Works about SEMICONDUCTOR industry

Results: 2471

Interconnected Horizons: ASEAN's Journey in the Global Semiconductor Trade Network Amidst the COVID-19 Pandemic and Supply Chain Realignments.

Published in:

Emerging Markets Finance & Trade, 2025, v. 61, n. 8, p. 2185, doi. 10.1080/1540496X.2024.2446387

By:

Prabheesh, K. P.;
Vidya, C. T.

Publication type:

Article

If China Strikes Taiwan: The American military is utterly unprepared. So is the American economy.

Published in:

Hoover Digest: Research & Opinion on Public Policy, 2025, n. 2, p. 77

By:

Freymann, Eyck;
Bromley, Hugo

Publication type:

Article

永續共好？企業社會責任對半導體製造業關鍵人才組織認同、離職傾向之影響.

Published in:

Commerce & Management Quarterly, 2025, v. 26, n. 1, p. 1

By:

蕭婉鎔;
莊雅嵐

Publication type:

Article

Study of Oxide Material Variation on Electrical Characteristics and Linearity Parameters Induced in Vertical Nanowire TFET.

Published in:

Semiconductors, 2025, v. 59, n. 5, p. 474, doi. 10.1134/S1063782625600494

By:

Bhardwaj, Anjana;
Das, Amit;
Rai, Amrita;
Krishna, Ram;
Upadhyay, A. K.

Publication type:

Article

Inherent Hardware Identifiers: Advancing IC Traceability and Provenance in the Multi-Die Era.

Published in:

Journal of Electronic Testing, 2025, v. 41, n. 1, p. 85, doi. 10.1007/s10836-025-06161-x

By:

Khan, M Shafkat M.;
Xi, Chengjie;
Varshney, Nitin;
Bahk, Je-Hyeong;
Asadizanjani, Navid

Publication type:

Article

Effect of SiC Particle Size on the Properties of TiSi<sub>2</sub>/SiC Composites Semiconductor Fabricated by Liquid Infiltration of Ti–Si Eutectic Alloy.

Published in:

Advanced Engineering Materials, 2025, v. 27, n. 9, p. 1, doi. 10.1002/adem.202402449

By:

Zhao, Ziyan;
Qi, Qian;
Liu, Xuejian;
Huang, Zhengren;
Liu, Yan

Publication type:

Article

Chiplets für Automotive-Anwendungen.

Published in:: Elektronik Industrie, 2025, p. 6
Publication type:: Article

Mit 1,5 kW Leistung.

Published in:: Elektronik Industrie, 2025, p. 25
Publication type:: Article

ManufAg: a multi-agent-system framework for production control of complex manufacturing systems.

Published in:

Information Systems & e-Business Management, 2006, v. 4, n. 2, p. 159, doi. 10.1007/s10257-005-0030-5

By:

Mönch, Lars;
Stehli, Marcel

Publication type:

Article

Asia Pacific outlook.

Published in:

Solid State Technology, 2001, v. 44, n. 11, p. 42

By:

Vogler, Debra

Publication type:

Article

Make or break China's foundry industry.

Published in:

Solid State Technology, 2001, v. 44, n. 11, p. 34

By:

Addison, Craig

Publication type:

Article

Where are they now?

Published in:

Solid State Technology, 2001, v. 44, n. 11, p. 32

By:

Xu, Arthur

Publication type:

Article

Amkor knocks down back-end operation costs.

Published in:

Solid State Technology, 2001, v. 44, n. 11, p. 24

By:

Burggraaf, Pieter

Publication type:

Article

WORLD NEWS.

Published in:: Solid State Technology, 2001, v. 44, n. 11, p. 16
Publication type:: Article

Not like its neighbors, but Colorado is still 11th in chipmaking.

Published in:

Solid State Technology, 2001, v. 44, n. 10, p. S42

By:

Burggraaf, Pieter "Pete"

Publication type:

Article

A relative newcomer, but statistics put New Mexico 10th in chipmaking.

Published in:

Solid State Technology, 2001, v. 44, n. 10, p. S34

By:

Burggraaf, Pieter "Pete"

Publication type:

Article

From Motorola's historic lab to today: Arizona ranks 3rd in chipmaking.

Published in:

Solid State Technology, 2001, v. 44, n. 10, p. S29

By:

Burggraaf, Pieter "Pete"

Publication type:

Article

Utah's wafer fabs.

Published in:

Solid State Technology, 2001, v. 44, n. 10, p. S26

By:

Burggraaf, Pieter "Pete"

Publication type:

Article

Fabs are good neighbors, too.

Published in:: Solid State Technology, 2001, v. 44, n. 10, p. S16
Publication type:: Article

Growing from Kilby's invention to today: Texas is 2nd in chipmaking.

Published in:

Solid State Technology, 2001, v. 44, n. 10, p. S11

By:

Burggraaf, Pieter "Pete"

Publication type:

Article

Regional concentration of fabs totals approximately 10% of industry's capacity.

Published in:

Solid State Technology, 2001, v. 44, n. 10, p. S7

By:

Burggraaf, Pieter "Pete"

Publication type:

Article

Challenge for the new millennium: Managing mask costs.

Published in:

Solid State Technology, 2001, v. 44, n. 10, p. 154

By:

Rygler, Kenneth A.

Publication type:

Article

Tough competition ahead from new Japanese wafer fabs.

Published in:

Solid State Technology, 2001, v. 44, n. 10, p. 36

By:

Nagahro, Yasuaki

Publication type:

Article

Tech Briefs.

Published in:: Solid State Technology, 2001, v. 44, n. 10, p. 26
Publication type:: Article

ASIA PACIFIC.

Published in:: Solid State Technology, 2001, v. 44, n. 10, p. 20
Publication type:: Article

EUROPE.

Published in:: Solid State Technology, 2001, v. 44, n. 10, p. 20
Publication type:: Article

JAPAN.

Published in:: Solid State Technology, 2001, v. 44, n. 10, p. 18
Publication type:: Article

USA.

Published in:: Solid State Technology, 2001, v. 44, n. 10, p. 16
Publication type:: Article

Chip sales down for July; N.A. tool orders up third month in a row.

Published in:: Solid State Technology, 2001, v. 44, n. 10, p. 16
Publication type:: Article

The coming world of nano- and pico-technology.

Published in:

2001

By:

Haavind, Robert

Publication type:

Editorial

Attendees challenged by economy.

Published in:: Solid State Technology, 2001, v. 44, n. 9, p. 32
Publication type:: Article

New challenges, new solutions.

Published in:: Solid State Technology, 2001, v. 44, n. 9, p. 22
Publication type:: Article

B-to-B sees second monthly uptick.

Published in:: Solid State Technology, 2001, v. 44, n. 9, p. 18
Publication type:: Article

Is chipmaking skill still a differentiator?

Published in:

2001

By:

Haavind, Robert

Publication type:

Editorial

How TSMC Fab 6 got up and running.

Published in:

Solid State Technology, 2001, v. 44, n. 8, p. S19

By:

Tsai, Nun-Sian

Publication type:

Article

Asia's silicon foundries.

Published in:

Solid State Technology, 2001, v. 44, n. 8, p. S9

By:

Burggraaf, Pieter "Pete"

Publication type:

Article

China: The sleeping dragon stirs.

Published in:: Solid State Technology, 2001, v. 44, n. 8, p. S6
Publication type:: Article

In the age of 300mm silicon, tech standards are even more crucial.

Published in:

Solid State Technology, 2001, v. 44, n. 8, p. 128

By:

Gehman, Bruce L.

Publication type:

Article

Singapore pours it on even in rough waters.

Published in:

Solid State Technology, 2001, v. 44, n. 8, p. 38

By:

Sitathan, Tony

Publication type:

Article

Cycle time, 300mm in spotlight at automation conference.

Published in:

Solid State Technology, 2001, v. 44, n. 8, p. 34

By:

Burggraaf, Pieter "Pete"

Publication type:

Article

STATS steps up role of package modeling.

Published in:

Solid State Technology, 2001, v. 44, n. 8, p. 30

By:

Burggraaf, Pieter "Pete"

Publication type:

Article

Asia Pacific.

Published in:: Solid State Technology, 2001, v. 44, n. 8, p. 24
Publication type:: Article

Europe.

Published in:: Solid State Technology, 2001, v. 44, n. 8, p. 24
Publication type:: Article

Japan.

Published in:: Solid State Technology, 2001, v. 44, n. 8, p. 22
Publication type:: Article

SMIF Integration and mini-environments cause users most grief.

Published in:: Solid State Technology, 2001, v. 44, n. 8, p. 20
Publication type:: Article

USA.

Published in:: Solid State Technology, 2001, v. 44, n. 8, p. 18
Publication type:: Article

WORLDWIDE HIGHLIGHTS.

Published in:: Solid State Technology, 2001, v. 44, n. 8, p. 18
Publication type:: Article

Economics will dictate the future.

Published in:

2001

By:

Haavind, Robert

Publication type:

Editorial

Partner for profit using the gainshare IP fee model.

Published in:

Solid State Technology, 2001, v. 44, n. 7, p. 271

By:

Kibarian, John K.

Publication type:

Article

PRODUCT PANORAMA.

Published in:: Solid State Technology, 2001, v. 44, n. 7, p. 209
Publication type:: Article