Works about SEMICONDUCTOR manufacturing


Results: 1132
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    Unraveling the Connection between Deposition, Microstructure, and Performance of Superconducting Quantum Circuits using Multi-modal Electron Microscopy.

    Published in:
    Microscopy & Microanalysis, 2024, v. 30, p. 1, doi. 10.1093/mam/ozae044.766
    By:
    • Oh, Jin-Su;
    • Kopas, Cameron J;
    • Marshall, Jayss;
    • Fang, Xiaotian;
    • Joshi, Kamal R;
    • Datta, Amlan;
    • Ghimire, Sunil;
    • Park, Joong-Mok;
    • Kim, Richard;
    • Setiawan, Daniel;
    • Lachman, Ella;
    • Mutus, Joshua Y;
    • Murthy, Akshay A;
    • Grassellino, Anna;
    • Romanenko, Alex;
    • Zasadzinski, John;
    • Wang, Jigang;
    • Prozorov, Ruslan;
    • Yadavalli, Kameshwar;
    • Kramer, Matt
    Publication type:
    Article
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    Phase flip code with semiconductor spin qubits.

    Published in:
    NPJ Quantum Information, 2022, v. 8, n. 1, p. 1, doi. 10.1038/s41534-022-00639-8
    By:
    • van Riggelen, F.;
    • Lawrie, W. I. L.;
    • Russ, M.;
    • Hendrickx, N. W.;
    • Sammak, A.;
    • Rispler, M.;
    • Terhal, B. M.;
    • Scappucci, G.;
    • Veldhorst, M.
    Publication type:
    Article
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    Survey of Reliability Research on 3D Packaged Memory.

    Published in:
    Electronics (2079-9292), 2023, v. 12, n. 12, p. 2709, doi. 10.3390/electronics12122709
    By:
    • Zhou, Shuai;
    • Ma, Kaixue;
    • Wu, Yugong;
    • Liu, Peng;
    • Hu, Xianghong;
    • Nie, Guojian;
    • Ren, Yan;
    • Qiu, Baojun;
    • Cai, Nian;
    • Xu, Shaoqiu;
    • Wang, Han
    Publication type:
    Article
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    Review of Wafer Surface Defect Detection Methods.

    Published in:
    Electronics (2079-9292), 2023, v. 12, n. 8, p. 1787, doi. 10.3390/electronics12081787
    By:
    • Ma, Jianhong;
    • Zhang, Tao;
    • Yang, Cong;
    • Cao, Yangjie;
    • Xie, Lipeng;
    • Tian, Hui;
    • Li, Xuexiang
    Publication type:
    Article
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