Works matching DE "PRINTED circuit testing"

Results: 24

Detection and localization of impact damages in carbon nanotube–modified epoxy adhesive films with printed circuits.

Published in:

Structural Health Monitoring, 2018, v. 17, n. 5, p. 1166, doi. 10.1177/1475921717738140

By:

Augustin, Till;
Karsten, Julian;
Fiedler, Bodo

Publication type:

Article

The life-cycle aspect of boundary scan.

Published in:

EE: Evaluation Engineering, 2014, v. 53, n. 11, p. 24

By:

van den Eijnden, Peter

Publication type:

Article

Why Program Devices at In-Circuit Test?

Published in:

EE: Evaluation Engineering, 2011, v. 50, n. 10, p. 28

By:

Smith, Michael J.

Publication type:

Article

IEEE 1149.7 Expands JTAG Functionality.

Published in:

EE: Evaluation Engineering, 2009, v. 48, n. 7, p. 44

By:

Lau, Stephen

Publication type:

Article

Implementing Change On the Test Floor.

Published in:

EE: Evaluation Engineering, 2007, v. 46, n. 5, p. 16

By:

VanNewkirk, John

Publication type:

Article

Integrating Boundary Scan With Various ATE.

Published in:

EE: Evaluation Engineering, 2006, v. 45, n. 7, p. 32

By:

Ehrenberg, Heiko

Publication type:

Article

What Problems Can Boundary Scan Solve?

Published in:

EE: Evaluation Engineering, 2006, v. 45, n. 5, p. 18

By:

Bennetts, R. G. (Ben)

Publication type:

Article

DFT Features Evaluated Before Prototyping.

Published in:: 2005
Publication type:: Product Review

Optimization of Boundary Scan Tests Using FPGA-Based Efficient Scan Architectures.

Published in:

Journal of Electronic Testing, 2016, v. 32, n. 3, p. 245, doi. 10.1007/s10836-016-5588-y

By:

Aleksejev, Igor;
Devadze, Sergei;
Jutman, Artur;
Shibin, Konstantin

Publication type:

Article

Current State of the Mixed-Signal Test Bus 1149.4.

Published in:

Journal of Electronic Testing, 2012, v. 28, n. 6, p. 857, doi. 10.1007/s10836-012-5339-7

By:

Hannu, Jari;
Häkkinen, Juha;
Voutilainen, Juha-Veikko;
Jantunen, Heli;
Moilanen, Markku

Publication type:

Article

PCB分压离子阱性能优化的理论模拟研究.

Published in:

Journal of Chinese Mass Spectrometry Society, 2017, v. 38, n. 3, p. 265, doi. 10.7538/zpxb.youxian.2016.0056

By:

何洋;
姚如娇;
肖育;
袁广洲;
张在越;
丁传凡;
李晓旭

Publication type:

Article

GMR- AND GMI-BASED SYSTEMS FOR NONDESTRUCTIVE EVALUATION OF PRINTED CIRCUIT BOARD.

Published in:

Journal of Circuits, Systems & Computers, 2007, v. 16, n. 6, p. 847, doi. 10.1142/S0218126607004039

By:

ELSHAFIEY, IBRAHIM;
MOHRA, ASHRAF

Publication type:

Article

Evaluation of Printed-Circuit Board Materials for High-Temperature Operation.

Published in:

Journal of Microelectronic & Electronic Packaging, 2017, v. 14, n. 4, p. 166, doi. 10.4071/imaps.516313

By:

Aviño-Salvado, Oriol;
Sabbah, Wissam;
Buttay, Cyril;
Morel, Hervé;
Bevilacqua, Pascal

Publication type:

Article

Improved Mechanisms for Excellent Tunable Microwave Ce and Mn Codoped Ba 0.6 Sr 0.4 TiO 3 Thin Films.

Published in:

Integrated Ferroelectrics, 2014, v. 152, n. 1, p. 104, doi. 10.1080/10584587.2014.901875

By:

Liao, Jiaxuan;
Wang, Sizhe;
Wei, Xubo;
Xu, Ziqiang;
Wang, Peng

Publication type:

Article

Influence of Film Thickness on Dielectric Properties of Y and Mn Alternately Doped BST Films.

Published in:

Integrated Ferroelectrics, 2014, v. 152, n. 1, p. 97, doi. 10.1080/10584587.2014.901873

By:

Zhang, Weifang;
Liao, Jiaxuan;
Huang, Jiaqi

Publication type:

Article

MODELING THE DOUBLE WELL POTENTIAL CONFIGURATION OF TI +4 : A FIRST STEP TOWARD A TRANSVERSE ISING MODEL FOR BST.

Published in:

Integrated Ferroelectrics, 2005, v. 71, n. 1, p. 161, doi. 10.1080/10584580590964600

By:

CROWNE, FRANK;
POTREPKA, DANIEL;
TIDROW, STEVEN

Publication type:

Article

Damage Progression Using Speckle-Correlation and High-Speed Imaging for Survivability of Leadfree Packaging Under Shock.

Published in:

Strain, 2009, v. 45, n. 3, p. 267, doi. 10.1111/j.1475-1305.2009.00629.x

By:

Lall, P.;
Iyengar, D.;
Shantaram, S.;
Panchagade, D.

Publication type:

Article

Boundary Scan and Processor Emulation Achieve Synergy.

Published in:

EE: Evaluation Engineering, 2005, v. 44, n. 5, p. 56

By:

Bonnett, Dave

Publication type:

Article

PCB Testing Goes Socketless.

Published in:

EE: Evaluation Engineering, 2004, v. 43, n. 7, p. 84

By:

Parker, Matt;
Smith, Jeff

Publication type:

Article

Reducing the Cost of Test With Boundary Scan.

Published in:

EE: Evaluation Engineering, 2004, v. 43, n. 1, p. 28

By:

Goepel, Holger

Publication type:

Article

Boundary Scan for Mixed-Signal Controller Cards.

Published in:

EE: Evaluation Engineering, 2003, v. 42, n. 9, p. 18

By:

Richards, Michael J.

Publication type:

Article

Materials progress: Heat treating/coating.

Published in:: Advanced Materials & Processes, 1997, v. 152, n. 3, p. 15
Publication type:: Article

An accelerated life test model based on reliability kinetics.

Published in:

Technometrics, 1995, v. 37, n. 2, p. 133, doi. 10.1080/00401706.1995.10484298

By:

Meeker, William Q.;
LuValle, Michael J.

Publication type:

Article

PROCESS TECHNOLOGY.

Published in:: Advanced Materials & Processes, 2018, v. 176, n. 3, p. 12
Publication type:: Article