Works matching DE "SEMICONDUCTOR-to-semiconductor contacts"

FCCSP IMC Growth under Reliability Stress Following Automotive Standards.

Published in:

Journal of Microelectronic & Electronic Packaging, 2019, v. 16, n. 1, p. 21, doi. 10.4071/imaps.735545

By:

• Wei-Wei Liu (Xenia);
• Weng, Berdy;
• Li, Jerry;
• Cing-Kun Yeh

Publication type:

Article