Risk Management for Commercial‐Off‐The‐Shelf Parts Based Space Hardware.
- Published in:
- Systems Engineering, 2025, v. 28, n. 3, p. 374, doi. 10.1002/sys.21797
- By:
- Publication type:
- Article
Works about RELIABILITY in engineering
Results: 5000
1
2
Stratum Corneum Hydration Measurements with a Bluetooth Wireless Probe: A Real-Life Study at Home Compared to Measurements under Laboratory Conditions.
- Published in:
- Skin Pharmacology & Physiology, 2024, v. 37, n. 1-3, p. 40, doi. 10.1159/000539411
- By:
- Publication type:
- Article
3
The Reliability of Contraceptive Discontinuation Reporting in Burkina Faso, Kenya, and Uganda.
- Published in:
- Studies in Family Planning, 2024, v. 55, n. 4, p. 333, doi. 10.1111/sifp.12272
- By:
- Publication type:
- Article
4
Seeking the Real Reliability: Why the Traditional Estimators of Reliability Usually Fail in Achievement Testing and Why the Deflation-Corrected Coefficients Could Be Better Options.
- Published in:
- Practical Assessment, Research & Evaluation, 2023, v. 28, p. 1
- By:
- Publication type:
- Article
5
How to obtain the most error-free estimate of reliability? Eight Sources of Deflation in the Estimates of Reliability to Avoid.
- Published in:
- Practical Assessment, Research & Evaluation, 2022, v. 27, p. 1
- By:
- Publication type:
- Article
6
THE EFFECTS OF LEARNING BY DOING ON NUCLEAR PLANT OPERATING RELIABILITY.
- Published in:
- Review of Economics & Statistics, 1979, v. 61, n. 2, p. 161, doi. 10.2307/1924583
- By:
- Publication type:
- Article
7
Practical Reliability Engineering - Fifth edition.
- Published in:
- 2012
- By:
- Publication type:
- Book Review
8
Adaptive Online Quality Control for Injection-Molding by Monitoring and Controlling Mold Separation.
- Published in:
- Polymer Engineering & Science, 2006, v. 46, n. 5, p. 569, doi. 10.1002/pen.20509
- By:
- Publication type:
- Article
9
Enhancing Slit Die Performance by Optimization of Restrictor Profiles.
- Published in:
- Polymer Engineering & Science, 2003, v. 43, n. 8, p. 1500, doi. 10.1002/pen.10127
- By:
- Publication type:
- Article
10
Reliability Generalization as a Seal of Quality of Substantive Meta-Analyses: The Case of the VIA Inventory of Strengths (VIA-IS) and Their Relationships to Life Satisfaction.
- Published in:
- Psychological Reports, 2019, v. 122, n. 3, p. 1167, doi. 10.1177/0033294118779198
- By:
- Publication type:
- Article
11
Optimisation of DLC deposition parameters for magnetic and reliability properties.
- Published in:
- Surface Engineering, 2015, v. 31, n. 2, p. 90, doi. 10.1179/1743294414Y.0000000290
- By:
- Publication type:
- Article
12
Neutron time bomb.
- Published in:
- Electronics Systems & Software, 2006, v. 4, n. 6, p. 30, doi. 10.1049/ess:20060605
- By:
- Publication type:
- Article
13
If it ain't broken, you're very lucky.
- Published in:
- Electronics Systems & Software, 2005, v. 3, n. 3, p. 12, doi. 10.1049/ess:20050301
- By:
- Publication type:
- Article
14
UNDERSTANDING AND USING OPC FOR MAINTENANCE AND RELIABILITY APPLICATIONS.
- Published in:
- Computing & Control Engineering, 2004, v. 15, n. 1, p. 28, doi. 10.1049/cce:20040106
- By:
- Publication type:
- Article
15
Analysis of the Spectacles Behavior Made by Composite Structures.
- Published in:
- Macromolecular Symposia, 2020, v. 389, n. 1, p. 1, doi. 10.1002/masy.201900102
- By:
- Publication type:
- Article
16
Enhancement of Strain‐Sensing Performance through Gas Phase Incorporation of Siloxane into Thermoplastic Polyurethane‐Conducting Polymer Composite.
- Published in:
- Macromolecular Chemistry & Physics, 2020, v. 221, n. 15, p. 1, doi. 10.1002/macp.202000155
- By:
- Publication type:
- Article
17
One-Step All-Solution-Based Au-GO Core-Shell Nanosphere Active Layers in Nonvolatile ReRAM Devices.
- Published in:
- Advanced Functional Materials, 2017, v. 27, n. 10, p. n/a, doi. 10.1002/adfm.201604604
- By:
- Publication type:
- Article
18
High-performance a-IGZO-based flexible TTFT with stacked dielectric layers via ultrathin high-κ SrTiO<sub>3</sub> buffer layer grown on HfO<sub>2</sub>.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 3, p. 1511, doi. 10.1007/s10854-021-07662-z
- By:
- Publication type:
- Article
19
Morphological, optical, and electrical characterizations and cryogenic reliability tests on AlInGaP red light emitting diodes immersed in liquid nitrogen.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 24, p. 28287, doi. 10.1007/s10854-021-07205-6
- By:
- Publication type:
- Article
20
The reliability assessment of Au–Al bonds using parallel gap resistance microwelding.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 8, p. 6313, doi. 10.1007/s10854-020-03187-z
- By:
- Publication type:
- Article
21
Comparative study on the reliability of SnPbSb solder joint under common thermal cycling and extreme thermal shocking.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 7, p. 5731, doi. 10.1007/s10854-020-03141-z
- By:
- Publication type:
- Article
22
Effect of SDBS on the oxidation reliability of screen-printed Cu circuits.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 4, p. 3035, doi. 10.1007/s10854-019-02847-z
- By:
- Publication type:
- Article
23
Effect of oxygen content on reliability of Au-20Sn solder joints for the chip-level package.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 2, p. 1411, doi. 10.1007/s10854-019-02655-5
- By:
- Publication type:
- Article
24
Improvement of high-temperature thermal aging reliability of Ag–Au joints by modifying Ni/Au surface finish.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 22, p. 20292, doi. 10.1007/s10854-019-02415-5
- By:
- Publication type:
- Article
25
Enhanced thermal reliability of Mn-doped (K, Na)NbO<sub>3</sub>-based piezoelectric ceramics.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 20, p. 18659, doi. 10.1007/s10854-019-02218-8
- By:
- Publication type:
- Article
26
Void fraction of a Sn–Ag–Cu solder joint underneath a chip resistor and its effect on joint strength and thermomechanical reliability.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 17, p. 15889, doi. 10.1007/s10854-019-01935-4
- By:
- Publication type:
- Article
27
Solder interconnects reliability subjected to thermal-vibration coupling loading.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 12, p. 11482, doi. 10.1007/s10854-019-01501-y
- By:
- Publication type:
- Article
28
What could and should be done differently: failure-oriented-accelerated-testing (FOAT) and its role in making an aerospace electronics device into a product.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 4, p. 2939, doi. 10.1007/s10854-017-8224-4
- By:
- Publication type:
- Article
29
Effect of multiple flip-chip assembly on the mechanical reliability of eutectic Au-Sn solder joint.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 9, p. 9941, doi. 10.1007/s10854-016-5063-7
- By:
- Publication type:
- Article
30
Reliability and failure mechanism of copper pillar joints under current stressing.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 10, p. 7690, doi. 10.1007/s10854-015-3410-8
- By:
- Publication type:
- Article
31
Effect of glass phase on solder joint reliability in crystalline silicon photovoltaic modules.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 10, p. 7811, doi. 10.1007/s10854-015-3429-x
- By:
- Publication type:
- Article
32
Analytical bathtub curve with application to electron device reliability.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 9, p. 6633, doi. 10.1007/s10854-015-3263-1
- By:
- Publication type:
- Article
33
Enhancement of mean-time-to-failure of Sn3.0Ag0.5Cu solder bump joint under current stressing via controlling bump shape.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 3, p. 1940, doi. 10.1007/s10854-014-2633-4
- By:
- Publication type:
- Article
34
Reliability of SnAgCu/SnAgCuCe solder joints with different heights for electronic packaging.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 10, p. 4489, doi. 10.1007/s10854-014-2192-8
- By:
- Publication type:
- Article
35
Reliability of lead-free solder joints in CSP device under thermal cycling.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 3, p. 1209, doi. 10.1007/s10854-014-1711-y
- By:
- Publication type:
- Article
36
Corrosion behavior of pure tin deposit under 55 °C/85 % RH reliability test.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 1, p. 317, doi. 10.1007/s10854-013-1588-1
- By:
- Publication type:
- Article
37
Interfacial reactions between electroplated Ni-Zn alloy films and lead-free solders.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2013, v. 24, n. 9, p. 3423, doi. 10.1007/s10854-013-1265-4
- By:
- Publication type:
- Article
38
Effect of TiO nanoparticles on the microstructure and bonding strengths of Sn0.7Cu composite solder BGA packages with immersion Sn surface finish.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 3, p. 681, doi. 10.1007/s10854-011-0471-1
- By:
- Publication type:
- Article
39
Impact of joint materials on the reliability of double-side packaged SiC power devices during high temperature aging.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 9, p. 917, doi. 10.1007/s10854-009-0018-x
- By:
- Publication type:
- Article
40
Assessment of Factors Influencing Thermomechanical Fatigue Behavior of Sn-Based Solder Joints under Severe Service Environments.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 1-3, p. 237
- By:
- Publication type:
- Article
41
Capacity reliability under uncertainty in transportation networks: an optimization framework and stability assessment methodology.
- Published in:
- Fuzzy Optimization & Decision Making, 2022, v. 21, n. 3, p. 479, doi. 10.1007/s10700-021-09374-9
- By:
- Publication type:
- Article
42
Reliability analysis of a k-out-of-n:F system under a linear degradation model with calibrations.
- Published in:
- Annals of the Institute of Statistical Mathematics, 2019, v. 71, n. 3, p. 537, doi. 10.1007/s10463-018-0650-4
- By:
- Publication type:
- Article
43
Fault tolerant distributed portfolio optimization in smart grids.
- Published in:
- International Journal of Robust & Nonlinear Control, 2014, v. 24, n. 8-9, p. 1317, doi. 10.1002/rnc.3142
- By:
- Publication type:
- Article
44
Microbiomes of China's Space Station During Assembly, Integration, and Test Operations.
- Published in:
- Microbial Ecology, 2019, v. 78, n. 3, p. 631, doi. 10.1007/s00248-019-01344-4
- By:
- Publication type:
- Article
45
Enhanced positioning accuracy and stability in servo mechanisms using a rack-drive dual-motor turret system with auto-tune control.
- Published in:
- International Journal of Advanced Manufacturing Technology, 2025, v. 137, n. 3, p. 1305, doi. 10.1007/s00170-025-15254-y
- By:
- Publication type:
- Article
46
Resilient machine learning for steel surface defect detection based on lightweight convolution.
- Published in:
- International Journal of Advanced Manufacturing Technology, 2024, v. 134, n. 9/10, p. 4639, doi. 10.1007/s00170-024-14403-z
- By:
- Publication type:
- Article
47
Influence of post-processing milling conditions on the machinability and residual stresses evolution of LPBF 18Ni300 maraging steel.
- Published in:
- International Journal of Advanced Manufacturing Technology, 2023, v. 127, n. 5/6, p. 2287, doi. 10.1007/s00170-023-11492-0
- By:
- Publication type:
- Article
48
A kinematic precision reliability evaluation method for rotor-bearing systems considering multi-source wear degradations and random errors.
- Published in:
- International Journal of Advanced Manufacturing Technology, 2023, v. 124, n. 11/12, p. 4159, doi. 10.1007/s00170-022-09383-x
- By:
- Publication type:
- Article
49
A hierarchical evaluation index system for FMS reliability considering coupling relations between system elements.
- Published in:
- International Journal of Advanced Manufacturing Technology, 2023, v. 124, n. 11/12, p. 3737, doi. 10.1007/s00170-021-07648-5
- By:
- Publication type:
- Article
50
A study on overall line efficiency (OLE) centered production line maintenance prioritization considering equipment operational reliability.
- Published in:
- International Journal of Advanced Manufacturing Technology, 2023, v. 124, n. 11/12, p. 3783, doi. 10.1007/s00170-021-07547-9
- By:
- Publication type:
- Article