Works matching DE "SEMICONDUCTOR wafers"
Results: 1225
CowSSL: contrastive open-world semi-supervised learning for wafer bin map.
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- Journal of Intelligent Manufacturing, 2025, v. 36, n. 3, p. 2163, doi. 10.1007/s10845-024-02351-0
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Virtual metrology for chemical mechanical planarization of semiconductor wafers.
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- Journal of Intelligent Manufacturing, 2025, v. 36, n. 3, p. 1923, doi. 10.1007/s10845-024-02335-0
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Stacking ensemble learning based material removal rate prediction model for CMP process of semiconductor wafer.
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- AI EDAM, 2024, v. 38, p. 1, doi. 10.1017/S0890060424000167
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Contrastive Learning with Global and Local Representation for Mixed-Type Wafer Defect Recognition.
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- Sensors (14248220), 2025, v. 25, n. 4, p. 1272, doi. 10.3390/s25041272
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Make or break China's foundry industry.
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- Solid State Technology, 2001, v. 44, n. 11, p. 34
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From Motorola's historic lab to today: Arizona ranks 3rd in chipmaking.
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- Solid State Technology, 2001, v. 44, n. 10, p. S29
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Growing from Kilby's invention to today: Texas is 2nd in chipmaking.
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- Solid State Technology, 2001, v. 44, n. 10, p. S11
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Regional concentration of fabs totals approximately 10% of industry's capacity.
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- Solid State Technology, 2001, v. 44, n. 10, p. S7
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300mm fabs and the role of bulk specialty gas supply.
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- Solid State Technology, 2001, v. 44, n. 10, p. 109
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Devices dictate control of implant-beam incident angle.
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- Solid State Technology, 2001, v. 44, n. 10, p. 79
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CaF[sub2] birefringence workshop reaches consensus.
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- Solid State Technology, 2001, v. 44, n. 9, p. 26
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Future bright with copper, low-k, 300mm, shrink.
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- Solid State Technology, 2001, v. 44, n. 9, p. 20
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In the age of 300mm silicon, tech standards are even more crucial.
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- Solid State Technology, 2001, v. 44, n. 8, p. 128
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Laser marking study proves benefits of simulation for backend tools.
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- Solid State Technology, 2001, v. 44, n. 8, p. 85
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An evaluation of semiconductor-grade polysilicon furnace fixtures.
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- Solid State Technology, 2001, v. 44, n. 8, p. 73
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Plasma etch rates: The impact of mask transmittance.
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- Solid State Technology, 2001, v. 44, n. 8, p. 55
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Factors in determining COO for 300mm FOUPs.
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- Solid State Technology, 2001, v. 44, n. 8, p. 48
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Singapore pours it on even in rough waters.
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- Solid State Technology, 2001, v. 44, n. 8, p. 38
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Cycle time, 300mm in spotlight at automation conference.
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- Solid State Technology, 2001, v. 44, n. 8, p. 34
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New technology tackles maskmaking challenges.
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- Solid State Technology, 2001, v. 44, n. 8, p. 26
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Asia Pacific.
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- Solid State Technology, 2001, v. 44, n. 8, p. 24
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Analyzing issues for 300mm "backend" lithography.
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- Solid State Technology, 2001, v. 44, n. 7, p. 138
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TECHNOLOGY NEWS.
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- Solid State Technology, 2001, v. 44, n. 7, p. 34
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Low-temperature annealing system for 300mm thermal processing.
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- Solid State Technology, 2001, v. 44, n. 6, p. 152
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New tools and fabs demand 300mm automation optimization.
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- Solid State Technology, 2001, v. 44, n. 6, p. 87
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Japanese companies design multifunction minifab tools.
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- Solid State Technology, 2001, v. 44, n. 6, p. 83
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Epitaxial wafer market.
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- Solid State Technology, 2001, v. 44, n. 6, p. 60
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SOI market with yet another technology.
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- Solid State Technology, 2001, v. 44, n. 6, p. 50
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2001": The 'make or break' year for 300mm wafer transition goals.
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- Solid State Technology, 2001, v. 44, n. 5, p. 174
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Taking IC manufacturing from 300mm pilot to production.
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- Solid State Technology, 2001, v. 44, n. 5, p. 121
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Managing 'process copy exact' for a 300mm production fab.
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- Solid State Technology, 2001, v. 44, n. 5, p. 109
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Suppliers' successes with 300mm tools and materials.
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- Solid State Technology, 2001, v. 44, n. 5, p. 91
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Chip singulation process with a water jet-guided laser.
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- Solid State Technology, 2001, v. 44, n. 4, p. S25
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Evaluating plasma-etch resistance of high-performance plastics.
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- Solid State Technology, 2001, v. 44, n. 4, p. 91
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WORLD NEWS.
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- Solid State Technology, 2001, v. 44, n. 3, p. 20
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Part Two of Two--Operation: How to make a sensor smarter.
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- Solid State Technology, 2001, v. 44, n. 2, p. 105
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Strip, etch, and RTP benefit from integrated water-vapor delivery.
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- Solid State Technology, 2001, v. 44, n. 2, p. 89
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Integrating backend processes.
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- Solid State Technology, 2001, v. 44, n. 2, p. 78
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At long last, SOI wafer market on the move.
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- Solid State Technology, 2001, v. 44, n. 2, p. 62
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WORLDWIDE HIGHLIGHTS.
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- Solid State Technology, 2001, v. 44, n. 2, p. 20
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PRODUCT NEWS.
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- Solid State Technology, 2001, v. 44, n. 1, p. 119
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In situ endpoint control saves chemicals in wet processing.
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- Solid State Technology, 2001, v. 44, n. 1, p. 96
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Implementation of extended temperature range etching.
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- Solid State Technology, 2001, v. 44, n. 1, p. 76
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Role of doping accuracy for sub-0.13um technology.
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- Solid State Technology, 2001, v. 44, n. 1, p. 68
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Process technology update: Progress on all fronts.
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- Solid State Technology, 2001, v. 44, n. 1, p. 68
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New scanning technique: Will it make coating the low-cost alternative for low-k films?
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- Solid State Technology, 2001, v. 44, n. 1, p. 52
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Sarnoff's simplified ESD protection for silicided devices.
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- Solid State Technology, 2001, v. 44, n. 1, p. 32
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US Air Force Lab develops defect analysis for GaAs.
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- Solid State Technology, 2001, v. 44, n. 1, p. 28
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Efficient, high-throughput post-STI CMP cleaning.
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- Solid State Technology, 2000, v. 43, n. 12, p. 96
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Etch and CVD process improvements via heated vacuum throttle valves.
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- Solid State Technology, 2000, v. 43, n. 12, p. 80
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