New tools for cycle-time reduction.
- Published in:
- Solid State Technology, 2001, v. 44, n. 11, p. 120
- By:
- Publication type:
- Article
Works matching DE "SEMICONDUCTOR industrial equipment industry"
Results: 55
1
2
Despite slowdown, European equipment suppliers buoyant.
- Published in:
- Solid State Technology, 2001, v. 44, n. 7, p. 54
- Publication type:
- Article
3
Outlook from Japan: Cloudy.
- Published in:
- Solid State Technology, 2001, v. 44, n. 5, p. 42
- Publication type:
- Article
4
CMP: Market trends and technology.
- Published in:
- Solid State Technology, 2000, v. 43, n. 6, p. 67
- By:
- Publication type:
- Article
5
JAPAN.
- Published in:
- Solid State Technology, 2000, v. 43, n. 5, p. 28
- By:
- Publication type:
- Article
6
WORLDWIDE HIGHLIGHTS.
- Published in:
- Solid State Technology, 2000, v. 43, n. 4, p. 16
- Publication type:
- Article
7
IMEC ships 0.25...m design kits.
- Published in:
- Solid State Technology, 1999, v. 42, n. 12, p. 24
- Publication type:
- Article
8
SEMI's book-to-bill hits 1.30.
- Published in:
- Solid State Technology, 1999, v. 42, n. 6, p. 14
- Publication type:
- Article
9
Manufacturing emissive displays.
- Published in:
- Solid State Technology, 1999, v. 42, n. 1, p. 51
- By:
- Publication type:
- Article
10
Minifabs lower barriers to 300 mm.
- Published in:
- Solid State Technology, 1999, v. 42, n. 1, p. 72
- By:
- Publication type:
- Article
11
Inventory modeling yields significant cycle-time improvements.
- Published in:
- Solid State Technology, 1999, v. 42, n. 1, p. 44
- By:
- Publication type:
- Article
12
Process control through integrated metrology.
- Published in:
- Solid State Technology, 1999, v. 42, n. 1, p. 33
- By:
- Publication type:
- Article
13
Patent Briefs.
- Published in:
- Solid State Technology, 1999, v. 42, n. 1, p. 28
- Publication type:
- Article
14
Japanese chipmakers cut spending plans.
- Published in:
- Solid State Technology, 1999, v. 42, n. 1, p. 24
- By:
- Publication type:
- Article
15
Singapore's new foundry.
- Published in:
- Solid State Technology, 1999, v. 42, n. 1, p. 24
- Publication type:
- Article
16
UMC restructures and forms joint ventures.
- Published in:
- Solid State Technology, 1999, v. 42, n. 1, p. 24
- By:
- Publication type:
- Article
17
Euro Briefs.
- Published in:
- Solid State Technology, 1999, v. 42, n. 1, p. 22
- Publication type:
- Article
18
ASM provides furnace for 300-mm.
- Published in:
- Solid State Technology, 1999, v. 42, n. 1, p. 22
- Publication type:
- Article
19
Jenoptik's new CEO to provide faster startups.
- Published in:
- Solid State Technology, 1999, v. 42, n. 1, p. 22
- By:
- Publication type:
- Article
20
13001 makes 0.12-microm lines with 248-nm exposure.
- Published in:
- Solid State Technology, 1999, v. 42, n. 1, p. 20
- By:
- Publication type:
- Article
21
Siemens spins out semiconductor business.
- Published in:
- Solid State Technology, 1999, v. 42, n. 1, p. 22
- By:
- Publication type:
- Article
22
Next-generation litho is the focus of Belgium conference.
- Published in:
- Solid State Technology, 1999, v. 42, n. 1, p. 20
- By:
- Publication type:
- Article
23
Tech Briefs.
- Published in:
- Solid State Technology, 1999, v. 42, n. 1, p. 18
- Publication type:
- Article
24
Copper interconnect process module.
- Published in:
- Solid State Technology, 1999, v. 42, n. 1, p. 18
- By:
- Publication type:
- Article
25
Device cross sectioning without losing product wafers.
- Published in:
- Solid State Technology, 1999, v. 42, n. 1, p. 18
- By:
- Publication type:
- Article
26
Equipment sales and chip sales tire in October.
- Published in:
- Solid State Technology, 1999, v. 42, n. 1, p. 14
- Publication type:
- Article
27
Indicators hint at an upturn in the equipment industry.
- Published in:
- Solid State Technology, 1998, v. 41, n. 12, p. 38
- By:
- Publication type:
- Article
28
September SEMI book-to-bill down again, to 0.57.
- Published in:
- Solid State Technology, 1998, v. 41, n. 12, p. 16
- Publication type:
- Article
29
Japan tool firms cut FY forecast.
- Published in:
- Solid State Technology, 1998, v. 41, n. 9, p. 56
- By:
- Publication type:
- Article
30
Mask technology challenges and 230-mm reticles.
- Published in:
- Solid State Technology, 1998, v. 41, n. 8, p. 46
- By:
- Publication type:
- Article
31
Worldwide highlights.
- Published in:
- Solid State Technology, 1998, v. 41, n. 8, p. 22
- Publication type:
- Article
32
Asiafocus.
- Published in:
- Solid State Technology, 1998, v. 41, n. 7, p. 86
- By:
- Publication type:
- Article
33
Eurofocus.
- Published in:
- Solid State Technology, 1998, v. 41, n. 7, p. 80
- By:
- Publication type:
- Article
34
Equipment book-to-bill slipped again in December.
- Published in:
- Solid State Technology, 1998, v. 41, n. 3, p. 16
- Publication type:
- Article
35
October equipment book-to-bill dips.
- Published in:
- Solid State Technology, 1998, v. 41, n. 2, p. 14
- Publication type:
- Article
36
Growth seen in front-end tool market.
- Published in:
- Solid State Technology, 1998, v. 41, n. 2, p. 14
- Publication type:
- Article
37
SEMATECH litho meeting: Good talk, no selections.
- Published in:
- Solid State Technology, 1998, v. 41, n. 1, p. 28
- By:
- Publication type:
- Article
38
The European Union's CE marking directives.
- Published in:
- Solid State Technology, 1997, v. 40, n. 12, p. 34
- Publication type:
- Article
39
From Physics to Function: An Empirical Study of Research and Development Performance in the Semiconductor Industry.
- Published in:
- Journal of Product Innovation Management, 1999, v. 16, n. 4, p. 385, doi. 10.1016/S0737-6782(98)00068-X
- By:
- Publication type:
- Article
40
An Empirical Analysis of Forecast Sharing in the Semiconductor Equipment Supply Chain.
- Published in:
- Management Science, 2005, v. 51, n. 2, p. 208, doi. 10.1287/mnsc.1040.0317
- By:
- Publication type:
- Article
41
Macro- and micro-modeling of field service dynamics.
- Published in:
- System Dynamics Review (Wiley), 1999, v. 15, n. 2, p. 139, doi. 10.1002/(SICI)1099-1727(199922)15:2<139::AID-SDR164>3.0.CO;2-B
- By:
- Publication type:
- Article
42
Representing function-technology platform based on the unified modelling language.
- Published in:
- International Journal of Production Research, 2012, v. 50, n. 12, p. 3236, doi. 10.1080/00207543.2011.562650
- By:
- Publication type:
- Article
43
A study on the improvements of new product development procedure performance-an application of design for Six Sigma in a semi-conductor equipment manufacturer.
- Published in:
- International Journal of Production Research, 2010, v. 48, n. 19, p. 5573, doi. 10.1080/00207540903119176
- By:
- Publication type:
- Article
44
Dynamic capacity modeling in semiconductor assembly manufacturing.
- Published in:
- International Journal of Production Research, 2008, v. 46, n. 3, p. 739, doi. 10.1080/00207540600932020
- By:
- Publication type:
- Article
45
The Brand Awareness-to-Preference Link in Business Markets: A Study of the Semiconductor Manufacturing Industry.
- Published in:
- Journal of Business-to-Business Marketing, 1995, v. 2, n. 4, p. 7
- By:
- Publication type:
- Article
46
Minimizing makespan on parallel machines with release time and machine eligibility restrictions.
- Published in:
- International Journal of Production Research, 2004, v. 42, n. 6, p. 1243, doi. 10.1080/00207540310001631584
- By:
- Publication type:
- Article
47
Scheduling a batch processing machine with non-identical job sizes.
- Published in:
- International Journal of Production Research, 2000, v. 38, n. 10, p. 2173, doi. 10.1080/00207540050028034
- By:
- Publication type:
- Article
48
Too Much of a Good Thing? Product Proliferation and Organizational Failure.
- Published in:
- Organization Science, 2001, v. 12, n. 5, p. 539, doi. 10.1287/orsc.12.5.539.10095
- By:
- Publication type:
- Article
49
Chip-making equipment industry warns of threat from Intel deal.
- Published in:
- Nature, 1997, v. 389, n. 6648, p. 215, doi. 10.1038/38335
- By:
- Publication type:
- Article
50
Product Briefings.
- Published in:
- Photovoltaics International, 2009, n. 6, p. 14
- Publication type:
- Article