Bioleaching of Gold from Printed Circuit Boards: Potential Sustainability of Thiosulphate.
- Published in:
- Recycling (MDPI AG), 2025, v. 10, n. 3, p. 87, doi. 10.3390/recycling10030087
- By:
- Publication type:
- Article
Works matching DE "PRINTED circuits"
Results: 2145
1
2
Effect of Solvent Pre-Treatment on the Leaching of Copper During Printed Circuit Board Recycling.
- Published in:
- Recycling (MDPI AG), 2025, v. 10, n. 3, p. 80, doi. 10.3390/recycling10030080
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- Publication type:
- Article
3
Financial and Technological Potential of Eco-Efficient Recycling of Waste Electronic Equipment.
- Published in:
- Minerals (2075-163X), 2025, v. 15, n. 6, p. 653, doi. 10.3390/min15060653
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- Publication type:
- Article
4
Fracture Behavior of Three-Dimensional-Printable Cementitious Mortars in Very Early Ages and Hardened States.
- Published in:
- ACI Materials Journal, 2024, v. 121, n. 2/3, p. 49, doi. 10.14359/51740302
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- Publication type:
- Article
5
Exploring the comminution process of waste printed circuit boards in recycling: a review.
- Published in:
- Journal of Material Cycles & Waste Management, 2024, v. 26, n. 3, p. 1326, doi. 10.1007/s10163-024-01945-3
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- Publication type:
- Article
6
Recent chemical methods for metals recovery from printed circuit boards: A review.
- Published in:
- Journal of Material Cycles & Waste Management, 2024, v. 26, n. 3, p. 1349, doi. 10.1007/s10163-024-01944-4
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- Publication type:
- Article
7
Clustering methods for printed and circuit board insertion problems.
- Published in:
- Journal of the Operational Research Society, 2000, v. 51, n. 10, p. 1205, doi. 10.2307/253933
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- Publication type:
- Article
8
A Novel Impedimetric Biosensor for Detection of Lead (II) with Low-cost Interdigitated Electrodes Made on PCB.
- Published in:
- Electroanalysis, 2016, v. 28, n. 9, p. 2000, doi. 10.1002/elan.201501153
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- Publication type:
- Article
9
Energy Localization and Topological Defect in Spherical Non‐Hermitian Topolectrical Circuits.
- Published in:
- Annalen der Physik, 2024, v. 536, n. 11, p. 1, doi. 10.1002/andp.202400026
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- Publication type:
- Article
10
A Negative Conductivity Material Makes a dc Invisibility Cloak Hide an Object at a Distance.
- Published in:
- Advanced Functional Materials, 2014, v. 23, n. 35, p. 4306, doi. 10.1002/adfm.201300226
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- Publication type:
- Article
11
Subgraph matching-based reference placement for printed circuit board designs.
- Published in:
- Journal of Supercomputing, 2024, v. 80, n. 16, p. 24324, doi. 10.1007/s11227-024-06338-9
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- Publication type:
- Article
12
Impact of plasma etching on fabrication technology of liquid crystal polymer printed circuit board.
- Published in:
- Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 9, p. 954, doi. 10.1007/s10854-009-0024-z
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- Publication type:
- Article
13
Diffusion Bonding 321-Grade Stainless Steel: Failure and Multimodal Characterization.
- Published in:
- Microscopy & Microanalysis, 2024, v. 30, n. 2, p. 192, doi. 10.1093/mam/ozae019
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- Publication type:
- Article
14
Characterizing the intermetallic formed during ball attach process.
- Published in:
- Microscopy & Microanalysis, 2008, v. 14, n. S3, p. 17, doi. 10.1017/S1431927608089253
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- Publication type:
- Article
15
Microbioreactor arrays with parametric control for high-throughput experimentation.
- Published in:
- Biotechnology & Bioengineering, 2004, v. 85, n. 4, p. 376, doi. 10.1002/bit.10835
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- Publication type:
- Article
16
Levitation and movement of human tumor cells using a printed circuit board device based on software-controlled dielectrophoresis.
- Published in:
- Biotechnology & Bioengineering, 2003, v. 82, n. 4, p. 474, doi. 10.1002/bit.10590
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- Publication type:
- Article
17
Application of Neural Networks to Testing Printed Circuit Boards Using Data from a X-ray 3D Microtomograph.
- Published in:
- Russian Journal of Nondestructive Testing, 2025, v. 61, n. 1, p. 91, doi. 10.1134/S1061830924602848
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- Publication type:
- Article
18
A Method of Calculating the Errors of Measurements of the Temperatures of Radio-Electrical Components of a Printed Circuit.
- Published in:
- Measurement Techniques, 2015, v. 58, n. 5, p. 539, doi. 10.1007/s11018-015-0750-y
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- Publication type:
- Article
19
基于深度学习的PCB表面缺陷检测研究进展.
- Published in:
- Machine Tool & Hydraulics, 2024, v. 52, n. 23, p. 188, doi. 10.3969/j.issn.1001-3881.2024.23.030
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- Publication type:
- Article
20
Dielectrophoretic Particle Chromatography: From Batch Processing to Semi-Continuous High-Throughput Separation.
- Published in:
- Powders, 2024, v. 3, n. 1, p. 54, doi. 10.3390/powders3010005
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- Publication type:
- Article
21
Development of an electronic stethoscope implementing filters with OPAM for the observation of cardiac signals using a graphical interface with an AD8232 module.
- Published in:
- Journal Electrical Engineering / Revista de Ingeniería Eléctrica, 2023, v. 7, n. 19, p. 1, doi. 10.35429/JEE.2023.19.7.1.14
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- Publication type:
- Article
22
Analytical Model for Evaluating the Reliability of Vias and Plated Through-Hole Pads on PCBs.
- Published in:
- Inventions (2411-5134), 2023, v. 8, n. 3, p. 77, doi. 10.3390/inventions8030077
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- Publication type:
- Article
23
Radio Frequency Properties of a 3D Printed Klystron Circuit.
- Published in:
- Instruments (2410-390X), 2024, v. 8, n. 1, p. 9, doi. 10.3390/instruments8010009
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- Publication type:
- Article
24
RECURSION MODELS FOR DESCRIBING AND MANAGING THE TRANSIENT FLOW OF MATERIALS IN GENERALIZED FLOWLINES.
- Published in:
- Management Science, 1989, v. 35, n. 6, p. 722, doi. 10.1287/mnsc.35.6.722
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- Publication type:
- Article
25
FORMULA STUDENT VERSENYAUTÓ ELEKTROMOS RENDSZERÉNEK FELÉPÍTÉSE.
- Published in:
- Multidiszciplináris Tudományok, 2020, v. 10, n. 4, p. 112, doi. 10.35925/j.multi.2020.4.14
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- Publication type:
- Article
26
Revolutionizing Papertronics: Advanced Green, Tunable, and Flexible Components and Circuits (Adv. Sustainable Syst. 6/2024).
- Published in:
- Advanced Sustainable Systems, 2024, v. 8, n. 6, p. 1, doi. 10.1002/adsu.202470020
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- Publication type:
- Article
27
On the Investigation of the Thermal Degradation of Waste Printed Circuit Boards for Recycling Applications.
- Published in:
- Advanced Sustainable Systems, 2022, v. 6, n. 2, p. 1, doi. 10.1002/adsu.202100054
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- Publication type:
- Article
28
Assessing the Applicability of Gravity Separation for Recycling of Non‐Metal Fraction from Waste Printed Circuit Boards.
- Published in:
- Advanced Sustainable Systems, 2022, v. 6, n. 2, p. 1, doi. 10.1002/adsu.202000231
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- Publication type:
- Article
29
Assessment of Pb, Cd, Cr and Ag leaching from electronics waste using four extraction methods.
- Published in:
- Journal of Environmental Science & Health. Part A. Toxic/Hazardous Substances & Environmental Engineering, 2008, v. 43, n. 14, p. 1717, doi. 10.1080/10934520802330305
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- Publication type:
- Article
30
Studies on the Reuse of Waste Printed Circuit Board as an Additive for Cement Mortar.
- Published in:
- Journal of Environmental Science & Health. Part A. Toxic/Hazardous Substances & Environmental Engineering, 2005, v. 40, n. 3, p. 645, doi. 10.1081/ESE-200046618
- By:
- Publication type:
- Article
31
Isolation improvement of compact LTE MIMO terminal using combination of neutralisation line and modified ground structure.
- Published in:
- Journal of the National Science Foundation of Sri Lanka, 2020, v. 48, n. 3, p. 251, doi. 10.4038/jnsfsr.v48i3.9158
- By:
- Publication type:
- Article
32
基于改进 YOLOv7-tiny 的 PCB 表面缺陷检测.
- Published in:
- Journal of Test & Measurement Technology, 2025, v. 39, n. 1, p. 81, doi. 10.62756/csjs.1671-7449.2025012
- By:
- Publication type:
- Article
33
Thermal Design and In Situ Temperature Measurement of Heterogeneous Material during Ultrafast Laser Scribing.
- Published in:
- Sensors & Materials, 2019, v. 31, n. 5, Part 2, p. 1667, doi. 10.18494/SAM.2019.2328
- By:
- Publication type:
- Article
34
Electrode Structure and Stimulation Frequency to Reduce the Estimation Error of Reagent Concentration Determined Using Measured Impedance.
- Published in:
- Sensors & Materials, 2019, v. 31, n. 5, Part 2, p. 1623, doi. 10.18494/SAM.2019.2283
- By:
- Publication type:
- Article
35
Characteristics of Lock-in Thermography Signal from Solder Bump Cracking in Wafer-level Chip Scale Packaging for Internet of Things Applications.
- Published in:
- Sensors & Materials, 2018, v. 30, n. 4, Part 2, p. 833, doi. 10.18494/SAM.2018.1784
- By:
- Publication type:
- Article
36
Calibration of Temperature Sensors with Different Tolerances for Polymerase Chain Reaction Chips.
- Published in:
- Sensors & Materials, 2017, v. 29, n. 7, Part 2, p. 961, doi. 10.18494/SAM.2017.1548
- By:
- Publication type:
- Article
37
Micro-Polymerase Chain Reaction Chip Reaction Chamber Temperature Measurement.
- Published in:
- Sensors & Materials, 2016, v. 28, n. 6, p. 593, doi. 10.18494/sam.2016.1277
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- Publication type:
- Article
38
Printed Circuit Board (PCB) Brazing and Ion Source Integration of a High-Field Asymmetric Ion Mobility Spectrometry (FAIMS) Chip.
- Published in:
- Analytical Letters, 2021, v. 54, n. 8, p. 1377, doi. 10.1080/00032719.2020.1803347
- By:
- Publication type:
- Article
39
Printed Circuit Board-Based Electrolyte Regulator for Laminar Microfluidics.
- Published in:
- Analytical Letters, 2019, v. 52, n. 9, p. 1500, doi. 10.1080/00032719.2018.1548623
- By:
- Publication type:
- Article
40
Application of Fractional Differential Model in Image Enhancement of Strong Reflection Surface.
- Published in:
- Mathematics (2227-7390), 2023, v. 11, n. 2, p. 444, doi. 10.3390/math11020444
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- Publication type:
- Article
41
Reliability Sensibility Analysis of the PCB Assembly concerning Warpage during the Reflow Soldering Process.
- Published in:
- Mathematics (2227-7390), 2022, v. 10, n. 17, p. 3055, doi. 10.3390/math10173055
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- Publication type:
- Article
42
Application of a Non-Dominated Sorting Genetic Algorithm to Solve a Bi-Objective Scheduling Problem Regarding Printed Circuit Boards.
- Published in:
- Mathematics (2227-7390), 2022, v. 10, n. 13, p. 2305, doi. 10.3390/math10132305
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- Publication type:
- Article
43
Improved Mixed-Integer Linear Programming Model for Short-Term Scheduling of the Pressing Process in Multi-Layer Printed Circuit Board Manufacturing.
- Published in:
- Mathematics (2227-7390), 2021, v. 9, n. 21, p. 2653, doi. 10.3390/math9212653
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- Publication type:
- Article
44
Using an Improved Differential Evolution for Scheduling Optimization of Dual-Gantry Multi-Head Surface-Mount Placement Machine.
- Published in:
- Mathematics (2227-7390), 2021, v. 9, n. 16, p. 2016, doi. 10.3390/math9162016
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- Publication type:
- Article
45
Mixed-Integer Linear Programming Model and Heuristic for Short-Term Scheduling of Pressing Process in Multi-Layer Printed Circuit Board Manufacturing.
- Published in:
- Mathematics (2227-7390), 2021, v. 9, n. 6, p. 653, doi. 10.3390/math9060653
- By:
- Publication type:
- Article
46
8-W 2-Stage GaN Doherty Power Amplifier Module on 7 × 7 QFN for the 5G N78 Band.
- Published in:
- Electronics (2079-9292), 2025, v. 14, n. 12, p. 2398, doi. 10.3390/electronics14122398
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- Publication type:
- Article
47
Vision-Based Structural Adhesive Detection for Electronic Components on PCBs.
- Published in:
- Electronics (2079-9292), 2025, v. 14, n. 10, p. 2045, doi. 10.3390/electronics14102045
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- Publication type:
- Article
48
Automated Defect Identification System in Printed Circuit Boards Using Region-Based Convolutional Neural Networks.
- Published in:
- Electronics (2079-9292), 2025, v. 14, n. 8, p. 1542, doi. 10.3390/electronics14081542
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- Publication type:
- Article
49
Efficient Optimization Method of the Meshed Return Plane Through Fusion of Convolutional Neural Network and Improved Particle Swarm Optimization.
- Published in:
- Electronics (2079-9292), 2025, v. 14, n. 5, p. 1035, doi. 10.3390/electronics14051035
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- Publication type:
- Article
50
A Wideband Analog Vector Modulator Phase Shifter Based on Non-Quadrature Vector Operation.
- Published in:
- Electronics (2079-9292), 2025, v. 14, n. 5, p. 997, doi. 10.3390/electronics14050997
- By:
- Publication type:
- Article