Works about SEMICONDUCTOR devices

Results: 1349

Electrical Stress on Semiconductor Devices Mounted on PCB during Electrostatic Elimination by Corona Discharge Ionizer.

Published in:

IEEJ Transactions on Electrical & Electronic Engineering, 2025, v. 20, n. 6, p. 966, doi. 10.1002/tee.24245

By:

Nakano, Aguri;
Okano, Makoto;
Terashige, Takashi

Publication type:

Article

Simulation and modeling of gallium nitride high-electron mobility transistors for non-alloyed ohmic contacts.

Published in:

International Journal of Nanoelectronics & Materials, 2025, v. 18, n. 2, p. 222, doi. 10.58915/ijneam.v18i2.2066

By:

Tung Kok Siong;
Packeer Mohamed, Mohamed Fauzi;
Abd Rahman, Siti Fatimah;
Syamsul, Mohd;
Abu Bakar, Ahmad Shuhaimi;
Abd Rahim, Alhan Farhanah

Publication type:

Article

Improved COT control strategy for CRM Boost-PFC circuits applied to marine integrated power systems.

Published in:

Scientific Reports, 2025, v. 15, n. 1, p. 1, doi. 10.1038/s41598-025-01888-1

By:

Chen, Hongxing;
Xiao, Jian;
Lin, Jianwen;
Liu, Chen;
Zhuang, Shengbin;
Wang, Zhiyuan

Publication type:

Article

Influence of humidity on the resistive switching of hexagonal boron nitride-based memristors.

Published in:

NPJ 2D Materials & Applications, 2025, v. 9, n. 1, p. 1, doi. 10.1038/s41699-025-00566-0

By:

Völkel, Lukas;
Ahmad, Rana Walied;
Bestaeva, Alana;
Braun, Dennis;
Cruces, Sofia;
Lee, Jimin;
Pasko, Sergej;
Krotkus, Simonas;
Heuken, Michael;
Menzel, Stephan;
Lemme, Max C.

Publication type:

Article

Performance Estimation of Dual-Halo Dual-Material Silicon-On-Insulator with High-K Dielectrics for Low Power Applications.

Published in:

Journal of Engineering Science & Technology Review, 2025, v. 18, n. 2, p. 49

By:

Pawan;
Sachdeva, Nitin;
Dhiman, Rohtash;
Singh, Shailendra Narayan;
Sharma, Swati;
Jain, Rachna;
Panchal, Vinod Kumar

Publication type:

Article

JAX-BTE: a GPU-accelerated differentiable solver for phonon Boltzmann transport equations.

Published in:

NPJ Computational Materials, 2025, v. 11, n. 1, p. 1, doi. 10.1038/s41524-025-01635-0

By:

Shang, Wenjie;
Zhou, Jiahang;
Panda, J. P.;
Xu, Zhihao;
Liu, Yi;
Du, Pan;
Wang, Jian-Xun;
Luo, Tengfei

Publication type:

Article

Inherent Hardware Identifiers: Advancing IC Traceability and Provenance in the Multi-Die Era.

Published in:

Journal of Electronic Testing, 2025, v. 41, n. 1, p. 85, doi. 10.1007/s10836-025-06161-x

By:

Khan, M Shafkat M.;
Xi, Chengjie;
Varshney, Nitin;
Bahk, Je-Hyeong;
Asadizanjani, Navid

Publication type:

Article

How to Achieve High Spatial Resolution in Organic Optobioelectronic Devices?

Published in:

Advanced Materials Interfaces, 2025, v. 12, n. 9, p. 1, doi. 10.1002/admi.202400822

By:

Fabbri, Luca;
Migliaccio, Ludovico;
Širvinskytė, Aleksandra;
Rizzi, Giacomo;
Bondi, Luca;
Tamarozzi, Cristiano;
Weber, Stefan A.L.;
Fraboni, Beatrice;
Glowacki, Eric Daniel;
Cramer, Tobias

Publication type:

Article

An improved modulation algorithm for the dual‐output six‐switch inverter with reduced switching frequency.

Published in:

International Journal of Circuit Theory & Applications, 2025, v. 53, n. 5, p. 2579, doi. 10.1002/cta.4241

By:

Li, Xiangfeng;
Yang, Zetao;
Guo, Fang;
Liao, Hui

Publication type:

Article

The modulation of the TiAlSiN coating on the band gap of monolayer MoS2.

Published in:

Surface Engineering, 2021, v. 37, n. 4, p. 505, doi. 10.1080/02670844.2020.1790169

By:

Wang, R.;
Jin, K.;
Liu, D. M.;
Su, K.

Publication type:

Article

On the Electrochemical Growth of a Crystalline p–n Junction From Aqueous Solutions.

Published in:

Chemistry - A European Journal, 2024, v. 30, n. 42, p. 1, doi. 10.1002/chem.202401403

By:

Felici, Roberto;
Baroni, Tommaso;
Carlà, Francesco;
Cioffi, Nicola;
Di Benedetto, Francesco;
Fontanesi, Claudio;
Giaccherini, Andrea;
Giurlani, Walter;
Gonidec, Mathieu;
Lavacchi, Alessandro;
Berretti, Enrico;
Marcantelli, Patrick;
Montegrossi, Giordano;
Bonechi, Marco;
Picca, Rosaria A.;
Poggini, Lorenzo;
Russo, Francesca;
Sportelli, Maria C.;
Torsi, Luisa;
Innocenti, Massimo

Publication type:

Article

The Formation Mechanism of Binary Semiconductor Nanomaterials: Shared by Single-Source and Dual-Source Precursor Approaches.

Published in:

Angewandte Chemie, 2013, v. 125, n. 42, p. 11240, doi. 10.1002/ange.201304958

By:

Yu, Kui;
Liu, Xiangyang;
Zeng, Qun;
Yang, Mingli;
Ouyang, Jianying;
Wang, Xinqin;
Tao, Ye

Publication type:

Article

Large-Size Growth of Ultrathin SnS2 Nanosheets and High Performance for Phototransistors.

Published in:

Advanced Functional Materials, 2016, v. 26, n. 24, p. 4405, doi. 10.1002/adfm.201600318

By:

Zhou, Xing;
Zhang, Qi;
Gan, Lin;
Li, Huiqiao;
Zhai, Tianyou

Publication type:

Article

Single Crystal-Like Performance in Solution-Coated Thin-Film Organic Field-Effect Transistors.

Published in:

Advanced Functional Materials, 2016, v. 26, n. 14, p. 2379, doi. 10.1002/adfm.201502274

By:

del Pozo, Freddy G.;
Fabiano, Simone;
Pfattner, Raphael;
Georgakopoulos, Stamatis;
Galindo, Sergi;
Liu, Xianjie;
Braun, Slawomir;
Fahlman, Mats;
Veciana, Jaume;
Rovira, Concepció;
Crispin, Xavier;
Berggren, Magnus;
Mas‐Torrent, Marta

Publication type:

Article

Charge Photogeneration in Few-Layer MoS2.

Published in:

Advanced Functional Materials, 2015, v. 25, n. 22, p. 3351, doi. 10.1002/adfm.201500709

By:

Borzda, Tetiana;
Gadermaier, Christoph;
Vujicic, Natasa;
Topolovsek, Peter;
Borovsak, Milos;
Mertelj, Tomaz;
Viola, Daniele;
Manzoni, Cristian;
Pogna, Eva A. A.;
Brida, Daniele;
Antognazza, Maria Rosa;
Scotognella, Francesco;
Lanzani, Guglielmo;
Cerullo, Giulio;
Mihailovic, Dragan

Publication type:

Article

Biodegradable Thin Metal Foils and Spin-On Glass Materials for Transient Electronics.

Published in:

Advanced Functional Materials, 2015, v. 25, n. 12, p. 1789, doi. 10.1002/adfm.201403469

By:

Kang, Seung‐Kyun;
Hwang, Suk‐Won;
Yu, Sooyoun;
Seo, Jung‐Hun;
Corbin, Elise A.;
Shin, Jiho;
Wie, Dae Seung;
Bashir, Rashid;
Ma, Zhenqiang;
Rogers, John A.

Publication type:

Article

State-of-the-Art Progress in Diverse Heterostructured Photocatalysts toward Promoting Photocatalytic Performance.

Published in:

Advanced Functional Materials, 2015, v. 25, n. 7, p. 998, doi. 10.1002/adfm.201401636

By:

Li, Haijin;
Zhou, Yong;
Tu, Wenguang;
Ye, Jinhua;
Zou, Zhigang

Publication type:

Article

Optimization of reflow profile for copper pillar with SAC305 solder cap FCCSP.

Published in:

Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 3, p. 1, doi. 10.1007/s10854-022-09661-0

By:

Zainudin, Wan Zamir Zakwan Wan;
Yong, Tan Chou;
Hui, Tan Cai;
Kar, Yap Boon;
Hoong, Wong Yew

Publication type:

Article

Formation mechanism and reliability of preferred growth full Cu6Sn5 intermetallic compound interconnect on (011) Cu single-crystal substrate.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 33, p. 25274, doi. 10.1007/s10854-022-09234-1

By:

Huang, M. L.;
Zou, L.;
Wu, Y.

Publication type:

Article

The electrical characterization of metal–insulator–semiconductor device with β-naphthol orange interface.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 26, p. 20900, doi. 10.1007/s10854-022-08897-0

By:

Özerden, Enise;
Özden, Pınar;
Afşin Kariper, İ.;
Pakma, Osman

Publication type:

Article

Influence of illumination intensity on the electrical properties of Al/NOA65/p-Si/Al heterojunction MPS device.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 16, p. 12796, doi. 10.1007/s10854-022-08225-6

By:

Özden, Şadan;
Avcı, Nejmettin;
Pakma, Osman;
Kariper, İ. Afşin

Publication type:

Article

Investigating the effect of copper phthalocyanine-emitting dopant on the production of near‐infrared organic light-emitting diodes.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 13, p. 10494, doi. 10.1007/s10854-022-08036-9

By:

Abbasi, Fatemeh;
Ghorashi, Seyed Mohammad Bagher;
Eskandarian, Parvin;
Zabolian, Hossein

Publication type:

Article

An overview of conventional and new advancements in high kappa thin film deposition techniques in metal oxide semiconductor devices.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 10, p. 7313, doi. 10.1007/s10854-022-07975-7

By:

Devaray, Premdass;
Hatta, Sharifah Fatmadiana Wan Muhammad;
Wong, Yew Hoong

Publication type:

Article

Electroluminescence from metal–oxide–semiconductor devices based on erbium silicate nanocrystals and silicon nanocrystals co-embedded in silicon oxide thin films.

Published in:

Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 15, p. 20659, doi. 10.1007/s10854-021-06579-x

By:

He, Majun;
Yang, Deren;
Li, Dongsheng

Publication type:

Article

Illumination impact on the electrical characteristics of Au/Sunset Yellow/n-Si/Au hybrid Schottky diode.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 17, p. 14665, doi. 10.1007/s10854-020-04029-8

By:

Imer, A. G.;
Kaya, E.;
Dere, A.;
Al-Sehemi, A. G.;
Al-Ghamdi, A. A.;
Karabulut, A.;
Yakuphanoglu, F.

Publication type:

Article

A low-temperature bonding method for high power device packaging based on In-infiltrated nanoporous Cu.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 17, p. 14157, doi. 10.1007/s10854-020-03970-y

By:

Hang, Chunjin;
Liu, Jiahao;
Wang, Jianqiang;
Fu, Xing;
Chen, Hongtao;
Li, Mingyu

Publication type:

Article

Effect of pulsed UV laser irradiation on 4H-SiC MOS with thermal gate oxide.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 8, p. 5838, doi. 10.1007/s10854-019-02610-4

By:

Luo, Zhipeng;
Wan, Caiping;
Xu, Hengyu;
Zhao, Fazhan;
Jin, Zhi

Publication type:

Article

Special issue on selected papers from EMRS: Carrier transport, photonics and sensing.

Published in:

2020

By:

Ruzin, Arie

Publication type:

Editorial

Mechanical characteristics and fracture behavior of GaN/DBA die-attached during thermal aging: pressure-less hybrid Ag sinter joint and Pb–5Sn solder joint.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 1, p. 587, doi. 10.1007/s10854-019-02563-8

By:

Kim, Dongjin;
Chen, Chuantong;
Nagao, Shijo;
Suganuma, Katsuaki

Publication type:

Article

Cobalt germanide contacts: growth reaction, phase formation models, and electrical properties.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 11, p. 10031, doi. 10.1007/s10854-019-01366-1

By:

Rabie, Mohamed A.;
Mirza, Souzan;
Hu, Yujie;
Haddara, Yaser M.

Publication type:

Article

Printed wire interconnection using Ag sinter paste for wide band gap power semiconductors.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 17, p. 15223, doi. 10.1007/s10854-018-9664-1

By:

Noh, Seungjun;
Choe, Chanyang;
Chen, Chuantong;
Zhang, Hao;
Suganuma, Katsuaki

Publication type:

Article

Solid porous Ag-Ag interface bonding and its application in the die-attached modules.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 15, p. 13418, doi. 10.1007/s10854-018-9467-4

By:

Chen, Chuantong;
Suganuma, Katsuaki

Publication type:

Article

Sputtering power dependence of structure and photoluminescence of ZnO on 6H-SiC.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 23, p. 17881, doi. 10.1007/s10854-017-7729-1

By:

Li, Qi;
Fu, Sulei;
Song, Cheng;
Wang, Guangyue;
Zeng, Fei;
Pan, Feng

Publication type:

Article

Current-voltage characteristics of Au/ZnO/n-Si device in a wide range temperature.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 22, p. 17177, doi. 10.1007/s10854-017-7646-3

By:

Kocyigit, A.;
Orak, I.;
Çaldıran, Z.;
Turut, A.

Publication type:

Article

Fabrication and study of optical properties on CdS semiconductor as buffer layer for Cu(In,Ga)Se thin film solar cells.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 14, p. 10173, doi. 10.1007/s10854-017-6781-1

By:

Esmaeili-Zare, Mahdiyeh;
Behpour, Mohsen

Publication type:

Article

The effect of infrared plasmon on the performance of Si-based THz detectors.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 1, p. 839, doi. 10.1007/s10854-016-5598-7

By:

Zhu, He;
Xu, Jintao;
Zhu, Jiaqi;
Wang, Miao;
Wu, Huizhen;
Li, Ning;
Dai, Ning

Publication type:

Article

Ag nanoparticle catalyst based on GaO/GaAs semiconductor nanowire growth by VLS method.

Published in:

Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 11, p. 8747, doi. 10.1007/s10854-015-3552-8

By:

Nguyen, Tien Dai;
Kim, Eui Tae;
Dao, Khac An

Publication type:

Article

Evolutions of bonding wires used in semiconductor electronics: perspective over 25 years.

Published in:

Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 7, p. 4412, doi. 10.1007/s10854-015-2892-8

By:

Gan, Chong;
Hashim, U.

Publication type:

Article

Failure analysis of EOS-induced damage at final electrical testing.

Published in:

Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 2, p. 596, doi. 10.1007/s10854-013-1521-7

By:

Chen, Ming-Kun;
Huang, Yu-Jung;
Cheng, Chi-Chan;
Lin, Yi-Lung;
Fu, Shen-Li

Publication type:

Article

Research on laser multi-focal scribe cutting of silicon wafer based on spatial light modulation.

Published in:

International Journal of Advanced Manufacturing Technology, 2025, v. 137, n. 3, p. 1117, doi. 10.1007/s00170-025-15267-7

By:

Zhang, Fengyun;
Jiang, Mingming;
Sun, Shufeng;
Sun, Weiwei;
Monka, Peter Pavol

Publication type:

Article

Optimization of silicon ingot manufacturing for high production rates.

Published in:

International Journal of Advanced Manufacturing Technology, 2024, v. 133, n. 3/4, p. 1893, doi. 10.1007/s00170-024-13953-6

By:

Ansari Dezfoli, Amir Reza

Publication type:

Article

An adaptive genetic algorithm optimize neural networks approach for wafer dicing saw quality prediction.

Published in:

International Journal of Advanced Manufacturing Technology, 2023, v. 124, n. 1/2, p. 209, doi. 10.1007/s00170-022-10472-0

By:

Shi, Jun;
Du, Sihan;
Shi, Yunpeng;
Cao, Weifeng;
Zhou, Lintao

Publication type:

Article

Statistical supervised learning with engineering data: a case study of low frequency noise measured on semiconductor devices.

Published in:

International Journal of Advanced Manufacturing Technology, 2022, v. 120, n. 9/10, p. 5835, doi. 10.1007/s00170-022-08949-z

By:

Gámiz, María Luz;
Kalén, Anton;
Nozal-Cañadas, Rafael;
Raya-Miranda, Rocío

Publication type:

Article

An MDP-based lifter assignment algorithm for inter-floor transportation in semiconductor fabrication.

Published in:

International Journal of Advanced Manufacturing Technology, 2022, v. 119, n. 9/10, p. 6583, doi. 10.1007/s00170-021-08387-3

By:

Shin, Kyohong;
Jang, Hoon;
Kim, Haejoong

Publication type:

Article

Material removal rate of double-faced mechanical polishing of 4H-SiC substrate.

Published in:

International Journal of Advanced Manufacturing Technology, 2022, v. 118, n. 11/12, p. 3983, doi. 10.1007/s00170-021-08186-w

By:

Zhang, Peng;
Yang, Jingfang;
Qiu, Huadong

Publication type:

Article

Recent developments and applications of chemical mechanical polishing.

Published in:

International Journal of Advanced Manufacturing Technology, 2020, v. 109, n. 5/6, p. 1419, doi. 10.1007/s00170-020-05740-w

By:

Zhong, Zhao-Wei

Publication type:

Article

Experimental investigation for performance assessment of scheduling policies in semiconductor wafer fabrication—a simulation approach.

Published in:

International Journal of Advanced Manufacturing Technology, 2018, v. 99, n. 5-8, p. 1503, doi. 10.1007/s00170-018-2414-y

By:

Singh, Rashmi;
Mathirajan, M.

Publication type:

Article

ARVIN converter: a bidirectional DC/DC converter for grid-connected G2V/V2G energy storage and electrification approaches.

Published in:

Electrical Engineering, 2024, v. 106, n. 5, p. 5485, doi. 10.1007/s00202-024-02295-x

By:

Ertekin, Davut

Publication type:

Article

Reliability evaluation of a novel fault tolerant multilevel inverter with reduced components.

Published in:

Electrical Engineering, 2023, v. 105, n. 3, p. 1655, doi. 10.1007/s00202-023-01744-3

By:

Dewangan, Niraj Kumar;
Verma, Deepak;
Agrawal, Rakeshwri;
Kumar, Dhananjay;
Gupta, Krishna Kumar

Publication type:

Article

Accurate simulation and modeling of the control system and the power electronics of a 72-pulse VSC-based generalized unified power flow controller (GUPFC).

Published in:

Electrical Engineering, 2020, v. 102, n. 3, p. 1795, doi. 10.1007/s00202-020-00993-w

By:

Abasi, Mahyar;
Joorabian, Mahmood;
Saffarian, Alireza;
Seifossadat, Seyyed Ghodratollah

Publication type:

Article