Works about RELIABILITY of electronics

Results: 66

Analytical Model for Evaluating the Reliability of Vias and Plated Through-Hole Pads on PCBs.

Published in:

Inventions (2411-5134), 2023, v. 8, n. 3, p. 77, doi. 10.3390/inventions8030077

By:

Korobkov, Maksim A.;
Vasilyev, Fedor V.;
Khomutskaya, Olga V.

Publication type:

Article

On-State Voltage Measurement Circuit for Condition Monitoring of MOSFETs in Resonant Converters.

Published in:

Electronics (2079-9292), 2024, v. 13, n. 19, p. 3902, doi. 10.3390/electronics13193902

By:

Ventimiglia, Marco;
Scuto, Alfio;
Sorrentino, Giuseppe;
Belverde, Gaetano;
Iannuzzo, Francesco;
Rizzo, Santi Agatino

Publication type:

Article

Simulation Of Reliability For Electronic Means With Regard To Temperature Fields.

Published in:

Reliability: Theory & Applications, 2016, v. 11, n. 4, p. 84

By:

Artyukhova, M.;
Polesskiy, S.;
Linetskiy, B.;
Ivanov, I.

Publication type:

Article

CURRENT APPROACHES TO ANALYSIS OF THE PROJECT RELIABILITY OF ELECTRONIC DEVICES OF CYCLIC USE.

Published in:

Reliability: Theory & Applications, 2015, v. 10, n. 3, p. 20

By:

Artyukhova, M.;
Polesskiy, S.;
Zhadnov, V.

Publication type:

Article

The U.S. Army Material Systems Analysis Activity, AMSAA, promotes reliability methodology and tool development.

Published in:: Quality & Reliability Engineering International, 1995, v. 11, n. 3, p. 216
Publication type:: Article

CECC Introduces Process Approval.

Published in:: Quality & Reliability Engineering International, 1993, v. 9, n. 5, p. 459
Publication type:: Article

INFLUENCE OF QUALITY OF MANUFACTURE ON ELECTRONIC EQUIPMENT AND SYSTEM RELIABILITY.

Published in:

Quality & Reliability Engineering International, 1987, v. 3, n. 3, p. 195, doi. 10.1002/qre.4680030310

By:

Ender, Urs;
Gerling, Wolfgang

Publication type:

Article

U.K. Defence Standard on Reliability Prediction Updated.

Published in:: Quality & Reliability Engineering International, 1985, v. 1, n. 3, p. 209
Publication type:: Article

Reliability Prediction for Electronic Systems.

Published in:: Quality & Reliability Engineering International, 1985, v. 1, n. 3, p. 209
Publication type:: Article

Electronic Reliability Analysis under Radiation Environment.

Published in:

Sensors & Materials, 2022, v. 34, n. 3, Part 3, p. 1119, doi. 10.18494/SAM.2021.3486

By:

Cher Ming Tan;
Pandey, Vimal Kant;
Yueh Chiang;
Tsung Ping Lee

Publication type:

Article

The Reliability of SAC305 Individual Solder Joints during Creep–Fatigue Conditions at Room Temperature.

Published in:

Crystals (2073-4352), 2022, v. 12, n. 9, p. N.PAG, doi. 10.3390/cryst12091306

By:

Abueed, Mohammed;
Al Athamneh, Raed;
Tanash, Moayad;
Hamasha, Sa'd

Publication type:

Article

Assessment of AF4 Parylene Cohesion/Adhesion on Si and SiO 2 Substrates by Means of Pull-Off Energy.

Published in:

Coatings (2079-6412), 2023, v. 13, n. 2, p. 237, doi. 10.3390/coatings13020237

By:

Sinani, Taulant;
Solonenko, Dmytro;
Miskovic, Goran

Publication type:

Article

Reliability and thermal fatigue life prediction of solder joints for advanced automotive microelectronics.

Published in:

Journal of Mechanical Science & Technology, 2021, v. 35, n. 8, p. 3633, doi. 10.1007/s12206-021-0734-6

By:

Gao, Jiachen;
Kwak, Jae B.

Publication type:

Article

Interface energy-driven indium whisker growth on ceramic substrates.

Published in:

Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 12, p. 16881, doi. 10.1007/s10854-021-06250-5

By:

Li, Shuai;
Liu, Yushuang;
Zhang, Peigen;
Zhang, Yan;
Lu, Chengjie;
Pan, Long;
Ding, Jianxiang;
Sun, Zhengming

Publication type:

Article

Threshold voltage instability of SiC MOSFETs under very‐high temperature and wide gate bias.

Published in:

IET Power Electronics (Wiley-Blackwell), 2024, v. 17, n. 15, p. 2393, doi. 10.1049/pel2.12786

By:

Chen, Cong;
Cai, Yumeng;
Sun, Peng;
Zhao, Zhibin

Publication type:

Article

Reliability of NAND Flash Memories: Planar Cells and Emerging Issues in 3D Devices.

Published in:

Computers (2073-431X), 2017, v. 6, n. 2, p. 16, doi. 10.3390/computers6020016

By:

Spinelli, Alessandro S.;
Compagnoni, Christian Monzio;
Lacaita, Andrea L.

Publication type:

Article

Coherence and reliability of a wearable inertial measurement unit for measuring postural sway.

Published in:

BMC Research Notes, 2019, v. 12, n. 1, p. N.PAG, doi. 10.1186/s13104-019-4238-8

By:

Ekvall Hansson, Eva;
Tornberg, Åsa

Publication type:

Article

Validity and reliability of the Newtest Powertimer 300-series® testing system.

Published in:

Journal of Sports Sciences, 2009, v. 27, n. 1, p. 77, doi. 10.1080/02640410802448723

By:

Enoksen, Eystein;
Tønnessen, Espen;
Shalfawi, Shaher

Publication type:

Article

Editorial for Special Issue on Reliability Analysis of Electrotechnical Devices.

Published in:

Applied Sciences (2076-3417), 2022, v. 12, n. 8, p. 4086, doi. 10.3390/app12084086

By:

Tan, Cher-Ming

Publication type:

Article

A PSO-based optimum consumer incentive policy for WEEE incorporating reliability of components.

Published in:

International Journal of Production Research, 2012, v. 50, n. 16, p. 4372, doi. 10.1080/00207543.2011.590538

By:

Agarwal, Gaurav;
Barari, Sikhar;
Tiwari, M.K.

Publication type:

Article

A SHORT ANALYSIS OF THE OF THE SMARTPHONES RELIABILITY.

Published in:

Fiability & Durability / Fiabilitate si Durabilitate, 2017, n. 1, p. 126

By:

PARIS, Adrian Stere

Publication type:

Article

Process Optimization of Additively Manufactured Conformal Temperature and Humidity Sensor for High-Temperature Applications.

Published in:

Journal of Microelectronic & Electronic Packaging, 2025, v. 22, n. 1, p. 13, doi. 10.4071/001c.133286

By:

Lamport, Emily;
Avuthu, Sai G. R.;
Si Chen;
Mapkar, Javed;
Akyurtlu, Alkim

Publication type:

Article

High‐Density Post‐Perovskite for Ultra‐Sensitive Hard X‐Ray Detection.

Published in:

Angewandte Chemie, 2025, v. 137, n. 19, p. 1, doi. 10.1002/ange.202425448

By:

Xia, Mengling;
Li, Yuzhu;
Li, Chenxing;
Xu, Yinsheng;
Niu, Guangda

Publication type:

Article

High‐Temperature Hybridized Copper–Boron Nitride Materials from Additive Manufacturing.

Published in:

Advanced Engineering Materials, 2023, v. 25, n. 3, p. 1, doi. 10.1002/adem.202201056

By:

Sheng, Aaron;
Khuje, Saurabh;
Yu, Jian;
Zhuang, Cheng-Gang;
Ren, Shenqiang

Publication type:

Article

Reliability Model for Electronic Devices under Time Varying Voltage.

Published in:

Quality & Reliability Engineering International, 2016, v. 32, n. 4, p. 1295, doi. 10.1002/qre.1867

By:

Méndez González, Luis Carlos;
Rodríguez Borbón, Manuel Iván;
Valles‐Rosales, Delia J.;
Del Valle, Arturo;
Rodriguez, Arnoldo

Publication type:

Article

БАГАТОРІВНЕВІ ГНУЧКІ СИСТЕМИ РОЗПОДІЛУ ЕЛЕКТРИЧНОЇ ЕНЕРГІЇ.

Published in:

Technical Electrodynamics / Tekhnichna Elektrodynamika, 2024, n. 5, p. 63, doi. 10.15407/techned2024.05.063

By:

Жаркін, А. Ф.;
Попов, В. А.;
Ярмолюк, О. С.;
Палачов, С. О.;
Наталич, В. О.

Publication type:

Article

Electrochemical Corrosion of SAC Alloys: A Review.

Published in:

Metals (2075-4701), 2020, v. 10, n. 10, p. 1276, doi. 10.3390/met10101276

By:

Gharaibeh, Ali;
Felhősi, Ilona;
Keresztes, Zsófia;
Harsányi, Gábor;
Illés, Balázs;
Medgyes, Bálint

Publication type:

Article

Industry Updates.

Published in:: Journal of Failure Analysis & Prevention, 2009, v. 9, n. 6, p. 527, doi. 10.1007/s11668-009-9302-6
Publication type:: Article

Image-based impedance spectroscopy for printed electronics.

Published in:

NPJ Flexible Electronics, 2025, v. 9, n. 1, p. 1, doi. 10.1038/s41528-025-00382-y

By:

Choi, Eunsik;
Choi, Suwon;
An, Kunsik;
Kang, Kyung-Tae

Publication type:

Article

Reliability of a phased-mission system with a storage component.

Published in:

Systems Science & Control Engineering, 2018, v. 6, n. 1, p. 279, doi. 10.1080/21642583.2018.1484306

By:

Qiu, Hui;
Yan, Xiangbin;
Ma, Xiaoyang;
Peng, Rui

Publication type:

Article

PHYSICS-OF-FAILURE AND COMPUTER-AIDED SIMULATION FUSION APPROACH WITH A SOFTWARE SYSTEM FOR ELECTRONICS RELIABILITY ANALYSIS.

Published in:

Maintenance & Reliability / Eksploatacja i Niezawodność, 2020, v. 22, n. 2, p. 340, doi. 10.17531/ein.2020.2.17.

By:

Bo SUN;
Yu LI;
Zili WANG;
Zhifeng LI;
Quan XIA;
Yi REN;
Qiang FENG;
Dezhen YANG;
Cheng QIAN

Publication type:

Article

Boundary Layers Defect Diagnosis and Analysis of Through Silicon Via (TSV).

Published in:

International Journal of Performability Engineering, 2019, v. 15, n. 1, p. 97, doi. 10.23940/ijpe.19.01.p10.97106

By:

Yuan Chen;
Peng Zhang;
Kuiliang Xia;
Hongzhong Huang

Publication type:

Article

Synthesis of dispensable PDMS/Al<sub>2</sub>O<sub>3</sub>/GO thermal gap filler and performance comparison with commercial thermal gap fillers for electronics packaging applications.

Published in:

Materials Technology, 2022, v. 37, n. 9, p. 970, doi. 10.1080/10667857.2021.1908788

By:

Kumaresan, Vigneshwarram;
Sreekantan, Srimala;
Devarajan, Mutharasu;
Mohamed, Khairudin

Publication type:

Article

Dedicated channels.

Published in:: Electronics Letters (Wiley-Blackwell), 2018, v. 54, n. 1, p. 3, doi. 10.1049/el.2017.4501
Publication type:: Article

Design Validation and Reliability Assurance of Electronic Systems Using the Next Generation RGT Models.

Published in:

Defence Science Journal, 2023, v. 73, n. 5, p. 594, doi. 10.14429/dsj.73.18798

By:

Basha, Mustaq;
Ware, Nilesh R.

Publication type:

Article

TRAINING CALENDAR.

Published in:

2024

By:

Ring, Rosalinda M.

Publication type:

Calendar

NOTEWORTHY NEWS.

Published in:: Electronic Device Failure Analysis, 2022, v. 24, n. 1, p. 32
Publication type:: Article

TRAINING CALENDAR.

Published in:

Electronic Device Failure Analysis, 2021, v. 23, n. 4, p. 50

By:

Ring, Rosalinda M.

Publication type:

Article

DIRECTORY OF INDEPENDENT FA PROVIDERS.

Published in:

Electronic Device Failure Analysis, 2021, v. 23, n. 4, p. 47

By:

Ring, Rosalinda M.

Publication type:

Article

ESREF 2018.

Published in:: 2018
Publication type:: Proceeding

A low-overhead soft-hard fault-tolerant architecture, design and management scheme for reliable high-performance many-core 3D-NoC systems.

Published in:

Journal of Supercomputing, 2017, v. 73, n. 6, p. 2705, doi. 10.1007/s11227-016-1951-0

By:

Dang, Khanh;
Meyer, Michael;
Okuyama, Yuichi;
Abdallah, Abderazek

Publication type:

Article

Reliability analysis of electronic equipment subjected to shock and vibration – A review.

Published in:

Shock & Vibration, 2009, v. 16, n. 1, p. 45, doi. 10.1155/2009/546053

By:

Amy, Robin Alastair;
Aglietti, Guglielmo S.;
Richardson, Guy

Publication type:

Article

A Study on the Estimation of RIC (Radiation-Induced Conductivity) of Proton Irradiated Polyimide.

Published in:

Polymers (20734360), 2023, v. 15, n. 2, p. 337, doi. 10.3390/polym15020337

By:

Miyaji, Yoshitaka;
Miyake, Hiroaki;
Tanaka, Yasuhiro

Publication type:

Article

Comparative Study for DC-DC Converter Output Bank's Reliability Evaluation Using Prediction Standards MIL-HDBK-217F vs. Telcordia SR-332.

Published in:

Energies (19961073), 2024, v. 17, n. 16, p. 3957, doi. 10.3390/en17163957

By:

Butnicu, Dan

Publication type:

Article

Alternative Solutions for Small Hydropower Plants.

Published in:

Energies (19961073), 2022, v. 15, n. 4, p. 1275, doi. 10.3390/en15041275

By:

Liszka, Damian;
Krzemianowski, Zbigniew;
Węgiel, Tomasz;
Borkowski, Dariusz;
Polniak, Andrzej;
Wawrzykowski, Konrad;
Cebula, Artur

Publication type:

Article

Overview of Control Algorithm Verification Methods in Power Electronics Systems.

Published in:

Energies (19961073), 2021, v. 14, n. 14, p. 4360, doi. 10.3390/en14144360

By:

Szcześniak, Paweł;
Grobelna, Iwona;
Novak, Mateja;
Nyman, Ulrik

Publication type:

Article

THE TEST-TO-TARGET METHODOLOGIES FOR THE RISK ASSESSMENT OF SEMICONDUCTOR RELIABILITY.

Published in:

International Journal of Reliability, Quality & Safety Engineering, 2013, v. 20, n. 4, p. -1, doi. 10.1142/S0218539313500113

By:

KARY CHIEN, WEI-TING;
ATMAN, ZHAO YONG;
CHANG, VENSON;
WU, JEFF

Publication type:

Article

TWO-STAGE DESIGN OF EXPERIMENTS APPROACH FOR PREDICTION OF RELIABILITY OF OPTOCOUPLERS.

Published in:

International Journal of Reliability, Quality & Safety Engineering, 2012, v. 19, n. 2, p. -1, doi. 10.1142/S0218539312500076

By:

THADURI, ADITHYA;
VERMA, A. K.;
VINOD, GOPIKA;
RAJESH, M. G.;
KUMAR, UDAY

Publication type:

Article

Research on Small Square PCB Rogowski Coil Measuring Transient Current in the Power Electronics Devices.

Published in:

Sensors (14248220), 2019, v. 19, n. 19, p. 4176, doi. 10.3390/s19194176

By:

Jiao, Chaoqun;
Zhang, Juan;
Zhao, Zhibin;
Zhang, Zuoming;
Fan, Yuanliang

Publication type:

Article

EXTREMELY RUGGED UHF 600 W LDMOS TRANSISTORS.

Published in:: 2011
Publication type:: Product Review