Works matching DE "SEMICONDUCTOR industry"

Results: 2470

Scalability of reinforcement learning methods for dispatching in semiconductor frontend fabs: a comparison of open-source models with real industry datasets.

Published in:

International Journal of Advanced Manufacturing Technology, 2025, v. 139, n. 9/10, p. 4395, doi. 10.1007/s00170-025-16117-2

By:

Stöckermann, Patrick;
Südfeld, Henning;
Immordino, Alessandro;
Altenmüller, Thomas;
Wegmann, Marc;
Gebser, Martin;
Schekotihin, Konstantin;
Seidel, Georg;
Chan, Chew Wye;
Zhang, Fei Fei

Publication type:

Article

Anaerobic Treatment of Semiconductor Industry Wastewater and Biomass Acclimation.

Published in:

CET Journal - Chemical Engineering Transactions, 2025, v. 117, p. 199, doi. 10.3303/CET25117034

By:

Escobar, Bruno P.;
Santos, Ana Rita N.;
Silva, Flávio G. C. S.;
Nadais, Maria Helena G. A. G.

Publication type:

Article

Intelligent manufacturing impact of vocational high school education through industrial-academic cooperation plan.

Published in:

International Journal of Electrical Engineering Education, 2025, v. 62, n. 3, p. 214, doi. 10.1177/0020720918791424

By:

Yen, Jung-Nan;
Chen, Hsin-Hung;
Chen, Long-Hui;
Hsu, Hsiang-Chen;
Lee, Yu-Chen

Publication type:

Article

Sensitivity of bilateral trade between Korea and China to exchange rate fluctuations: Insights from the semiconductor industry.

Published in:

World Economy, 2024, v. 47, n. 7, p. 3150, doi. 10.1111/twec.13572

By:

Baek, Jungho;
Piao, Shanyu;
Nam, Soojoong

Publication type:

Article

Make or break China's foundry industry.

Published in:

Solid State Technology, 2001, v. 44, n. 11, p. 34

By:

Addison, Craig

Publication type:

Article

Asia Pacific outlook.

Published in:

Solid State Technology, 2001, v. 44, n. 11, p. 42

By:

Vogler, Debra

Publication type:

Article

Where are they now?

Published in:

Solid State Technology, 2001, v. 44, n. 11, p. 32

By:

Xu, Arthur

Publication type:

Article

Amkor knocks down back-end operation costs.

Published in:

Solid State Technology, 2001, v. 44, n. 11, p. 24

By:

Burggraaf, Pieter

Publication type:

Article

WORLD NEWS.

Published in:: Solid State Technology, 2001, v. 44, n. 11, p. 16
Publication type:: Article

Not like its neighbors, but Colorado is still 11th in chipmaking.

Published in:

Solid State Technology, 2001, v. 44, n. 10, p. S42

By:

Burggraaf, Pieter "Pete"

Publication type:

Article

A relative newcomer, but statistics put New Mexico 10th in chipmaking.

Published in:

Solid State Technology, 2001, v. 44, n. 10, p. S34

By:

Burggraaf, Pieter "Pete"

Publication type:

Article

From Motorola's historic lab to today: Arizona ranks 3rd in chipmaking.

Published in:

Solid State Technology, 2001, v. 44, n. 10, p. S29

By:

Burggraaf, Pieter "Pete"

Publication type:

Article

Utah's wafer fabs.

Published in:

Solid State Technology, 2001, v. 44, n. 10, p. S26

By:

Burggraaf, Pieter "Pete"

Publication type:

Article

Fabs are good neighbors, too.

Published in:: Solid State Technology, 2001, v. 44, n. 10, p. S16
Publication type:: Article

Growing from Kilby's invention to today: Texas is 2nd in chipmaking.

Published in:

Solid State Technology, 2001, v. 44, n. 10, p. S11

By:

Burggraaf, Pieter "Pete"

Publication type:

Article

Regional concentration of fabs totals approximately 10% of industry's capacity.

Published in:

Solid State Technology, 2001, v. 44, n. 10, p. S7

By:

Burggraaf, Pieter "Pete"

Publication type:

Article

Challenge for the new millennium: Managing mask costs.

Published in:

Solid State Technology, 2001, v. 44, n. 10, p. 154

By:

Rygler, Kenneth A.

Publication type:

Article

Tough competition ahead from new Japanese wafer fabs.

Published in:

Solid State Technology, 2001, v. 44, n. 10, p. 36

By:

Nagahro, Yasuaki

Publication type:

Article

Tech Briefs.

Published in:: Solid State Technology, 2001, v. 44, n. 10, p. 26
Publication type:: Article

ASIA PACIFIC.

Published in:: Solid State Technology, 2001, v. 44, n. 10, p. 20
Publication type:: Article

EUROPE.

Published in:: Solid State Technology, 2001, v. 44, n. 10, p. 20
Publication type:: Article

JAPAN.

Published in:: Solid State Technology, 2001, v. 44, n. 10, p. 18
Publication type:: Article

USA.

Published in:: Solid State Technology, 2001, v. 44, n. 10, p. 16
Publication type:: Article

Chip sales down for July; N.A. tool orders up third month in a row.

Published in:: Solid State Technology, 2001, v. 44, n. 10, p. 16
Publication type:: Article

The coming world of nano- and pico-technology.

Published in:

2001

By:

Haavind, Robert

Publication type:

Editorial

Attendees challenged by economy.

Published in:: Solid State Technology, 2001, v. 44, n. 9, p. 32
Publication type:: Article

New challenges, new solutions.

Published in:: Solid State Technology, 2001, v. 44, n. 9, p. 22
Publication type:: Article

B-to-B sees second monthly uptick.

Published in:: Solid State Technology, 2001, v. 44, n. 9, p. 18
Publication type:: Article

Is chipmaking skill still a differentiator?

Published in:

2001

By:

Haavind, Robert

Publication type:

Editorial

How TSMC Fab 6 got up and running.

Published in:

Solid State Technology, 2001, v. 44, n. 8, p. S19

By:

Tsai, Nun-Sian

Publication type:

Article

Asia's silicon foundries.

Published in:

Solid State Technology, 2001, v. 44, n. 8, p. S9

By:

Burggraaf, Pieter "Pete"

Publication type:

Article

China: The sleeping dragon stirs.

Published in:: Solid State Technology, 2001, v. 44, n. 8, p. S6
Publication type:: Article

In the age of 300mm silicon, tech standards are even more crucial.

Published in:

Solid State Technology, 2001, v. 44, n. 8, p. 128

By:

Gehman, Bruce L.

Publication type:

Article

Singapore pours it on even in rough waters.

Published in:

Solid State Technology, 2001, v. 44, n. 8, p. 38

By:

Sitathan, Tony

Publication type:

Article

Cycle time, 300mm in spotlight at automation conference.

Published in:

Solid State Technology, 2001, v. 44, n. 8, p. 34

By:

Burggraaf, Pieter "Pete"

Publication type:

Article

STATS steps up role of package modeling.

Published in:

Solid State Technology, 2001, v. 44, n. 8, p. 30

By:

Burggraaf, Pieter "Pete"

Publication type:

Article

Asia Pacific.

Published in:: Solid State Technology, 2001, v. 44, n. 8, p. 24
Publication type:: Article

Europe.

Published in:: Solid State Technology, 2001, v. 44, n. 8, p. 24
Publication type:: Article

Japan.

Published in:: Solid State Technology, 2001, v. 44, n. 8, p. 22
Publication type:: Article

SMIF Integration and mini-environments cause users most grief.

Published in:: Solid State Technology, 2001, v. 44, n. 8, p. 20
Publication type:: Article

USA.

Published in:: Solid State Technology, 2001, v. 44, n. 8, p. 18
Publication type:: Article

WORLDWIDE HIGHLIGHTS.

Published in:: Solid State Technology, 2001, v. 44, n. 8, p. 18
Publication type:: Article

Economics will dictate the future.

Published in:

2001

By:

Haavind, Robert

Publication type:

Editorial

Partner for profit using the gainshare IP fee model.

Published in:

Solid State Technology, 2001, v. 44, n. 7, p. 271

By:

Kibarian, John K.

Publication type:

Article

PRODUCT PANORAMA.

Published in:: Solid State Technology, 2001, v. 44, n. 7, p. 209
Publication type:: Article

Catalytic technology for PFC emissions control.

Published in:

Solid State Technology, 2001, v. 44, n. 7, p. 189

By:

Brown, Roy S.;
Rossin, Joseph A.;
Aitchison, Kenneth

Publication type:

Article

New metrology challenges met by elastic probe technology.

Published in:

Solid State Technology, 2001, v. 44, n. 7, p. 177

By:

Howland, William H.;
Hillard, Robert J.

Publication type:

Article

Chipmakers to compete with assembly houses for SiP.

Published in:: Solid State Technology, 2001, v. 44, n. 7, p. 51
Publication type:: Article

WORLD NEWS.

Published in:: Solid State Technology, 2001, v. 44, n. 7, p. 24
Publication type:: Article

What's new? Everything! How can we ever get all of it to work together?

Published in:

2001

By:

Haavind, Robert

Publication type:

Editorial