Works matching DE "REFLOW soldering"

Results: 28

All-round suppression of Cu6Sn5 growth in Sn/Cu joints by utilizing TiO2 nanoparticles.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 18, p. 15966, doi. 10.1007/s10854-018-9682-z

By:

Shang, Shengyan;
Kunwar, Anil;
Yao, Jinye;
Wang, Yunpeng;
Zhao, Ning;
Huang, Mingliang;
Ma, Haitao

Publication type:

Article

A new fabrication process of TGV substrate with silicon vertical feedthroughs using double sided glass in silicon reflow process.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 4, p. 3917, doi. 10.1007/s10854-016-6005-0

By:

Li, Wenyin;
Xiao, Dingbang;
Wu, Xuezhong;
Hou, Zhanqiang;
Chen, Zhihua;
Wang, Xinghua;
Zhou, Jian

Publication type:

Article

Influence of latent heat released from solder joints II: PCB deformation during reflow and pad cratering defects.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 1, p. 1070, doi. 10.1007/s10854-016-5630-y

By:

Dušek, Karel;
Rudajevová, Alexandra

Publication type:

Article

Effect of multiple flip-chip assembly on the mechanical reliability of eutectic Au-Sn solder joint.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 9, p. 9941, doi. 10.1007/s10854-016-5063-7

By:

Chu, Kunmo;
Park, Sunghoon;
Lee, Changseung;
Sohn, Yoonchul

Publication type:

Article

Influence of protective atmosphere on the solderability and reliability of OSP-based solder joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 5, p. 4898, doi. 10.1007/s10854-016-4373-0

By:

Tao, Yeqing;
Ding, Dongyan;
Li, Ting;
Guo, Jason;
Yu, Yunhong

Publication type:

Article

Influence of latent heat released from solder joints on the reflow temperature profile.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 1, p. 543, doi. 10.1007/s10854-015-3787-4

By:

Dušek, K.;
Rudajevová, A.;
Plaček, M.

Publication type:

Article

Diffusion wave model and growth kinetics of interfacial intermetallic compounds in Sn-3.0Ag-0.5Cu-xTiO solder joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 5, p. 3196, doi. 10.1007/s10854-015-2817-6

By:

Tang, Y.;
Li, G.;
Luo, S.;
Wang, K.;
Zhou, B.

Publication type:

Article

Interfacial reaction and mechanical properties between low melting temperature Sn-58Bi solder and various surface finishes during reflow reactions.

Published in:

Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 3, p. 1649, doi. 10.1007/s10854-014-2589-4

By:

Lee, Sang-Min;
Yoon, Jeong-Won;
Jung, Seung-Boo

Publication type:

Article

Interfacial microstructure and hardness of nickel (Ni) nanoparticle-doped tin-silver-copper (Sn-Ag-Cu) solders on immersion silver (Ag)-plated copper (Cu) substrates.

Published in:

Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 9, p. 4012, doi. 10.1007/s10854-014-2123-8

By:

Fouzder, Tama;
Li, Qingqian;
Chan, Y.;
Chan, Daniel

Publication type:

Article

Formation of Sn-Bi solder alloys by sequential electrodeposition and reflow.

Published in:

Journal of Materials Science: Materials in Electronics, 2013, v. 24, n. 6, p. 2052, doi. 10.1007/s10854-012-1055-4

By:

Goh, Yingxin;
Lee, Seen;
Haseeb, A.

Publication type:

Article

Microstructures and Mechanical Properties of the Sn58wt.%Bi Composite Solders with Sn Decorated MWCNT Particles.

Published in:

Journal of Electronic Materials, 2019, v. 48, n. 3, p. 1746, doi. 10.1007/s11664-018-06882-0

By:

Park, Hyun-Joon;
Lee, Choong-Jae;
Min, Kyung Deuk;
Jung, Seung-Boo

Publication type:

Article

Effects of Solder Volume and Reflow Conditions on Self-Alignment Accuracy for Fan-Out Package Applications.

Published in:

Journal of Electronic Materials, 2018, v. 47, n. 1, p. 133, doi. 10.1007/s11664-017-5883-0

By:

Park, Hwan-Pil;
Seo, Gwancheol;
Kim, Sungchul;
Kim, Young-Ho

Publication type:

Article

Effect of Reflow Time on Wetting Behavior, Microstructure Evolution, and Joint Strength of Sn-2.5Ag-0.5Cu Solder on Bare and Nickel-Coated Copper Substrates.

Published in:

Journal of Electronic Materials, 2016, v. 45, n. 7, p. 3744, doi. 10.1007/s11664-016-4504-7

By:

Sona, Mrunali;
Prabhu, K.

Publication type:

Article

Thermal Stress of Surface Oxide Layer on Micro Solder Bumps During Reflow.

Published in:

Journal of Electronic Materials, 2015, v. 44, n. 2, p. 744, doi. 10.1007/s11664-014-3528-0

By:

Key Chung, C.;
Zhu, Z.;
Kao, C.

Publication type:

Article

Interfacial reaction between SAC305 lead-free solders and ENImAg surface finish and bare copper.

Published in:

Materialwissenschaft und Werkstoffechnik, 2017, v. 48, n. 3/4, p. 235, doi. 10.1002/mawe.201600764

By:

Adawiyah, M.A. Rabiatul;
Azlina, O. Saliza

Publication type:

Article

Competitive growth of Cu3Sn and Cu6Sn5 at Sn/Cu interface during various multi-reflow processes.

Published in:

Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 18, p. 22771, doi. 10.1007/s10854-021-06711-x

By:

Shang, Min;
Dong, Chong;
Yao, Jinye;
Wang, Chen;
Ma, Haoran;
Ma, Haitao;
Wang, Yunpeng

Publication type:

Article

Study on liquid-filled structure target with shaped charge vertical penetration.

Published in:

Defence Technology, 2019, v. 15, n. 6, p. 861, doi. 10.1016/j.dt.2019.05.003

By:

Min Guo;
Xu-dong Zu;
Xiao-jun Shen;
Zheng-xiang Huang

Publication type:

Article

Process enabling highly accurate die position for fan-out package applications.

Published in:

Electronics Letters (Wiley-Blackwell), 2017, v. 53, n. 12, p. 810, doi. 10.1049/el.2017.0357

By:

Park, H.-P.;
Kim, Y.-H.

Publication type:

Article

Cu6Sn5 Whiskers Precipitated in Sn3.0Ag0.5Cu/Cu Interconnection in Concentrator Silicon Solar Cells Solder Layer.

Published in:

Materials (1996-1944), 2017, v. 10, n. 4, p. 327, doi. 10.3390/ma10040327

By:

Liang Zhang;
Zhi-quan Liu;
Fan Yang;
Su-juan Zhong

Publication type:

Article

Intermetallic Layer Growth Kinetics in Sn-Ag-Cu System using Diffusion Multiple and Reflow Techniques.

Published in:

Advanced Engineering Materials, 2015, v. 17, n. 4, p. 512, doi. 10.1002/adem.201400226

By:

Pawełkiewicz, Magdalena;
Danielewski, Marek;
Janczak‐Rusch, Jolanta

Publication type:

Article

Millimeter-Wave Substrate Integrated Waveguide Using Micromachined Tungsten-Coated Through Glass Silicon Via Structures.

Published in:

Micromachines, 2018, v. 9, n. 4, p. 172, doi. 10.3390/mi9040172

By:

Hyeon, Ik-Jae;
Baek, Chang-Wook

Publication type:

Article

Fabrication of 150‐nm AlGaN/GaN field‐plated High Electron Mobility Transistors using i‐line stepper.

Published in:

Electronics Letters (Wiley-Blackwell), 2021, v. 57, n. 24, p. 948, doi. 10.1049/ell2.12303

By:

Ando, Yuji;
Makisako, Ryutaro;
Takahashi, Hidemasa;
Wakejima, Akio;
Suda, Jun

Publication type:

Article

DEVELOPMENT OF A CLOSED-LOOP DIAGNOSIS SYSTEM FOR REFLOW SOLDERING USING NEURAL NETWORKS AND SUPPORT VECTOR REGRESSION.

Published in:

International Journal of Industrial Engineering, 2014, v. 21, n. 1, p. 19

By:

Tsung-Nan Tsai;
Chiu-Wen Tsai

Publication type:

Article

Heterogeneous Integration on 2.3D Hybrid Substrate Using Solder Joint and Underfill.

Published in:

Journal of Microelectronic & Electronic Packaging, 2022, v. 19, n. 1, p. 8, doi. 10.4071/imaps.1546248

By:

Tsun-Sheng Chou, Ricky;
Lau, John H.;
Chang-Fu Chen, Gary;
Yu-Cheng Huang, Jones;
Channing Cheng-Lin Yang;
Hsing-Ning Liu;
Tzyy-Jang Tseng

Publication type:

Article

Analysis of the quality of the welding process in the exchange of component of BGA technology.

Published in:

2016

By:

Marques-Costa, Robson;
da Silva-Vieira, Antonio;
Pereira-Lopes, Raimundo Valdan;
Cabral-Leite, Jandecy;
Tetsuo-Fujiyama, Roberto

Publication type:

Case Study

Preparation and reflow soldering characteristics of solder paste containing submicron Sn powders synthesised via chemical reduction.

Published in:

Research on Chemical Intermediates, 2014, v. 40, n. 7, p. 2463, doi. 10.1007/s11164-014-1655-0

By:

Chee, Sang-Soo;
Lee, Jong-Hyun

Publication type:

Article

Transformation of SAC (Sn3.0Ag0.5Cu) nanoparticles into bulk material during melting process with large melting-point depression.

Published in:

Micro & Nano Letters (Wiley-Blackwell), 2016, v. 11, n. 12, p. 840, doi. 10.1049/mnl.2016.0361

By:

Hyun Jin Kim;
Seok Pil Jang;
Jong-Hyun Lee;
Yong-Jun Park

Publication type:

Article

Effects of Reflow Time on the Interfacial Microstructure and Shear Behavior of the SAC/FeNi-Cu Joint.

Published in:

Metals (2075-4701), 2016, v. 6, n. 5, p. 109, doi. 10.3390/met6050109

By:

Yunxia Chen;
Xulei Wu;
Xiaojing Wang;
Hai Huang

Publication type:

Article

Works matching DE "REFLOW soldering"

All-round suppression of Cu<sub>6</sub>Sn<sub>5</sub> growth in Sn/Cu joints by utilizing TiO<sub>2</sub> nanoparticles.

A new fabrication process of TGV substrate with silicon vertical feedthroughs using double sided glass in silicon reflow process.

Influence of latent heat released from solder joints II: PCB deformation during reflow and pad cratering defects.

Effect of multiple flip-chip assembly on the mechanical reliability of eutectic Au-Sn solder joint.

Influence of protective atmosphere on the solderability and reliability of OSP-based solder joints.

Influence of latent heat released from solder joints on the reflow temperature profile.

Diffusion wave model and growth kinetics of interfacial intermetallic compounds in Sn-3.0Ag-0.5Cu-xTiO solder joints.

Interfacial reaction and mechanical properties between low melting temperature Sn-58Bi solder and various surface finishes during reflow reactions.

Interfacial microstructure and hardness of nickel (Ni) nanoparticle-doped tin-silver-copper (Sn-Ag-Cu) solders on immersion silver (Ag)-plated copper (Cu) substrates.

Formation of Sn-Bi solder alloys by sequential electrodeposition and reflow.

Microstructures and Mechanical Properties of the Sn58wt.%Bi Composite Solders with Sn Decorated MWCNT Particles.

Effects of Solder Volume and Reflow Conditions on Self-Alignment Accuracy for Fan-Out Package Applications.

Effect of Reflow Time on Wetting Behavior, Microstructure Evolution, and Joint Strength of Sn-2.5Ag-0.5Cu Solder on Bare and Nickel-Coated Copper Substrates.

Thermal Stress of Surface Oxide Layer on Micro Solder Bumps During Reflow.

Interfacial reaction between SAC305 lead-free solders and ENImAg surface finish and bare copper.

Competitive growth of Cu<sub>3</sub>Sn and Cu<sub>6</sub>Sn<sub>5</sub> at Sn/Cu interface during various multi-reflow processes.

Study on liquid-filled structure target with shaped charge vertical penetration.

Process enabling highly accurate die position for fan-out package applications.

Cu<sub>6</sub>Sn<sub>5</sub> Whiskers Precipitated in Sn3.0Ag0.5Cu/Cu Interconnection in Concentrator Silicon Solar Cells Solder Layer.

Intermetallic Layer Growth Kinetics in Sn-Ag-Cu System using Diffusion Multiple and Reflow Techniques.

Millimeter-Wave Substrate Integrated Waveguide Using Micromachined Tungsten-Coated Through Glass Silicon Via Structures.

Fabrication of 150‐nm AlGaN/GaN field‐plated High Electron Mobility Transistors using i‐line stepper.

DEVELOPMENT OF A CLOSED-LOOP DIAGNOSIS SYSTEM FOR REFLOW SOLDERING USING NEURAL NETWORKS AND SUPPORT VECTOR REGRESSION.

Heterogeneous Integration on 2.3D Hybrid Substrate Using Solder Joint and Underfill.

Analysis of the quality of the welding process in the exchange of component of BGA technology.

Preparation and reflow soldering characteristics of solder paste containing submicron Sn powders synthesised via chemical reduction.

Transformation of SAC (Sn3.0Ag0.5Cu) nanoparticles into bulk material during melting process with large melting-point depression.

Effects of Reflow Time on the Interfacial Microstructure and Shear Behavior of the SAC/FeNi-Cu Joint.