Works matching DE "SEALING (Technology)"
1
- Fluid Machinery, 2025, v. 53, n. 5, p. 30, doi. 10.3969/j.issn.1005-0329.2025.05.005
- OU Guofu;
- LI Zhihao;
- JIN Haozhe;
- CHEN Fengguan;
- LIU Xiaofei;
- CHEN Xiantao;
- LIANG Chunlei;
- LIU Peng
- Article
2
- Computer-Aided Design & Applications, 2005, v. 2, n. 1-4, p. 135, doi. 10.1080/16864360.2005.10738361
- Spence, Allan D.;
- Chan, H.-L.;
- Mitchell, J. Philip;
- Capson, David W.
- Article
3
- Instruments & Experimental Techniques, 2025, v. 68, n. 1, p. 108, doi. 10.1134/S002044122570023X
- Stepanov, V. A.;
- Moos, E. N.;
- Rumyantsev, R. S.;
- Kudyukin, A. I.;
- Bobrovskii, K. I.;
- Payurov, A. Ya.
- Article
4
- Journal of Applied Fluid Mechanics, 2025, v. 18, n. 7, p. 1938, doi. 10.47176/jafm.18.7.3144
- Li, Q.;
- Cheng, S.;
- Hou, Z.;
- Zhao, W.;
- Guan, Q.
- Article
5
- China Pulp & Paper, 2025, v. 44, n. 5, p. 114, doi. 10.11980/j.issn.0254-508X.2025.05.015
- Article
6
- NPJ Science of Food, 2025, v. 9, n. 1, p. 1, doi. 10.1038/s41538-025-00450-7
- Zhu, Yan;
- Du, Wangli;
- Cui, Jian;
- Shao, Hong;
- Guo, Yakun;
- Tang, Changyu;
- Xu, Run
- Article
7
- Pure & Applied Chemistry, 2025, v. 97, n. 6, p. 659, doi. 10.1515/pac-2024-0265
- Chang, Zhen Hong;
- Teow, Yeit Haan;
- Yeap, Swee Pin;
- Sum, Jing Yao
- Article
8
- Solid State Technology, 2000, v. 43, n. 8, p. 136
- Article
9
- Solid State Technology, 1999, v. 42, n. 8, p. 73
- Article
10
- Journal of Electronic Materials, 2025, v. 54, n. 1, p. 773, doi. 10.1007/s11664-024-11524-9
- Sakamoto, Ichizo;
- Jeong, Doojin;
- Tatsumi, Hiroaki;
- Nishikawa, Hiroshi
- Article
11
- Journal of Electronic Materials, 2024, v. 53, n. 8, p. 4410, doi. 10.1007/s11664-024-11107-8
- Bickel, Steffen;
- Quednau, Sebastian;
- Birlem, Olav;
- Graff, Andreas;
- Altmann, Frank;
- Junghähnel, Manuela;
- Panchenko, Juliana
- Article
12
- Surface Engineering, 2023, v. 39, n. 2, p. 174, doi. 10.1080/02670844.2023.2203441
- Ren, Jinghui;
- Li, Tianrun;
- Zhang, Suode;
- Xu, Min;
- Wang, Jianqiang
- Article
13
- Surface Engineering, 2014, v. 30, n. 5, p. 299, doi. 10.1179/1743294414Y.0000000268
- Li, W. Y.;
- Zhang, D. D.;
- Huang, C. J.;
- Yin, S.;
- Yu, M.;
- Wang, F. F.;
- Liao, H. L.
- Article
14
- Surface Engineering, 2014, v. 30, n. 1, p. 31, doi. 10.1179/1743294413Y.0000000195
- Wang, Y. Q.;
- Deng, Y. Z.;
- Shao, Y. W.;
- Wang, F. H.
- Article
15
- Surface Engineering, 2012, v. 28, n. 7, p. 491, doi. 10.1179/1743294412Y.0000000015
- Chen, M-A;
- Cheng, N;
- Li, J-M;
- Liu, S-Y
- Article
16
- Surface Engineering, 2012, v. 28, n. 5, p. 345, doi. 10.1179/1743294412Y.0000000004
- Zhang, J J;
- Wang, Z H;
- Lin, P H;
- Si, L Q;
- Shen, G J;
- Zhou, Z H;
- Jiang, S Q;
- Lu, W H
- Article
17
- Surface Engineering, 2008, v. 24, n. 6, p. 436, doi. 10.1179/174329408X281777
- Cai, F.;
- Yang, Q.;
- Huang, X.;
- Nagy, D.
- Article
18
- Surface Engineering, 2007, v. 23, n. 2, p. 73, doi. 10.1179/174329407X192588
- Article
19
- Surface Engineering, 2004, v. 20, n. 1, p. 17, doi. 10.1179/026708404225010612
- Article
20
- Ingeniería y Desarrollo, 2010, n. 28, p. 2
- Castaño, Juan G.;
- Echeverría, Félix
- Article
21
- 2014
- Sarkar, Suresh;
- Guria, Amit K.;
- Patra, Biplab K.;
- Pradhan, Narayan
- Case Study
22
- Angewandte Chemie, 2013, v. 125, n. 47, p. 12607, doi. 10.1002/ange.201306334
- Liu, Ning;
- Lee, Kiyoung;
- Schmuki, Patrik
- Article
23
- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 20, p. 18848, doi. 10.1007/s10854-019-02241-9
- Min, Kyung Deuk;
- Jung, Kwang-Ho;
- Lee, Choong-Jae;
- Jeong, Haksan;
- Jung, Seung-Boo
- Article
24
- Journal of Materials Science: Materials in Electronics, 2013, v. 24, n. 3, p. 839, doi. 10.1007/s10854-012-0829-z
- Roshanghias, A.;
- Kokabi, A.;
- Miyashita, Y.;
- Mutoh, Y.;
- Madaah Hosseini, H.
- Article
25
- Journal of Materials Science: Materials in Electronics, 2013, v. 24, n. 3, p. 1037, doi. 10.1007/s10854-012-0874-7
- Liu, Yucheng;
- Hu, Anmin;
- Luo, Tingbi;
- Li, Ming
- Article
26
- Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 2, p. 484, doi. 10.1007/s10854-011-0422-x
- Şahin, Mevlüt;
- Çadirli, Emin
- Article
27
- Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 1, p. 1, doi. 10.1007/s10854-011-0593-5
- Article
28
- Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 8, p. 779, doi. 10.1007/s10854-009-9993-1
- Wen-Xue Chen;
- Song-Bai Xue;
- Hui Wang;
- Yu-Hua Hu
- Article
29
- Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 2, p. 111, doi. 10.1007/s10854-009-9877-4
- Hui Wang;
- Songbai Xue;
- Feng Zhao;
- Wenxue Chen
- Article
30
- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 12, p. 1239, doi. 10.1007/s10854-009-9859-6
- Hui Wang;
- Songbai Xue;
- Wenxue Chen;
- Feng Zhao
- Article
31
- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 6, p. 571, doi. 10.1007/s10854-008-9767-1
- Babaghorbani, P.;
- Nai, S.;
- Gupta, M.
- Article
32
- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 2, p. 186, doi. 10.1007/s10854-008-9696-z
- Guangdong Li;
- Yaowu Shi;
- Hu Hao;
- Zhidong Xia;
- Yongping Lei;
- Fu Guo;
- Xiaoyan Li
- Article
33
- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 12, p. 1160, doi. 10.1007/s10854-007-9505-0
- Jing Bo Wan;
- Yong Chang Liu;
- Chen Wei;
- Peng Jiang;
- Zhi Gao
- Article
34
- Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 10, p. 1057, doi. 10.1007/s10854-006-9114-3
- Yu, D. Q.;
- Wu, C. M.;
- Wong, Y. W.;
- Lai, J. K. L.
- Article
35
- Journal of Materials Science Letters, 2003, v. 22, n. 6, p. 463, doi. 10.1023/A:1022924014590
- Vippola, M.;
- Vuoristo, P.;
- Lepistö, T.;
- Mäntylä, T.
- Article
36
- Geotechnical & Geological Engineering, 2018, v. 36, n. 1, p. 49, doi. 10.1007/s10706-017-0301-1
- Khamrat, Supattra;
- Tepnarong, Prachya;
- Artkhonghan, Kiattisak;
- Fuenkajorn, Kittitep
- Article
37
- PAMM: Proceedings in Applied Mathematics & Mechanics, 2015, v. 15, n. 1, p. 197, doi. 10.1002/pamm.201510089
- Gorash, Yevgen;
- Dempster, William;
- Nicholls, William D.;
- Hamilton, Robert
- Article
38
- PAMM: Proceedings in Applied Mathematics & Mechanics, 2013, v. 13, n. 1, p. 73, doi. 10.1002/pamm.201310032
- Gorash, Yevgen;
- Chen, Haofeng
- Article
39
- Journal of Solid State Electrochemistry, 2020, v. 24, n. 7, p. 1669, doi. 10.1007/s10008-020-04660-9
- Qian, Bei;
- Yang, Xulan;
- Li, Xuyun;
- Song, Zuwei
- Article
40
- Journal of Solid State Electrochemistry, 2010, v. 14, n. 7, p. 1255, doi. 10.1007/s10008-009-0928-9
- Sabino, Rondon;
- Azambuja, Denise Schermann;
- Gonçalves, Reinaldo Simões
- Article
41
- Journal of Solid State Electrochemistry, 2010, v. 14, n. 3, p. 403, doi. 10.1007/s10008-009-0891-5
- Costa, Virginia;
- Texier, Annick
- Article
42
- Continuum Mechanics & Thermodynamics, 2018, v. 30, n. 2, p. 381, doi. 10.1007/s00161-017-0608-4
- Fischer, Tim;
- Welzenbach, Sarah;
- Meier, Felix;
- Werner, Ewald;
- kyzy, Sonun Ulan;
- Munz, Oliver
- Article
43
- European Food Research & Technology, 2003, v. 217, n. 4, p. 365
- Zehra Ayhan;
- Q. Howard Zhang
- Article
44
- Strength of Materials, 2016, v. 48, n. 3, p. 371, doi. 10.1007/s11223-016-9773-0
- Vereshchaka, S.;
- Deineka, A.;
- Danil'tsev, V.
- Article
45
- Strength of Materials, 2010, v. 42, n. 4, p. 374, doi. 10.1007/s11223-010-9226-0
- Zanin, A. E.;
- Zinkovskii, A. P.;
- Sheremet'ev, A. V.
- Article
46
- Strength of Materials, 2009, v. 41, n. 6, p. 699, doi. 10.1007/s11223-009-9176-6
- Article
47
- Strength of Materials, 2009, v. 41, n. 6, p. 593, doi. 10.1007/s11223-009-9175-7
- Margolin, B.;
- Kursevich, I.;
- Sorokin, A.;
- Lapin, A.;
- Kokhonov, V.;
- Neustroev, V.
- Article
48
- Strength of Materials, 2009, v. 41, n. 5, p. 570, doi. 10.1007/s11223-009-9148-x
- Article
49
- Russian Journal of Nondestructive Testing, 2020, v. 56, n. 2, p. 119, doi. 10.1134/S1061830920020035
- Article
50
- Measurement Techniques, 2018, v. 60, n. 11, p. 1148, doi. 10.1007/s11018-018-1332-6
- Vashchuk, S. P.;
- Slobodyan, S. M.;
- Vashchuk, D. S.
- Article