Exhaust gas monitoring: New window into semiconductor processing.
- Published in:
- Solid State Technology, 1999, v. 42, n. 5, p. 61
- By:
- Publication type:
- Article
Works matching DE "SEMICONDUCTORS testing"
Results: 61
1
2
Wafer-level burn-in will cut time and cost.
- Published in:
- Solid State Technology, 1998, v. 41, n. 11, p. 20
- By:
- Publication type:
- Article
3
Semiconductor sequencing: how many flows do you need?
- Published in:
- Bioinformatics, 2015, v. 31, n. 7, p. 1199, doi. 10.1093/bioinformatics/btu805
- By:
- Publication type:
- Article
4
Technology: Getting Moore from DNA sequencing.
- Published in:
- 2011
- By:
- Publication type:
- journal article
5
A hybrid knowledge discovery model using decision tree and neural network for selecting dispatching rules of a semiconductor final testing factory.
- Published in:
- Production Planning & Control, 2005, v. 16, n. 7, p. 665, doi. 10.1080/09537280500213757
- By:
- Publication type:
- Article
6
Study of optimization of Al/a-SiC:H Schottky diodes by means of annealing process of a-SiC:H thin films sputtered at three different hydrogen flow rates.
- Published in:
- Journal of Engineering Science & Technology Review, 2008, v. 1, n. 1, p. 4
- By:
- Publication type:
- Article
7
The Importance of integrated alarms in automotive device test.
- Published in:
- EE: Evaluation Engineering, 2018, v. 57, n. 12, p. 26
- By:
- Publication type:
- Article
8
Cost of test still biggest hurdle as newer factors add to challenges.
- Published in:
- 2018
- By:
- Publication type:
- Product Review
9
Instrumentation platforms facilitate testing.
- Published in:
- 2018
- By:
- Publication type:
- Product Review
10
ITC focuses on automotive, data analytics.
- Published in:
- 2018
- By:
- Publication type:
- Proceeding
11
INDUSTRY UPDATE.
- Published in:
- EE: Evaluation Engineering, 2016, v. 55, n. 10, p. 6
- Publication type:
- Article
12
Presto, Peraso develop 60-GHz transceiver test.
- Published in:
- EE: Evaluation Engineering, 2016, v. 55, n. 6, p. 6
- Publication type:
- Article
13
Internet of Things dominates SEMICON West.
- Published in:
- 2015
- By:
- Publication type:
- Proceeding
14
Semiconductor Vendors Mine Big Data for Quality.
- Published in:
- EE: Evaluation Engineering, 2014, v. 53, n. 4, p. 24
- By:
- Publication type:
- Article
15
Modular Instruments Vie With Traditional IC ATE.
- Published in:
- EE: Evaluation Engineering, 2013, v. 52, n. 7, p. 22
- By:
- Publication type:
- Article
16
Exploring the Relationship Between AXIe and PXI.
- Published in:
- EE: Evaluation Engineering, 2012, v. 51, n. 3, p. 36
- By:
- Publication type:
- Article
17
Improving Semiconductor Yield With Scan Diagnosis.
- Published in:
- EE: Evaluation Engineering, 2010, v. 49, n. 3, p. 36
- By:
- Publication type:
- Article
18
What Is Concurrent Test?
- Published in:
- EE: Evaluation Engineering, 2009, v. 48, n. 4, p. 40
- By:
- Publication type:
- Article
19
System Architected Around IEEE 1450 STIL.
- Published in:
- 2005
- Publication type:
- Product Review
20
Portable System Supports Multisite Final Testing.
- Published in:
- 2005
- Publication type:
- Product Review
21
Package Provides Pulse Measurement Capabilities.
- Published in:
- 2005
- Publication type:
- Product Review
22
Yield improvement planning for the recycle processes of test wafers.
- Published in:
- International Journal of Advanced Manufacturing Technology, 2006, v. 27, n. 11/12, p. 1228, doi. 10.1007/s00170-004-2316-z
- By:
- Publication type:
- Article
23
Design, Characterization and Analysis of a 0.35 μm CMOS SPAD.
- Published in:
- Sensors (14248220), 2014, v. 14, n. 12, p. 22773, doi. 10.3390/s141222773
- By:
- Publication type:
- Article
24
Non-Equilibrium Dislocation Dynamics in Semiconductor Crystals and Superlattices.
- Published in:
- Journal of Non-Equilibrium Thermodynamics, 2018, v. 43, n. 2, p. 163, doi. 10.1515/jnet-2018-0002
- By:
- Publication type:
- Article
25
Intelligent manufacturing: New advances and challenges.
- Published in:
- 2015
- By:
- Publication type:
- Editorial
26
The cooperative estimation of distribution algorithm: a novel approach for semiconductor final test scheduling problems.
- Published in:
- Journal of Intelligent Manufacturing, 2014, v. 25, n. 5, p. 867, doi. 10.1007/s10845-013-0746-x
- By:
- Publication type:
- Article
27
Determining the operator-machine assignment for machine interference problem and an empirical study in semiconductor test facility.
- Published in:
- Journal of Intelligent Manufacturing, 2014, v. 25, n. 5, p. 899, doi. 10.1007/s10845-013-0777-3
- By:
- Publication type:
- Article
28
Gas-mediated liquid metal printing toward large-scale 2D semiconductors and ultraviolet photodetector.
- Published in:
- NPJ 2D Materials & Applications, 2021, v. 5, n. 1, p. 1, doi. 10.1038/s41699-021-00219-y
- By:
- Publication type:
- Article
29
Properties of trivalent-ion doped tungsten bronzes.
- Published in:
- Journal of Materials Science, 2013, v. 48, n. 7, p. 3003, doi. 10.1007/s10853-012-7079-6
- By:
- Publication type:
- Article
30
Rating the extent of surface scratches on photostimulable storage phosphor plates in a dental school environment.
- Published in:
- Dentomaxillofacial Radiology, 2010, v. 39, n. 3, p. 179, doi. 10.1259/dmfr/28972644
- By:
- Publication type:
- Article
31
Integrated System for Testing and Characterizing Semiconductor Materials and Devices.
- Published in:
- Carpathian Journal of Electronic & Computer Engineering, 2010, v. 3, n. 1, p. 74
- By:
- Publication type:
- Article
32
products & literature.
- Published in:
- Advanced Materials & Processes, 2011, v. 169, n. 3, p. 44
- Publication type:
- Article
33
MBJ Solutions.
- Published in:
- Photovoltaics International, 2011, n. 13, p. 159
- Publication type:
- Article
34
Keithley updates solar cell tester to support Drive-Level Capacitance Profiling.
- Published in:
- Photovoltaics International, 2009, n. 4, p. 59
- Publication type:
- Article
35
Radiative d-d transitions at tungsten centers in II-VI semiconductors.
- Published in:
- Semiconductors, 2017, v. 51, n. 3, p. 322, doi. 10.1134/S1063782617030253
- By:
- Publication type:
- Article
36
Features of the band structure and conduction mechanisms of n-HfNiSn heavily doped with Y.
- Published in:
- Semiconductors, 2017, v. 51, n. 2, p. 139, doi. 10.1134/S106378261702018X
- By:
- Publication type:
- Article
37
Features of long-term relaxation of capacitance in rectifying structures based on n-ZnP<sub>2</sub>.
- Published in:
- Semiconductors, 2008, v. 42, n. 6, p. 662, doi. 10.1134/S1063782608060067
- By:
- Publication type:
- Article
38
Mechanism of dislocation-governed charge transport in schottky diodes based on gallium nitride.
- Published in:
- Semiconductors, 2008, v. 42, n. 6, p. 689, doi. 10.1134/S1063782608060092
- By:
- Publication type:
- Article
39
Calibration Enabled Scalable Current Sensor Module for Quiescent Current Testing.
- Published in:
- Journal of Electronic Testing, 2012, v. 28, n. 5, p. 697, doi. 10.1007/s10836-012-5327-y
- By:
- Publication type:
- Article
40
Challenges for Semiconductor Test Engineering: A Review Paper.
- Published in:
- Journal of Electronic Testing, 2012, v. 28, n. 3, p. 365, doi. 10.1007/s10836-011-5276-x
- By:
- Publication type:
- Article
41
Tester Memory Requirements and Test Application Time Reduction for Delay Faults with Digital Captureless Test Sensors.
- Published in:
- Journal of Electronic Testing, 2012, v. 28, n. 2, p. 229, doi. 10.1007/s10836-011-5271-2
- By:
- Publication type:
- Article
42
Controllability of Static CMOS Circuits for Timing Characterization.
- Published in:
- Journal of Electronic Testing, 2008, v. 24, n. 5, p. 481, doi. 10.1007/s10836-007-5059-6
- By:
- Publication type:
- Article
43
Design and Analysis of Low Noise Optimization Amplifier Using Reconfigurable Slotted Patch Antenna.
- Published in:
- Wireless Personal Communications, 2017, v. 97, n. 4, p. 5185, doi. 10.1007/s11277-017-4774-2
- By:
- Publication type:
- Article
44
Measurement of the thermal parameters of semiconductor products using pulse-amplitude modulation of the heating power.
- Published in:
- Measurement Techniques, 2010, v. 53, n. 6, p. 679, doi. 10.1007/s11018-010-9561-3
- By:
- Publication type:
- Article
45
Design and Preliminary Evaluation of High‐Speed Line‐of‐Sight Calculation CMOS Image Sensor.
- Published in:
- Electronics & Communications in Japan, 2018, v. 101, n. 5, p. 47, doi. 10.1002/ecj.12062
- By:
- Publication type:
- Article
46
Basic research on a consecutive educational system including design, trial fabrication, and evaluation of integrated crcuits.
- Published in:
- Electronics & Communications in Japan, 2010, v. 93, n. 10, p. 12, doi. 10.1002/ecj.10290
- By:
- Publication type:
- Article
47
COMPRESSED SKEWED-LOAD DELAY TEST GENERATION BASED ON EVOLUTION AND DETERMINISTIC INITIALIZATION OF POPULATIONS.
- Published in:
- Computing & Informatics, 2013, v. 32, n. 2, p. 251
- By:
- Publication type:
- Article
48
THE TRANSFORMATION OF FAILURE ANALYSIS—LESSONS FROM 10 YEARS IN THE SERVICE.
- Published in:
- Electronic Device Failure Analysis, 2015, v. 17, n. 3, p. 2
- By:
- Publication type:
- Article
49
Training Calendar.
- Published in:
- 2014
- By:
- Publication type:
- Calendar
50
Hydrocarbons‐Driven Crystallization of Polymer Semiconductors for Low‐Temperature Fabrication of High‐Performance Organic Field‐Effect Transistors.
- Published in:
- Advanced Functional Materials, 2018, v. 28, n. 15, p. 1, doi. 10.1002/adfm.201706372
- By:
- Publication type:
- Article