Works about RADIO frequency
1
- Chinese Journal of Network & Information Security, 2025, v. 11, n. 2, p. 152, doi. 10.11959/j.issn.2096-109x.2025024
- Article
2
- Journal of Engineering Science & Technology Review, 2025, v. 18, n. 2, p. 140
- Mudavath, Mahesh;
- Rani, S. Sandhya;
- Shirisha, Dubbaka;
- Srinu, Banoth
- Article
3
- Applied Sciences (2076-3417), 2025, v. 15, n. 9, p. 4916, doi. 10.3390/app15094916
- Chen, Boqing;
- Yang, Lijun;
- Wu, Meng
- Article
4
- Journal of Pain Research, 2025, v. 18, p. 2203, doi. 10.2147/JPR.S512813
- Shang, Chao;
- Sun, Ning;
- Lv, Zixu;
- Yin, Donghua;
- Feng, Chunlin
- Article
5
- Therapeutics & Clinical Risk Management, 2025, v. 21, p. 575, doi. 10.2147/TCRM.S508522
- Xu, Yan;
- Yin, Yan;
- Yang, Zai-Quan;
- Li, Jing;
- Guo, Li-Na;
- Ma, Chao
- Article
6
- Przegląd Elektrotechniczny, 2025, v. 2025, n. 4, p. 157, doi. 10.15199/48.2025.04.31
- PAKPROM, Jariya;
- SANTALUNAI, Samran;
- SANTALUNAI, Samroeng;
- THONGSOPA, Chanchai;
- CHAROENSIRI, Weerawat;
- JANPANGNGERN, Pisit;
- THOSDEEKORAPHAT, Thanaset;
- KRACHODNOK, Piyaporn;
- SANTALUNAI, Nuchanart;
- CHAIPANYA, Pichaya
- Article
7
- Journal of Electromagnetic Waves & Applications, 2025, v. 39, n. 8, p. 918, doi. 10.1080/09205071.2025.2487506
- Das, Puja;
- Karmakar, Anirban;
- Halimi, Md. Ahsan;
- Bhowmik, Priyansha;
- Huda, Shabana
- Article
8
- Journal of Electromagnetic Waves & Applications, 2025, v. 39, n. 8, p. 849, doi. 10.1080/09205071.2025.2482773
- Singh, Ajay Kumar;
- Ray, K. P.;
- Padhy, B. B.
- Article
9
- Journal of Korean Institute of Electromagnetic Engineering & Science / Han-Guk Jeonjapa Hakoe Nonmunji, 2025, v. 36, n. 3, p. 243, doi. 10.5515/KJKIEES.2025.36.3.243
- 곽준혁;
- 박동욱;
- 김홍희;
- 송승준;
- 전재우;
- 주현준;
- 백동현;
- 김영진;
- 어윤성
- Article
10
- International Journal of Legal Information, 2024, v. 52, n. 1, p. 763, doi. 10.1017/S1759078723001137
- Rusanen, Jere;
- Sethi, Alok;
- Tervo, Nuutti;
- Kiuru, Veeti;
- Rahkonen, Timo;
- Pärssinen, Aarno;
- Aikio, Janne P.
- Article
11
- Biotechnic & Histochemistry, 2011, v. 86, n. 6, p. 404, doi. 10.3109/10520295.2010.517473
- Kreb, DL;
- Bosscha, K;
- Ernst, MF;
- Rutten, MJCM;
- Jager, GJ;
- van Diest, PJ;
- van der Linden, JC
- Article
12
- Climacteric, 2024, v. 27, n. 2, p. 210, doi. 10.1080/13697137.2024.2302425
- Joris, A.;
- Di Pietrantonio, V.;
- Praet, J.;
- Renard, K.;
- Verduyn, A.-C.;
- Buxant, F.;
- Rozenberg, S.
- Article
13
- Surface Engineering, 2021, v. 37, n. 6, p. 795, doi. 10.1080/02670844.2020.1815492
- Li, Z. M.;
- Li, X. N.;
- Cheng, X. T.;
- Hu, Y. L.;
- Zheng, Y. H.;
- Yang, M.;
- Dong, C.
- Article
14
- Surface Engineering, 2019, v. 35, n. 3, p. 227, doi. 10.1080/02670844.2018.1458490
- Sarkar, Satyajit;
- Pradhan, Siddhartha Kumar;
- Jeevitha, M.
- Article
15
- Surface Engineering, 2017, v. 33, n. 8, p. 633, doi. 10.1080/02670844.2017.1292704
- Liu, Eryong;
- Pu, Jibin;
- Zeng, Zhixiang;
- Wang, Yongxin;
- Zhao, Wenjie
- Article
16
- Surface Engineering, 2011, v. 27, n. 5, p. 389, doi. 10.1179/1743294410Y.0000000024
- Article
17
- Surface Engineering, 2010, v. 26, n. 8, p. 596, doi. 10.1179/026708410X12459349720097
- Shah, H. N.;
- Jayaganthan, R.;
- Kaur, D.
- Article
18
- Surface Engineering, 2006, v. 22, n. 5, p. 337, doi. 10.1179/174329406X126771
- Mitchell, S. A.;
- Davidson, M. R.;
- Bradley, R. H.
- Article
19
- Surface Engineering, 2004, v. 20, n. 6, p. 454, doi. 10.1179/026708404X1099
- Kim, B.;
- Park, K. Y.;
- Han, D.
- Article
20
- Surface Engineering, 2004, v. 20, n. 5, p. 391, doi. 10.1179/026708404225016445
- Article
21
- Electronics Systems & Software, 2005, v. 3, n. 3, p. 8
- Article
22
- Journal of Wood Science, 2013, v. 59, n. 2, p. 160, doi. 10.1007/s10086-012-1306-2
- Uzunovic, Adnan;
- Gething, Brad;
- Coelho, Aaron;
- Dale, Angela;
- Janowiak, John;
- Mack, Ron;
- Hoover, Kelli
- Article
23
- Journal of Wood Science, 2010, v. 56, n. 2, p. 95, doi. 10.1007/s10086-009-1079-4
- Liu, Honghai;
- Yang, Lin;
- Cai, Yingchun;
- Sugimori, Masatoshi;
- Hayashi, Kazuo
- Article
24
- Journal of Wood Science, 2007, v. 53, n. 3, p. 258, doi. 10.1007/s10086-006-0844-x
- Kayimbi Tubajika;
- Jonh Jonawiak;
- Ronald Mack;
- Kelli Hoover
- Article
25
- Journal of Wood Science, 2004, v. 50, n. 4, p. 315, doi. 10.1007/s10086-003-0577-z
- Article
26
- Journal of Wood Science, 2004, v. 50, n. 3, p. 209, doi. 10.1007/s10086-003-0559-1
- Article
27
- Macromolecular Symposia, 2025, v. 414, n. 1, p. 1, doi. 10.1002/masy.202400200
- Kumar, Surendra;
- Gupta, Pallavi;
- Rajauriya, Manisha
- Article
28
- Macromolecular Symposia, 2024, v. 413, n. 4, p. 1, doi. 10.1002/masy.202400045
- Nutu, Emil;
- Vintila, Ionut Sebastian;
- Stuparu, Florin;
- Pelin, George;
- Jiga, Gabriel Gheorghe
- Article
29
- Macromolecular Symposia, 2023, v. 407, n. 1, p. 1, doi. 10.1002/masy.202200094
- Article
30
- Chemistry - A European Journal, 2024, v. 30, n. 27, p. 1, doi. 10.1002/chem.202304100
- Xu, Linling;
- Guo, Hui;
- Tao, Jiaqi;
- Zavabeti, Ali;
- Zhou, Yugang;
- Zheng, Youdou;
- Zhang, Rong;
- Chen, Dunjun
- Article
31
- Angewandte Chemie, 2013, v. 125, n. 52, p. 14371, doi. 10.1002/ange.201306086
- Wei, Dacheng;
- Lu, Yunhao;
- Han, Cheng;
- Niu, Tianchao;
- Chen, Wei;
- Wee, Andrew Thye Shen
- Article
32
- Angewandte Chemie, 2013, v. 125, n. 41, p. 10971, doi. 10.1002/ange.201305434
- Long, Dong;
- Marshall, Christopher B.;
- Bouvignies, Guillaume;
- Mazhab ‐ Jafari, Mohammad T.;
- Smith, Matthew J.;
- Ikura, Mitsuhiko;
- Kay, Lewis E.
- Article
33
- Angewandte Chemie, 2013, v. 125, n. 32, p. 8439, doi. 10.1002/ange.201303255
- Xu, Xiang;
- Lee, Jae ‐ Seung;
- Jerschow, Alexej
- Article
34
- Advanced Functional Materials, 2016, v. 26, n. 21, p. 3738, doi. 10.1002/adfm.201600122
- Li, Shandong;
- Li, Qiang;
- Xu, Jie;
- Yan, Shishen;
- Miao, Guo‐Xing;
- Kang, Shishou;
- Dai, Youyong;
- Jiao, Jiqing;
- Lü, Yueguang
- Article
35
- Advanced Functional Materials, 2014, v. 24, n. 25, p. 3846, doi. 10.1002/adfm.201303886
- Huang, Xian;
- Liu, Yuhao;
- Cheng, Huanyu;
- Shin, Woo‐Jung;
- Fan, Jonathan A.;
- Liu, Zhuangjian;
- Lu, Ching‐Jui;
- Kong, Gil‐Woo;
- Chen, Kaile;
- Patnaik, Dwipayan;
- Lee, Sang‐Heon;
- Hage‐Ali, Sami;
- Huang, Yonggang;
- Rogers, John A.
- Article
36
- Journal of Materials Science: Materials in Electronics, 2023, v. 34, n. 5, p. 1, doi. 10.1007/s10854-023-09925-3
- Abreu, R. F.;
- Nobrega, F. A. C.;
- da M. Colares, D.;
- Saturno, S. O.;
- do Nascimento, J. P. C.;
- Abreu, T. O.;
- Ghosh, A.;
- do Carmo, F. F.;
- Silva, M. A. S.;
- Sales, A. J. M.;
- Silva, R. S.;
- Sombra, A. S. B.
- Article
37
- Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 26, p. 20867, doi. 10.1007/s10854-022-08895-2
- Jaouali, M.;
- Nouiri, M.;
- Ihzaz, N.;
- Sagna, A.;
- Mejnoun, K.;
- Zouaoui, M.;
- Bouloufa, A.;
- El Haskouri, J.;
- Djessas, K.;
- El Mir, L.;
- Ayadi, Z. Ben
- Article
38
- Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 21, p. 16977, doi. 10.1007/s10854-022-08576-0
- Sonklin, Thita;
- Munthala, Dhanunjaya;
- Leuasoongnoen, Pimchanok;
- Janphuang, Pattanapong;
- Pojprapai, Soodkhet
- Article
39
- Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 20, p. 16597, doi. 10.1007/s10854-022-08556-4
- Article
40
- Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 20, p. 16136, doi. 10.1007/s10854-022-08504-2
- Usha, K. S.;
- Sivakumar, R.;
- Sanjeeviraja, C.
- Article
41
- Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 19, p. 15546, doi. 10.1007/s10854-022-08460-x
- Li, Yuanjie;
- Ma, Hailong;
- Hu, Wenbo;
- Zhao, Yuqing
- Article
42
- Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 9, p. 7244, doi. 10.1007/s10854-022-07908-4
- Sun, Jiamei;
- Zhao, Man;
- Jiang, Dayong
- Article
43
- Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 8, p. 4764, doi. 10.1007/s10854-021-07666-9
- Xu, Qian;
- Li, Bao-jia;
- Huang, Li-jing;
- Li, Huang;
- Wang, Yong-ying
- Article
44
- Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 22, p. 26631, doi. 10.1007/s10854-021-07040-9
- Trivedi, Harshita;
- Ghorannevis, Zohreh;
- Parmar, Avanish Singh
- Article
45
- Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 21, p. 26126, doi. 10.1007/s10854-021-06341-3
- Liu, Fei;
- Cheng, Li-jin;
- Li, Hao;
- Liu, Shao-jun
- Article
46
- 2021
- Silva, P. H. T.;
- Silva, M. A. S.;
- Sombra, A. S. B.;
- Fechine, P. B. A.
- Correction Notice
47
- Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 14, p. 18628, doi. 10.1007/s10854-021-06332-4
- Silva, P. H. T.;
- Silva, M. A. S.;
- Sombra, A. S. B.;
- Fechine, P. B. A.
- Article
48
- Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 13, p. 17473, doi. 10.1007/s10854-021-06280-z
- Torchynska, T.;
- Macotela, L. G. Vega;
- Polupan, G.;
- Melnichuk, O.;
- Khomenkova, L.;
- Gourbilleau, F.
- Article
49
- Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 4, p. 4885, doi. 10.1007/s10854-020-05228-z
- Xu, Zunping;
- Wang, Jinchuan;
- Chen, Yi
- Article
50
- Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 20, p. 18018, doi. 10.1007/s10854-020-04353-z
- Cynthia, S. R.;
- Sivakumar, R.;
- Sanjeeviraja, C.;
- Gopalakrishnan, C.;
- Jeyadheepan, K.
- Article