Works matching DE "SILICON nitride"
1
- Journal of Shanghai University / Shanghai Daxue Xuebao, 2025, v. 31, n. 1, p. 122, doi. 10.12066/j.issn.1007-2861.2542
- Article
2
- Nanomaterials (2079-4991), 2025, v. 15, n. 9, p. 635, doi. 10.3390/nano15090635
- Zhang, Jiachen;
- Lv, Kunlun;
- Yin, Yuan;
- Gao, Yuqian;
- Tian, Ye;
- Han, Yuncheng;
- Tang, Jun
- Article
3
- China Mechanical Engineering, 2025, v. 36, n. 3, p. 435, doi. 10.3969/j.issn.l004-132X.2025.03.007
- Article
4
- Ceramica, 2025, v. 71, p. 1, doi. 10.1590/DZOA4919
- Chiba, R.;
- Carvalho, F. M. S.;
- Guedes-Silva, C. C.
- Article
5
- Nature Communications, 2025, v. 16, n. 1, p. 1, doi. 10.1038/s41467-025-59215-1
- Zhou, Ji;
- Hu, Jianqi;
- Clementi, Marco;
- Yakar, Ozan;
- Nitiss, Edgars;
- Stroganov, Anton;
- Brès, Camille-Sophie
- Article
6
- Solid State Technology, 2001, v. 44, n. 11, p. 26
- Article
7
- Solid State Technology, 2001, v. 44, n. 4, p. 75
- Levy, Sagy;
- Boom, Robin;
- Lam, James;
- Kepten, Avishai
- Article
8
- Solid State Technology, 2000, v. 43, n. 4, p. 79
- Laxman, Ravi K.;
- Anderson, Timothy D.;
- Mestemacher, John A.
- Article
9
- Surface Engineering, 2021, v. 37, n. 8, p. 1043, doi. 10.1080/02670844.2021.1908738
- Wang, Ping;
- Ma, Qun;
- Chen, Xiaomin;
- Zhang, Chunqing
- Article
10
- Surface Engineering, 2020, v. 36, n. 7, p. 745, doi. 10.1080/02670844.2020.1730062
- Rukhande, Sanjay W.;
- Rathod, W. S.
- Article
11
- Surface Engineering, 2020, v. 36, n. 7, p. 770, doi. 10.1080/02670844.2019.1688015
- Shu, Kun;
- Zhang, Chuanwei;
- Zheng, Dezhi;
- Gu, Le;
- Wang, Liqin
- Article
12
- Surface Engineering, 2020, v. 36, n. 5, p. 456, doi. 10.1080/02670844.2018.1564199
- Meziani, Samir;
- Moussi, Aberrahmane;
- Mahiou, Linda;
- Antoni, Frederic;
- Outemzabet, Ratiba
- Article
13
- Surface Engineering, 2020, v. 36, n. 1, p. 49, doi. 10.1080/02670844.2018.1555214
- Article
14
- Surface Engineering, 2019, v. 35, n. 1, p. 54, doi. 10.1080/02670844.2018.1454997
- Wang, Hongjun;
- Li, Qintao;
- Wu, Xiujuan
- Article
15
- Surface Engineering, 2017, v. 33, n. 5, p. 362, doi. 10.1080/02670844.2016.1230975
- Hu, J.;
- Fang, L.;
- Liao, X.-L.;
- Shi, L.-T.
- Article
16
- Surface Engineering, 2013, v. 29, n. 10, p. 749, doi. 10.1179/1743294413Y.0000000178
- Pang, J.;
- Bai, Y.;
- Qin, F.;
- Pan, L.;
- Zhao, Y.;
- Kang, R.
- Article
17
- Surface Engineering, 2011, v. 27, n. 6, p. 436, doi. 10.1179/174329409X409495
- Yilbas, B S;
- Arif, A F M;
- Karatas, C
- Article
18
- Surface Engineering, 2010, v. 26, n. 3, p. 224, doi. 10.1179/174329409X455449
- Article
19
- Surface Engineering, 2008, v. 24, n. 6, p. 464, doi. 10.1179/026708408X336373
- Wu, H. Y.;
- Zhang, P. Z.;
- Xu, Z.
- Article
20
- Surface Engineering, 2006, v. 22, n. 1, p. 63, doi. 10.1179/174329406X84985
- Kim, B.;
- Bae, J.;
- Han, S. S.
- Article
21
- Surface Engineering, 2003, v. 19, n. 6, p. 410, doi. 10.1179/026708403225010136
- Amaral, M.;
- Oliveira, F. J.;
- Belmonte, M.;
- Fernandes, A. J. S.;
- Costa, F. M.;
- Silva, R. F.
- Article
22
- Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 9, p. 1, doi. 10.1007/s10854-023-10211-5
- Liu, Daosen;
- Wei, Shengsheng;
- Liu, Chao;
- Wang, Dejun
- Article
23
- Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 5, p. 1, doi. 10.1007/s10854-022-09769-3
- Roisin, Nicolas;
- Colla, Marie-Stéphane;
- Raskin, Jean-Pierre;
- Flandre, Denis
- Article
24
- Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 12, p. 9774, doi. 10.1007/s10854-022-07825-6
- Gayathri, K.;
- Teja, Y. N.;
- Prakash, R. Mithun;
- Hossain, Md Shahadat;
- Alsalme, Ali;
- Sundaravadivel, E.;
- Sakar, M.
- Article
25
- Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 9, p. 6380, doi. 10.1007/s10854-022-07810-z
- Luo, Zhuang;
- Ju, Shanshan;
- Zhang, Xin;
- Zhao, Weikang;
- Liu, Fei;
- Yin, Zhanqing;
- Liu, Yanqin;
- Lu, Qingmei;
- Hu, Yanlin
- Article
26
- Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 7, p. 4712, doi. 10.1007/s10854-021-07661-0
- Wu, Guofa;
- Ma, Mingtao;
- Li, Aihua;
- Song, Kaixin;
- Khesro, Amir;
- Bafrooei, Hadi Barzegar;
- Taheri-nassaj, Ehsan;
- Luo, Shaojin;
- Shi, Feng;
- Sun, Shikuan;
- Wang, Dawei
- Article
27
- Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 7, p. 4497, doi. 10.1007/s10854-021-07640-5
- Ye, Fen;
- Jiang, Xiangping;
- Huang, Xiaokun;
- Zeng, Renfen;
- Chen, Chao;
- Nie, Xin;
- Cheng, Hao
- Article
28
- Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 6, p. 3129, doi. 10.1007/s10854-021-07515-9
- He, Guangming;
- Li, Zhijun;
- Dong, Yunan;
- Wang, Guoshuai
- Article
29
- Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 4, p. 2116, doi. 10.1007/s10854-021-07417-w
- Li, Chen;
- Hou, Jiale;
- Ye, Zijun;
- Muhammad, Raz;
- Li, Aihua;
- Ma, Mingtao;
- Wu, Guofa;
- Song, Kaixin;
- Zhou, Tao;
- Mao, Minmin;
- Liu, Bing;
- Bafrooei, Hadi Barzegar;
- Taheri-nassaj, Ehsan;
- Luo, Shaojin;
- Shi, Feng;
- Sun, Shikuan;
- Wang, Dawei
- Article
30
- Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 18, p. 23309, doi. 10.1007/s10854-021-06815-4
- Peng, Sen;
- Zhang, Yu;
- Tang, Jiejia;
- Zeng, Wenfei;
- Zhao, Chenglin
- Article
31
- Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 17, p. 21957, doi. 10.1007/s10854-021-06611-0
- Zhang, Chunyan;
- Chen, Yaoyi;
- Fang, Haolan;
- Tian, Zhongqing;
- Meng, Fancheng;
- Lin, Huixing
- Article
32
- Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 5, p. 6133, doi. 10.1007/s10854-021-05331-9
- Xiong, Wenjuan;
- Wang, Guilei;
- Du, Yong;
- Lin, Hongxiao;
- Zhao, Xuewei;
- Yu, Jiahan;
- Kong, Zhenzhen;
- Dong, Yan;
- Jiang, Haojie;
- Tao, Yang;
- Li, Junfeng;
- Wang, Wenwu;
- Radamson, Henry H.
- Article
33
- Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 1, p. 1, doi. 10.1007/s10854-020-04909-z
- Xiong, Wenjuan;
- Wang, Guilei;
- Li, Junfeng;
- Zhao, Chao;
- Wang, Wenwu;
- Radamson, Henry H.
- Article
34
- Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 14, p. 11227, doi. 10.1007/s10854-020-03671-6
- Kozlovskiy, A. L.;
- Zdorovets, M. V.
- Article
35
- Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 13, p. 10078, doi. 10.1007/s10854-020-03553-x
- Xu, Qiang;
- Xiong, Wenjuan;
- Wang, Guilei;
- Ye, Tianchun
- Article
36
- Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 12, p. 9888, doi. 10.1007/s10854-020-03533-1
- Buyukbas-Ulusan, A.;
- Tataroglu, A.
- Article
37
- Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 4, p. 2918, doi. 10.1007/s10854-019-02836-2
- Saleem, Adil;
- Zhang, Yujun;
- Gong, Hongyu;
- Majeed, Muhammad K.;
- Lin, Xiao;
- Jing, Jie;
- Sheng, Mingming;
- Zhao, Cuncai
- Article
38
- Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 3, p. 2331, doi. 10.1007/s10854-019-02765-0
- Park, Young-Sam;
- Cho, Doo-Hee
- Article
39
- Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 3, p. 1986, doi. 10.1007/s10854-019-02718-7
- Gupta, Prachi;
- Soni, Mahesh;
- Sharma, Satinder K.
- Article
40
- Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 2, p. 1461, doi. 10.1007/s10854-019-02660-8
- Zhou, Bo;
- Cui, Chunting;
- Ma, Shenghua;
- Bai, Jintao;
- Wang, Hui
- Article
41
- Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 1, p. 239, doi. 10.1007/s10854-019-02480-w
- Iqbal, A.;
- Walker, G.;
- Hold, L.;
- Fernandes, A.;
- Lacopi, A.;
- Mohd-Yasin, F.
- Article
42
- Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 1, p. 90, doi. 10.1007/s10854-019-01164-9
- Xiong, Wenjuan;
- Jiang, Haojie;
- Li, Tingting;
- Zhang, Peng;
- Xu, Qing;
- Zhao, Xuewei;
- Wang, Guilei;
- Liu, Yaodong;
- Luo, Ying;
- Li, Zhihua;
- Li, Junfeng;
- Yu, Jinzhong;
- Chao, Zhao;
- Wang, Wenwu;
- Radamson, Henry H.
- Article
43
- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 20, p. 18432, doi. 10.1007/s10854-019-02197-w
- Manan, Abdul;
- Khan, Arshad;
- Ullah, Atta;
- Ahmad, Arbab Safeer;
- Wazir, Arshad Hussain;
- Iqbal, Javed;
- Ullah, Mati
- Article
44
- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 16, p. 15267, doi. 10.1007/s10854-019-01899-5
- Zhang, Qingji;
- Jing, Jiangping;
- Chen, Zhuoyuan;
- Sun, Mengmeng;
- Li, Jiarun;
- Li, Yan;
- Xu, Likun
- Article
45
- Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 23, p. 20081, doi. 10.1007/s10854-018-0139-1
- Yang, Ning;
- Li, Shizheng;
- Yang, Jinlin;
- Li, Hongbo;
- Ye, Xiaojun;
- Liu, Cui;
- Yuan, Xiao
- Article
46
- Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 22, p. 19353, doi. 10.1007/s10854-018-0064-3
- Kolli, Sowmya;
- Sunkara, Mahendra;
- Alphenaar, Bruce
- Article
47
- Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 16, p. 12168, doi. 10.1007/s10854-017-7031-2
- Fukuda, Shinji;
- Shimada, Kazuhiko;
- Izu, Noriya;
- Miyazaki, Hiroyuki;
- Iwakiri, Shoji;
- Hirao, Kiyoshi
- Article
48
- Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 11, p. 8278, doi. 10.1007/s10854-017-6541-2
- Fukuda, Shinji;
- Shimada, Kazuhiko;
- Izu, Noriya;
- Miyazaki, Hiroyuki;
- Hirao, Kiyoshi;
- Iwakiri, Shoji
- Article
49
- 2017
- Chen, Xiaobo;
- Yang, Wen;
- Yang, Peizhi;
- Yuan, Junbao;
- Zhao, Fei;
- Hao, Jiabo;
- Tang, Yu
- Erratum
50
- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 10, p. 10003, doi. 10.1007/s10854-016-5071-7
- Huang, Zhen;
- Zhang, Yuantao;
- Deng, Gaoqiang;
- Li, Baozhu;
- Cui, Shuang;
- Liang, Hongwei;
- Chang, Yuchun;
- Song, Junfeng;
- Zhang, Baolin;
- Du, Guotong
- Article