Applied physics: A cascade laser's random walk.
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- Nature, 2013, v. 503, n. 7475, p. 200, doi. 10.1038/503200a
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- Article
Works matching DE "SEMICONDUCTOR device packaging"
Results: 3
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EMERGING TECHNIQUES FOR 2-D/2.5-D/3-D PACKAGE FAILURE ANALYSIS: EOTPR, 3-D X-RAY, AND PLASMA FIB.
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- Electronic Device Failure Analysis, 2016, v. 18, n. 4, p. 30, doi. 10.31399/asm.edfa.2016-4.p030
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- Article
3
TEC power consumption in laser array packaging.
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- Optical & Quantum Electronics, 2017, v. 49, n. 4, p. 1, doi. 10.1007/s11082-017-0976-9
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- Article