Works about RELIABILITY of electronics
Results: 61
Threshold voltage instability of SiC MOSFETs under very‐high temperature and wide gate bias.
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- IET Power Electronics (Wiley-Blackwell), 2024, v. 17, n. 15, p. 2393, doi. 10.1049/pel2.12786
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- Publication type:
- Article
Comparative study between sliding mode control and the vector control of a brushless doubly fed reluctance generator based on wind energy conversion systems.
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- Electrical Engineering & Electromechanics, 2022, n. 1, p. 51, doi. 10.20998/2074-272X.2022.1.07
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- Publication type:
- Article
Simulation Of Reliability For Electronic Means With Regard To Temperature Fields.
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- Reliability: Theory & Applications, 2016, v. 11, n. 4, p. 84
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- Publication type:
- Article
CURRENT APPROACHES TO ANALYSIS OF THE PROJECT RELIABILITY OF ELECTRONIC DEVICES OF CYCLIC USE.
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- Reliability: Theory & Applications, 2015, v. 10, n. 3, p. 20
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- Publication type:
- Article
A SHORT ANALYSIS OF THE OF THE SMARTPHONES RELIABILITY.
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- Fiability & Durability / Fiabilitate si Durabilitate, 2017, n. 1, p. 126
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- Article
TRAINING CALENDAR.
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- 2024
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- Publication type:
- Calendar
TRAINING CALENDAR.
- Published in:
- Electronic Device Failure Analysis, 2021, v. 23, n. 4, p. 50
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- Publication type:
- Article
DIRECTORY OF INDEPENDENT FA PROVIDERS.
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- Electronic Device Failure Analysis, 2021, v. 23, n. 4, p. 47
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- Publication type:
- Article
NOTEWORTHY NEWS.
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- Electronic Device Failure Analysis, 2022, v. 24, n. 1, p. 32
- Publication type:
- Article
ESREF 2018.
- Published in:
- 2018
- Publication type:
- Proceeding
EXTREMELY RUGGED UHF 600 W LDMOS TRANSISTORS.
- Published in:
- 2011
- Publication type:
- Product Review
Ensuring a High Quality Digital Device through Design for Testability.
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- Journal of Computing & Information Technology, 2012, v. 20, n. 4, p. 235, doi. 10.2498/cit.1001982
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- Publication type:
- Article
БАГАТОРІВНЕВІ ГНУЧКІ СИСТЕМИ РОЗПОДІЛУ ЕЛЕКТРИЧНОЇ ЕНЕРГІЇ.
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- Technical Electrodynamics / Tekhnichna Elektrodynamika, 2024, n. 5, p. 63, doi. 10.15407/techned2024.05.063
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- Publication type:
- Article
An Introduction to Reversible Latches.
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- Computer Journal, 2008, v. 51, n. 6, p. 700, doi. 10.1093/comjnl/bxm116
- Publication type:
- Article
Research Progress on the Solder Joint Reliability of Electronics Using in Deep Space Exploration.
- Published in:
- Chinese Journal of Mechanical Engineering, 2023, v. 36, n. 1, p. 1, doi. 10.1186/s10033-023-00834-4
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- Publication type:
- Article
Validity and reliability of the Newtest Powertimer 300-series® testing system.
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- Journal of Sports Sciences, 2009, v. 27, n. 1, p. 77, doi. 10.1080/02640410802448723
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- Publication type:
- Article
Radiation Hardness of Flash Memory Fabricated in Deep-Submicron Technology.
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- International Journal of Photoenergy, 2013, p. 1, doi. 10.1155/2013/158792
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- Publication type:
- Article
Synthesis of dispensable PDMS/Al<sub>2</sub>O<sub>3</sub>/GO thermal gap filler and performance comparison with commercial thermal gap fillers for electronics packaging applications.
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- Materials Technology, 2022, v. 37, n. 9, p. 970, doi. 10.1080/10667857.2021.1908788
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- Publication type:
- Article
ESD improvement in P-i-N diode through introducing a lighter and deeper anode junction.
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- International Journal of Nanoelectronics & Materials, 2017, v. 10, n. 2, p. 159
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- Publication type:
- Article
Analysis of reliability for fault tolerant design in NANO CMOS logic circuit.
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- International Journal of Nanoelectronics & Materials, 2017, v. 10, n. 2, p. 123
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- Publication type:
- Article
Reliability analysis of electronic equipment subjected to shock and vibration – A review.
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- Shock & Vibration, 2009, v. 16, n. 1, p. 45, doi. 10.1155/2009/546053
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- Publication type:
- Article
Comparative Study for DC-DC Converter Output Bank's Reliability Evaluation Using Prediction Standards MIL-HDBK-217F vs. Telcordia SR-332.
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- Energies (19961073), 2024, v. 17, n. 16, p. 3957, doi. 10.3390/en17163957
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- Publication type:
- Article
Alternative Solutions for Small Hydropower Plants.
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- Energies (19961073), 2022, v. 15, n. 4, p. 1275, doi. 10.3390/en15041275
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- Publication type:
- Article
Overview of Control Algorithm Verification Methods in Power Electronics Systems.
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- Energies (19961073), 2021, v. 14, n. 14, p. 4360, doi. 10.3390/en14144360
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- Publication type:
- Article
Design Validation and Reliability Assurance of Electronic Systems Using the Next Generation RGT Models.
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- Defence Science Journal, 2023, v. 73, n. 5, p. 594, doi. 10.14429/dsj.73.18798
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- Publication type:
- Article
Interface energy-driven indium whisker growth on ceramic substrates.
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- Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 12, p. 16881, doi. 10.1007/s10854-021-06250-5
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- Publication type:
- Article
Reliability Model for Electronic Devices under Time Varying Voltage.
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- Quality & Reliability Engineering International, 2016, v. 32, n. 4, p. 1295, doi. 10.1002/qre.1867
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- Publication type:
- Article
The U.S. Army Material Systems Analysis Activity, AMSAA, promotes reliability methodology and tool development.
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- Quality & Reliability Engineering International, 1995, v. 11, n. 3, p. 216
- Publication type:
- Article
CECC Introduces Process Approval.
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- Quality & Reliability Engineering International, 1993, v. 9, n. 5, p. 459
- Publication type:
- Article
INFLUENCE OF QUALITY OF MANUFACTURE ON ELECTRONIC EQUIPMENT AND SYSTEM RELIABILITY.
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- Quality & Reliability Engineering International, 1987, v. 3, n. 3, p. 195, doi. 10.1002/qre.4680030310
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- Publication type:
- Article
U.K. Defence Standard on Reliability Prediction Updated.
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- Quality & Reliability Engineering International, 1985, v. 1, n. 3, p. 209
- Publication type:
- Article
Reliability Prediction for Electronic Systems.
- Published in:
- Quality & Reliability Engineering International, 1985, v. 1, n. 3, p. 209
- Publication type:
- Article
An Investigation of the Indentation Elastic Modulus for Metal Films on Flexible Substrates Considering the Substrate Effect.
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- Materials (1996-1944), 2025, v. 18, n. 1, p. 154, doi. 10.3390/ma18010154
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- Publication type:
- Article
Influence of Solder Mask on Electrochemical Migration on Printed Circuit Boards.
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- Materials (1996-1944), 2024, v. 17, n. 17, p. 4242, doi. 10.3390/ma17174242
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- Publication type:
- Article
Boundary Layers Defect Diagnosis and Analysis of Through Silicon Via (TSV).
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- International Journal of Performability Engineering, 2019, v. 15, n. 1, p. 97, doi. 10.23940/ijpe.19.01.p10.97106
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- Publication type:
- Article
Industry Updates.
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- Journal of Failure Analysis & Prevention, 2009, v. 9, n. 6, p. 527, doi. 10.1007/s11668-009-9302-6
- Publication type:
- Article
A Methodology to Estimate Single-Event Effects Induced by Low-Energy Protons.
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- Eng, 2024, v. 5, n. 1, p. 319, doi. 10.3390/eng5010017
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- Publication type:
- Article
Dedicated channels.
- Published in:
- Electronics Letters (Wiley-Blackwell), 2018, v. 54, n. 1, p. 3, doi. 10.1049/el.2017.4501
- Publication type:
- Article
Reliability of a phased-mission system with a storage component.
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- Systems Science & Control Engineering, 2018, v. 6, n. 1, p. 279, doi. 10.1080/21642583.2018.1484306
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- Publication type:
- Article
The Reliability of SAC305 Individual Solder Joints during Creep–Fatigue Conditions at Room Temperature.
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- Crystals (2073-4352), 2022, v. 12, n. 9, p. N.PAG, doi. 10.3390/cryst12091306
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- Publication type:
- Article
Assessment of AF4 Parylene Cohesion/Adhesion on Si and SiO 2 Substrates by Means of Pull-Off Energy.
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- Coatings (2079-6412), 2023, v. 13, n. 2, p. 237, doi. 10.3390/coatings13020237
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- Publication type:
- Article
A Study on the Estimation of RIC (Radiation-Induced Conductivity) of Proton Irradiated Polyimide.
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- Polymers (20734360), 2023, v. 15, n. 2, p. 337, doi. 10.3390/polym15020337
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- Publication type:
- Article
Optimal Location of Sectionners and Distributed Generation Resources to Improve Reliability in Distribution Networks.
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- Mathematical Modelling of Engineering Problems, 2021, v. 8, n. 2, p. 165, doi. 10.18280/mmep.080201
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- Publication type:
- Article
Electronic Reliability Analysis under Radiation Environment.
- Published in:
- Sensors & Materials, 2022, v. 34, n. 3, Part 3, p. 1119, doi. 10.18494/SAM.2021.3486
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- Publication type:
- Article
Electrochemical Corrosion of SAC Alloys: A Review.
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- Metals (2075-4701), 2020, v. 10, n. 10, p. 1276, doi. 10.3390/met10101276
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- Publication type:
- Article
Bending Setups for Reliability Investigation of Flexible Electronics.
- Published in:
- Micromachines, 2021, v. 12, n. 1, p. 78, doi. 10.3390/mi12010078
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- Publication type:
- Article
On-State Voltage Measurement Circuit for Condition Monitoring of MOSFETs in Resonant Converters.
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- Electronics (2079-9292), 2024, v. 13, n. 19, p. 3902, doi. 10.3390/electronics13193902
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- Publication type:
- Article
Editorial for Special Issue on Reliability Analysis of Electrotechnical Devices.
- Published in:
- Applied Sciences (2076-3417), 2022, v. 12, n. 8, p. 4086, doi. 10.3390/app12084086
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- Publication type:
- Article
Reliability and thermal fatigue life prediction of solder joints for advanced automotive microelectronics.
- Published in:
- Journal of Mechanical Science & Technology, 2021, v. 35, n. 8, p. 3633, doi. 10.1007/s12206-021-0734-6
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- Publication type:
- Article
Research on Small Square PCB Rogowski Coil Measuring Transient Current in the Power Electronics Devices.
- Published in:
- Sensors (14248220), 2019, v. 19, n. 19, p. 4176, doi. 10.3390/s19194176
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- Publication type:
- Article