Works matching DE "SEMICONDUCTOR production equipment"
1
- Solid State Technology, 2001, v. 44, n. 2, p. 152
- Article
2
- Solid State Technology, 2000, v. 43, n. 3, p. S23
- Hofer, Ferdinand;
- Leitner, Othmar;
- Warbichler, Peter;
- Grogger, Werner
- Article
3
- Solid State Technology, 2000, v. 43, n. 3, p. 27
- Article
4
- Solid State Technology, 1998, v. 41, n. 8, p. 79
- Article
5
- Solid State Technology, 1998, v. 41, n. 3, p. 161
- Article
6
- Solid State Technology, 1998, v. 41, n. 3, p. 161
- Article
7
- Solid State Technology, 1998, v. 41, n. 3, p. S27
- Article
8
- Solid State Technology, 1998, v. 41, n. 1, p. 109
- Article
9
- Computing & Control Engineering, 2003, v. 14, n. 5, p. 6, doi. 10.1049/cce:20030501
- Article
10
- Journal of Circuits, Systems & Computers, 2008, v. 17, n. 1, p. 15, doi. 10.1142/S0218126608004186
- MENG-CHIOU WU;
- RUNG-BIN LIN
- Article
11
- Chemistry & Industry, 2017, v. 81, n. 3, p. 36, doi. 10.1002/cind.813_8.x
- Article
12
- Semiconductor Physics, Quantum Electronics & Optoelectronics, 2015, v. 18, n. 3, p. 233, doi. 10.15407/spqeo18.03.233
- Article
13
- Journal of Intelligent Manufacturing, 2012, v. 23, n. 3, p. 699, doi. 10.1007/s10845-010-0420-5
- Montealegre, Norma;
- Hagenkötter, Sebastian
- Article
14
- Journal of Microelectronic & Electronic Packaging, 2020, v. 17, n. 4, p. 128, doi. 10.4071/imaps.1227889
- Juhee Lee;
- Kyeongsoo Kim;
- Simon Kim;
- Kiseop Kim;
- Kyungsoo Lee
- Article
15
- Journal of Microelectronic & Electronic Packaging, 2020, v. 17, n. 4, p. 121, doi. 10.4071/imaps.1227802
- Article
16
- Journal of Microelectronic & Electronic Packaging, 2020, v. 17, n. 4, p. 111, doi. 10.4071/imaps.1226533
- Lau, John H.;
- Cheng-Ta Ko;
- Tzvy-Jang Tseng;
- Chia-Yu Peng;
- Kai-Ming Yang;
- Tim Xia;
- Lin, Puru Bruce;
- Lin, Eagle;
- Leo Chang;
- Hsing Ning Liu;
- Lin, Curry;
- Cheng, David;
- Winnie Lu
- Article