Reliability physics behind the QFN state of stress.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 2, p. 2160, doi. 10.1007/s10854-016-5781-x
- By:
- Publication type:
- Article
Works matching DE "QUAD flat packaging"
Results: 5
1
2
Structural Durability of QFN Package Using Three-Point Bending Test.
- Published in:
- International Review of Mechanical Engineering, 2012, v. 6, n. 3, p. 528
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- Publication type:
- Article
3
Heat Sink Induced Thermomechanical Joint Strain in QFN Devices.
- Published in:
- Journal of Microelectronic & Electronic Packaging, 2014, v. 11, n. 2, p. 80, doi. 10.4071/imaps.402
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- Publication type:
- Article
4
A Fully Integrated Dual-Band CMOS Power Amplifier Using a Variable Switched Interstage Matching Network.
- Published in:
- IETE Journal of Research, 2014, v. 60, n. 2, p. 139, doi. 10.1080/03772063.2014.914685
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- Publication type:
- Article
5
The Future of mm-wave Packaging.
- Published in:
- Microwave Journal, 2014, v. 57, n. 2, p. 24
- By:
- Publication type:
- Article