yulong;
- Sun, Yao;
- Cai, Ming
- Article
34
- International Journal of Advanced Manufacturing Technology, 2018, v. 97, n. 5-8, p. 1913, doi. 10.1007/s00170-018-1867-3
- Article
35
- International Journal of Advanced Manufacturing Technology, 2018, v. 96, n. 9-12, p. 4009, doi. 10.1007/s00170-018-1839-7
- Božić, D.;
- Stanković, N.;
- Ružić, J.;
- Stašić, J.
- Article
36
- International Journal of Advanced Manufacturing Technology, 2017, v. 93, n. 9-12, p. 4233, doi. 10.1007/s00170-017-0894-9
- Czelusniak, Tiago;
- Amorim, Fred;
- Mendes, Luciano
- Article
37
- Granular Matter, 2018, v. 20, n. 4, p. 1, doi. 10.1007/s10035-018-0844-8
- Zhang, Zhihua;
- Cui, Yifei;
- Chan, Dave H.;
- Taslagyan, Karén A.
- Article
38
- Granular Matter, 2018, v. 20, n. 4, p. 1, doi. 10.1007/s10035-018-0840-z
- Ravjee, Sachin;
- Jacobsz, Schalk Willem;
- Wilke, Daniel Nicolas;
- Govender, Nicolin
- Article
39
- Granular Matter, 2016, v. 18, n. 3, p. 1, doi. 10.1007/s10035-016-0661-x
- Olmos, L.;
- Chaix, J.-M.;
- Nadler, S.;
- Bonnefoy, O.;
- Gelet, J.-L.;
- Thomas, G.
- Article
40
- Granular Matter, 2012, v. 14, n. 1, p. 11, doi. 10.1007/s10035-011-0305-0
- Cuéllar, Pablo;
- Georgi, Steven;
- Baeßler, Matthias;
- Rücker, Werner
- Article
41
- Integrated Ferroelectrics, 2016, v. 174, n. 1, p. 71, doi. 10.1080/10584587.2016.1192414
- do Nascimento, William Junior;
- da Silva, Roney Carlos;
- Eiras, José Antonio
- Article
42
- Integrated Ferroelectrics, 2013, v. 149, n. 1, p. 61, doi. 10.1080/10584587.2013.852941
- Sangsubun, C.;
- Watcharapasorn, A.;
- Jiansirisomboon, S.
- Article
43
- Integrated Ferroelectrics, 2013, v. 140, n. 1, p. 140, doi. 10.1080/10584587.2012.741865
- Lee, Seung-Hwan;
- Nam, Sung-Pill;
- Lee, Sung-Gap;
- Lee, Young-Hie
- Article
44
- Metallurgical Research & Technology, 2015, v. 112, n. 6, p. 1, doi. 10.1051/metal/2015034
- Woyun Long;
- Anxian Lu;
- Xueqiong Ouyang;
- Jing Li
- Article
45
- International Archives of the Photogrammetry, Remote Sensing & Spatial Information Sciences, 2016, v. 41, n. B2, p. 349, doi. 10.5194/isprsarchives-XLI-B2-349-2016
- Koziatek, O.;
- Dragićević, S.;
- Li, S.
- Article
46
- Revue Francaise de Photogrammetrie et de Teledetection, 2018, n. 217/218, p. 51, doi. 10.52638/rfpt.2018.416
- Beaudoin, Laurent;
- Avanthey, Loïca
- Article
47
- Acta Mechanica, 2018, v. 229, n. 1, p. 33, doi. 10.1007/s00707-017-1951-z
- Xiao, Xianlin;
- Mu, Lin;
- Zhao, Guiping
- Article
48
- Frontiers of Structural & Civil Engineering, 2024, v. 18, n. 3, p. 411, doi. 10.1007/s11709-024-1057-3
- Padmanabhan, Gowtham;
- Shanmugam, Ganesh Kumar
- Article
49
- KONA: Powder & Particle Journal, 2013, n. 30, p. 22, doi. 10.14356/kona.2013007
- Mandal, Hasan;
- Acikbas, Nurcan Calis
- Article
50
- Annals of the University Dunarea de Jos of Galati: Fascicle IX, Metallurgy & Materials Science, 2011, v. 29, n. 2, p. 74
- SAS-BOCA, Monica;
- RUS, Luciana;
- TINTELECAN, Marius;
- MARIAN, Ionuţ;
- NISTOR, Liviu
- Article