Status and Future of batch, hot-wall furnaces.
- Published in:
- Solid State Technology, 1999, v. 42, n. 11, p. 83
- By:
- Publication type:
- Article
Works matching DE "SEMICONDUCTOR wafers -- Design %26 construction"
Results: 19
1
2
Global yield engineering for IC production.
- Published in:
- Solid State Technology, 1998, v. 41, n. 12, p. 81
- By:
- Publication type:
- Article
3
Electroplating bath control for copper interconnects.
- Published in:
- Solid State Technology, 1998, v. 41, n. 11, p. 47
- By:
- Publication type:
- Article
4
Integration risks in 300-mm wafer fab automation.
- Published in:
- Solid State Technology, 1998, v. 41, n. 7, p. 193
- By:
- Publication type:
- Article
5
Pyrogenic wet oxidation by RTP.
- Published in:
- Solid State Technology, 1998, v. 41, n. 6, p. 121
- By:
- Publication type:
- Article
6
Noncyclic scheduling of dual-armed cluster tools for minimization of wafer residency time and makespan.
- Published in:
- Advances in Mechanical Engineering (Sage Publications Inc.), 2017, v. 9, n. 4, p. 1, doi. 10.1177/1687814017693217
- By:
- Publication type:
- Article
7
Sequential screening in semiconductor manufacturing, II...
- Published in:
- Operations Research, 1996, v. 44, n. 1, p. 196, doi. 10.1287/opre.44.1.196
- By:
- Publication type:
- Article
8
A scenario-based stochastic programming model for the control or dummy wafers downgrading problem.
- Published in:
- Applied Stochastic Models in Business & Industry, 2009, v. 25, n. 3, p. 263, doi. 10.1002/asmb.748
- By:
- Publication type:
- Article
9
Separation of wet wafers after sawing.
- Published in:
- Photovoltaics International, 2010, n. 9, p. 52
- By:
- Publication type:
- Article
10
Automation for the PV industry - a step-by-step guide.
- Published in:
- Photovoltaics International, 2009, n. 4, p. 24
- Publication type:
- Article
11
An efficient adaptive dispatching method for semiconductor wafer fabrication facility.
- Published in:
- International Journal of Advanced Manufacturing Technology, 2016, v. 84, n. 1-4, p. 315, doi. 10.1007/s00170-016-8410-1
- By:
- Publication type:
- Article
12
GaN and the 2014 Nobel Prize in physics.
- Published in:
- Current Science (00113891), 2014, v. 107, n. 11, p. 1782
- By:
- Publication type:
- Article
13
Scribing and cutting a blue LED wafer using a Q-switched. Nd:YAG laser.
- Published in:
- Applied Physics A: Materials Science & Processing, 2000, v. 70, n. 5, p. 561, doi. 10.1007/s003390051080
- By:
- Publication type:
- Article
14
An integrated release and dispatch policy for semiconductor wafer fabrication.
- Published in:
- International Journal of Production Research, 2014, v. 52, n. 8, p. 2275, doi. 10.1080/00207543.2013.854938
- By:
- Publication type:
- Article
15
Modelling and scheduling analysis of multi-cluster tools with residency constraints based on time constraint sets.
- Published in:
- International Journal of Production Research, 2013, v. 51, n. 16, p. 4835, doi. 10.1080/00207543.2013.774490
- By:
- Publication type:
- Article
16
Capacity requirements planning for twin Fabs of wafer fabrication.
- Published in:
- International Journal of Production Research, 2009, v. 47, n. 16, p. 4473, doi. 10.1080/00207540802007597
- By:
- Publication type:
- Article
17
Basic research on a consecutive educational system including design, trial fabrication, and evaluation of integrated crcuits.
- Published in:
- Electronics & Communications in Japan, 2010, v. 93, n. 10, p. 12, doi. 10.1002/ecj.10290
- By:
- Publication type:
- Article
18
Capacity planning with sequential time constraints under various control policies in the back-end of wafer fabrications.
- Published in:
- Journal of the Operational Research Society, 2010, v. 61, n. 8, p. 1258, doi. 10.1057/jors.2009.36
- By:
- Publication type:
- Article
19
Achieving Uniformity in a Semiconductor Fabrication Process Using Spatial Modeling.
- Published in:
- Journal of the American Statistical Association, 1998, v. 93, n. 441, p. 36, doi. 10.1080/01621459.1998.10474085
- By:
- Publication type:
- Article