Works matching DE "PRINTED circuits industry"

Results: 239

Effectiveness of acidic deep eutectic solvents in recovery of hazardous base metals from waste printed circuit boards.

Published in:

Environmental Science & Pollution Research, 2025, v. 32, n. 27, p. 16361, doi. 10.1007/s11356-025-36685-w

By:

Oke, Emmanuel Anuoluwapo;
Potgieter, Johannes Herman

Publication type:

Article

Investigation of impurity ions on the influence of copper electrodeposition in through holes of printed circuit board.

Published in:

Transactions of the Institute of Metal Finishing, 2025, v. 103, n. 4, p. 182, doi. 10.1080/00202967.2025.2517442

By:

Chen, Xianming;
He, Wei;
Huang, Benxia;
Cui, Hongbin;
Zhou, Weibin;
Cai, Kaijian;
Wang, Wanjin;
Chen, Guoqin;
Wang, Shouxu;
Chen, Yuanming

Publication type:

Article

A Novel Forecasting Model Based on Support Vector Regression and Bat Meta-Heuristic (Bat-SVR): Case Study in Printed Circuit Board Industry.

Published in:

International Journal of Information Technology & Decision Making, 2015, v. 14, n. 1, p. 195, doi. 10.1142/S0219622014500849

By:

Tavakkoli, Amirmohammad;
Rezaeenour, Jalal;
Hadavandi, Esmaeil

Publication type:

Article

Spectral CT in the World of Electronics: Moving Toward Failure Free Devices.

Published in:

2023

By:

Dewanckele, Jan;
Boone, Marijn;
Van Loo, Denis;
De Boever, Wesley

Publication type:

Abstract

Development of the Digital Site for Chemical Processes in the Manufacturing of Printed Circuit Boards.

Published in:

Inventions (2411-5134), 2021, v. 6, n. 3, p. 1, doi. 10.3390/inventions6030048

By:

Vasilyev, Fedor V.;
Medvedev, Arkadiy M.;
Barakovsky, Fedor A.;
Korobkov, Maksim A.

Publication type:

Article

Study of Optimal Real-time Polymerase Chain Reaction Chip by Comparison of Coating Reflective Materials.

Published in:

Sensors & Materials, 2019, v. 31, n. 2, Part 2, p. 437, doi. 10.18494/SAM.2019.2101

By:

Ji-Soo Hwang;
Bo-Jun Kim;
Jong-Dae Kim;
Yu-Seop Kim;
Hye-Jeong Song;
Chan-Young Park

Publication type:

Article

Towards High Quality PCB Defect Detection Leveraging State-of-the-Art Hybrid Models.

Published in:

International Journal of Advanced Computer Science & Applications, 2024, v. 15, n. 2, p. 459, doi. 10.14569/ijacsa.2024.0150249

By:

Tuan Anh Nguyen;
Hoanh Nguyen

Publication type:

Article

A LOW PROFILE DUAL BAND SLOTTED PATCH ANTENNA ON DIELECTRIC MATERIAL SUBSTRATE.

Published in:

Journal of Applied Global Research, 2013, v. 6, n. 18, p. 12

By:

Islam, M. T.;
Ullah, M. Habib;
Reaz, M. B. I.

Publication type:

Article

Ecologically clean solder based on Sn-Ag-Cu.

Published in:

Welding International, 2011, v. 25, n. 7, p. 531, doi. 10.1080/09507116.2011.554256

By:

Perevezentsev, B.N.;
Krumaev, M.N.

Publication type:

Article

Printed circuit board joining technology for notebook PC and HDD.

Published in:

Welding International, 2008, v. 22, n. 1, p. 44, doi. 10.1080/09507110801936127

By:

Happoya, A.

Publication type:

Article

Optimization Studies on Recovery of Metals from Printed Circuit Board Waste.

Published in:

Bioinorganic Chemistry & Applications, 2018, p. 1, doi. 10.1155/2018/1067512

By:

Sivakumar, P.;
Prabhakaran, D.;
Thirumarimurugan, M.

Publication type:

Article

PROCESS MONITORING IN REAL TIME: EMPIRICAL BAYES APPROACH -- DISCRETE CASE.

Published in:

Quality & Reliability Engineering International, 1991, v. 7, n. 3, p. 123, doi. 10.1002/qre.4680070303

By:

Yousry, M. A.;
Sturm, G. W.;
Feltz, C. J.;
Noorossana, R.

Publication type:

Article

THE ROLE OF SPC IN PRINTED CIRCUIT BOARD MANUFACTURE.

Published in:

Quality & Reliability Engineering International, 1989, v. 5, n. 2, p. 165, doi. 10.1002/qre.4680050211

By:

Manson, M. M.;
Dale, B. G.

Publication type:

Article

An efficient genetic algorithm for setup time minimization in PCB assembly.

Published in:

International Journal of Advanced Manufacturing Technology, 2015, v. 77, n. 5-8, p. 973, doi. 10.1007/s00170-014-6510-3

By:

García-Nájera, Abel;
Brizuela, Carlos;
Martínez-Pérez, Israel

Publication type:

Article

Interaction of cemented carbide micro-drills and printed circuit boards during micro-drilling.

Published in:

International Journal of Advanced Manufacturing Technology, 2015, v. 77, n. 5-8, p. 1305, doi. 10.1007/s00170-014-6520-1

By:

Zheng, Li;
Wang, Cheng;
Qu, Yun;
Song, Yue;
Fu, Lian

Publication type:

Article

Generation of microfeatures on stainless steel by electrochemical micromachining.

Published in:

International Journal of Advanced Manufacturing Technology, 2015, v. 76, n. 1-4, p. 39, doi. 10.1007/s00170-013-5251-z

By:

Ghoshal, B.;
Bhattacharyya, B.

Publication type:

Article

Organizing the nozzle magazine of a gantry-type PCB assembly machine.

Published in:

International Journal of Advanced Manufacturing Technology, 2013, v. 68, n. 5-8, p. 1189, doi. 10.1007/s00170-013-4911-3

By:

Knuutila, Timo;
Suomi, Tomi;
Emet, Stefan;
Johnsson, Mika;
Nevalainen, Olli S.

Publication type:

Article

Misalignment inspection of multilayer PCBs with an automated X-ray machine vision system.

Published in:

International Journal of Advanced Manufacturing Technology, 2010, v. 51, n. 9-12, p. 995, doi. 10.1007/s00170-010-2664-9

By:

Chuang, Shui-Fa;
Chang, Wen-Tung;
Lin, Chih-Cheng;
Tarng, Yeong-Shin

Publication type:

Article

Workload balancing in printed circuit board assembly.

Published in:

International Journal of Advanced Manufacturing Technology, 2010, v. 50, n. 9-12, p. 1175, doi. 10.1007/s00170-010-2558-x

By:

Emet, Stefan;
Knuutila, Timo;
Alhoniemi, Esa;
Maier, Michael;
Johnsson, Mika;
Nevalainen, Olli

Publication type:

Article

Establishing process parameter levels for double-sided PCBs.

Published in:

International Journal of Advanced Manufacturing Technology, 2010, v. 50, n. 9-12, p. 1025, doi. 10.1007/s00170-010-2591-9

By:

Pradhan, Biswabrata

Publication type:

Article

Analysis of sonic waves generated during laser engraving of printed circuits.

Published in:

International Journal of Advanced Manufacturing Technology, 2009, v. 42, n. 1/2, p. 138, doi. 10.1007/s00170-008-1581-7

By:

Gorkič, Aleš;
Kovačič, Drago;
Diaci, Janez

Publication type:

Article

An environmental assessment model applied to printed circuit board manufacturing.

Published in:

International Journal of Advanced Manufacturing Technology, 2007, v. 32, n. 7/8, p. 834, doi. 10.1007/s00170-005-0389-y

By:

Hui, I.

Publication type:

Article

Automatic optical inspection for detecting defects on printed circuit board inner layers.

Published in:

International Journal of Advanced Manufacturing Technology, 2005, v. 25, n. 9/10, p. 940, doi. 10.1007/s00170-004-2299-9

By:

Rau, H.;
Wu, C.-H.

Publication type:

Article

Simulation Analysis of a PCB Factory using Factorial Design – A Case Study.

Published in:

International Journal of Advanced Manufacturing Technology, 2003, v. 21, n. 7, p. 523, doi. 10.1007/s001700300062

By:

F.T.S. Chan;
H.K. Chan

Publication type:

Article

A Novel Approach Using a Two-Dimensional Wavelet Transform in Ball Grid Array (BGA) Substrate Conducting Path Inspections.

Published in:

International Journal of Advanced Manufacturing Technology, 2003, v. 21, n. 3, p. 223

By:

Yeh, C.-H.

Publication type:

Article

AUTOMATED TEMPERATURE AND HUMIDITY CONTROL AND MONITORING SYSTEM FOR IMPROVING THE PERFORMANCE IN DRYING SYSTEM.

Published in:

Eurasian Physical Technical Journal, 2023, v. 20, n. 2, p. 32, doi. 10.31489/2023No2/32-40

By:

L. A., Alkahdery;
A. V., Yurchenko;
J. A.-K., Mohammed;
Y. G., Neshina

Publication type:

Article

Advances in Producing Functional Circuits on Biodegradable PCBs.

Published in:

Periodica Polytechnica: Electrical Engineering & Computer Science, 2016, v. 60, n. 4, p. 223, doi. 10.3311/PPee.9690

By:

Kovács, Bálint;
Géczy, Attila;
Horváth, Gergely;
Hajdu, István;
Gál, László

Publication type:

Article

PCB Handler의 과도응답해석 및 충격계수 산출 연구.

Published in:

Journal of Digital Convergence, 2017, v. 15, n. 7, p. 223, doi. 10.14400/JDC.2017.15.7.223

By:

이병화;
권순기;
고만수

Publication type:

Article

An occupational mark of screwdriver operators.

Published in:

Contact Dermatitis (01051873), 1995, v. 32, n. 1, p. 46, doi. 10.1111/j.1600-0536.1995.tb00840.x

By:

Koh, David;
Jeyaratnam, J.;
Aw, T. C.

Publication type:

Article

Dispersion of volatile organic compounds (VOCs) emissions from a biofilter at an electronic manufacturing facility.

Published in:

Environmental Progress & Sustainable Energy, 2017, v. 36, n. 4, p. 1100, doi. 10.1002/ep.12578

By:

Azlah, Nada;
Shareefdeen, Zarook;
Elkamel, Ali

Publication type:

Article

OPTIMIZATION OF CVD DIAMOND COATING TYPE ON MICRO DRILLS IN PCB MACHINING.

Published in:

Surface Review & Letters, 2016, v. 23, n. 2, p. -1, doi. 10.1142/S0218625X15501085

By:

LEI, X. L.;
HE, Y.;
SUN, F. H.

Publication type:

Article

BY THE NUMBERS.

Published in:: EE: Evaluation Engineering, 2019, v. 58, n. 6, p. 2
Publication type:: Article

BY THE NUMBERS.

Published in:: 2019
Publication type:: Chart/Diagram/Graph

The evolution of Industry 4.0, through the eyes of the PCB manufacturer.

Published in:

EE: Evaluation Engineering, 2017, v. 56, n. 7, p. 20

By:

Spinzi, Shavi

Publication type:

Article

Tools from software to X-ray systems round out PCB test and inspection.

Published in:

EE: Evaluation Engineering, 2018, v. 57, n. 2, p. 12

By:

Nelson, Rick

Publication type:

Article

Designer adaptation in the changing PCB industry.

Published in:

EE: Evaluation Engineering, 2017, v. 56, n. 11, p. 20

By:

Jordan, Benjamin

Publication type:

Article

Systems and software address testability.

Published in:

EE: Evaluation Engineering, 2016, v. 55, n. 3, p. 14

By:

Nelson, Rick

Publication type:

Article

IPC sees moderate domestic PCB production growth through 2017.

Published in:: EE: Evaluation Engineering, 2016, v. 55, n. 2, p. 4
Publication type:: Article

Maintaining high-speed signal integrity.

Published in:

EE: Evaluation Engineering, 2015, v. 54, n. 9, p. 26

By:

Lecklider, Tom

Publication type:

Article

EE INDUSTRY UPDATE.

Published in:: EE: Evaluation Engineering, 2014, v. 53, n. 12, p. 6
Publication type:: Article

EE INDUSTRY UPDATE.

Published in:: EE: Evaluation Engineering, 2014, v. 53, n. 11, p. 6
Publication type:: Article

JTAG and Embedded Test Complement ATE.

Published in:

EE: Evaluation Engineering, 2014, v. 53, n. 3, p. 14

By:

Nelson, Rick

Publication type:

Article

Estimating Emissions From Your Printed Circuit Board.

Published in:

EE: Evaluation Engineering, 2007, v. 46, n. 3, p. 70

By:

Swanberg, Roger

Publication type:

Article

No-Clean Solder Flux Chemistry and Temperature Effects on Humidity-Related Reliability of Electronics.

Published in:

Journal of Electronic Materials, 2019, v. 48, n. 2, p. 1207, doi. 10.1007/s11664-018-06862-4

By:

Piotrowska, Kamila;
Grzelak, Magdalena;
Ambat, Rajan

Publication type:

Article

Solder Flux Residues and Humidity-Related Failures in Electronics: Relative Effects of Weak Organic Acids Used in No-Clean Flux Systems.

Published in:

Journal of Electronic Materials, 2015, v. 44, n. 4, p. 1116, doi. 10.1007/s11664-014-3609-0

By:

Verdingovas, Vadimas;
Jellesen, Morten;
Ambat, Rajan

Publication type:

Article

Reliability Testing of WLCSP Lead-Free Solder Joints.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 5, p. 1032, doi. 10.1007/BF02692564

By:

Huann-Wu Chiang;
Jun-Yuan Chen;
Ming-Chuan Chen;
Lee, Jeffrey C. B.;
Shiau, Gary

Publication type:

Article

Designing a yield-based skip-lot sampling plan for lot acceptance determination.

Published in:

Journal of the Operational Research Society, 2022, v. 73, n. 3, p. 653, doi. 10.1080/01605682.2020.1854630

By:

Wu, Chien-Wei;
Chen, Jr-Tzung;
Liu, Shih-Wen

Publication type:

Article

A heuristic for multiple-feeder PCB manufacturing.

Published in:

Journal of the Operational Research Society, 2006, v. 57, n. 9, p. 1134, doi. 10.1057/palgrave.jors.2602086

By:

Volgenant, A.;
de Waal, A.

Publication type:

Article

Simulation studies of printed circuit board using finite element method to evaluate the potential of cellulose fibres to replace glass fibres.

Published in:

Materialwissenschaft und Werkstoffechnik, 2025, v. 56, n. 5, p. 715, doi. 10.1002/mawe.202400028

By:

Velosa, J. C.;
Curto, J. M. R.

Publication type:

Article

Comparative study of interfacial interaction between aromatic and aliphatic functional group in solder wettability.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 15, p. 12910, doi. 10.1007/s10854-018-9410-8

By:

Ismail, Norliza;
Ismail, Roslina;
Jalar, Azman;
Omar, Ghazali;
Salleh, Emee Marina;
Kamil, Norinsan;
Rahman, Irman Abdul

Publication type:

Article