Works matching DE "PRINTED circuit testing"
Results: 21
Damage Progression Using Speckle-Correlation and High-Speed Imaging for Survivability of Leadfree Packaging Under Shock.
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- Strain, 2009, v. 45, n. 3, p. 267, doi. 10.1111/j.1475-1305.2009.00629.x
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- Article
The life-cycle aspect of boundary scan.
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- EE: Evaluation Engineering, 2014, v. 53, n. 11, p. 24
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- Article
Why Program Devices at In-Circuit Test?
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- EE: Evaluation Engineering, 2011, v. 50, n. 10, p. 28
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- Article
IEEE 1149.7 Expands JTAG Functionality.
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- EE: Evaluation Engineering, 2009, v. 48, n. 7, p. 44
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- Article
Implementing Change On the Test Floor.
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- EE: Evaluation Engineering, 2007, v. 46, n. 5, p. 16
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- Article
Integrating Boundary Scan With Various ATE.
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- EE: Evaluation Engineering, 2006, v. 45, n. 7, p. 32
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- Article
What Problems Can Boundary Scan Solve?
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- EE: Evaluation Engineering, 2006, v. 45, n. 5, p. 18
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- Article
DFT Features Evaluated Before Prototyping.
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- 2005
- Publication type:
- Product Review
Boundary Scan and Processor Emulation Achieve Synergy.
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- EE: Evaluation Engineering, 2005, v. 44, n. 5, p. 56
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- Article
PCB Testing Goes Socketless.
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- EE: Evaluation Engineering, 2004, v. 43, n. 7, p. 84
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- Article
Reducing the Cost of Test With Boundary Scan.
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- EE: Evaluation Engineering, 2004, v. 43, n. 1, p. 28
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- Article
Boundary Scan for Mixed-Signal Controller Cards.
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- EE: Evaluation Engineering, 2003, v. 42, n. 9, p. 18
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- Article
Evaluation of Printed-Circuit Board Materials for High-Temperature Operation.
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- Journal of Microelectronic & Electronic Packaging, 2017, v. 14, n. 4, p. 166, doi. 10.4071/imaps.516313
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- Article
Detection and localization of impact damages in carbon nanotube–modified epoxy adhesive films with printed circuits.
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- Structural Health Monitoring, 2018, v. 17, n. 5, p. 1166, doi. 10.1177/1475921717738140
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- Article
PROCESS TECHNOLOGY.
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- Advanced Materials & Processes, 2018, v. 176, n. 3, p. 12
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- Article
An accelerated life test model based on reliability kinetics.
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- Technometrics, 1995, v. 37, n. 2, p. 133, doi. 10.1080/00401706.1995.10484298
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- Article
GMR- AND GMI-BASED SYSTEMS FOR NONDESTRUCTIVE EVALUATION OF PRINTED CIRCUIT BOARD.
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- Journal of Circuits, Systems & Computers, 2007, v. 16, n. 6, p. 847, doi. 10.1142/S0218126607004039
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- Article
Optimization of Boundary Scan Tests Using FPGA-Based Efficient Scan Architectures.
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- Journal of Electronic Testing, 2016, v. 32, n. 3, p. 245, doi. 10.1007/s10836-016-5588-y
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- Article
Current State of the Mixed-Signal Test Bus 1149.4.
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- Journal of Electronic Testing, 2012, v. 28, n. 6, p. 857, doi. 10.1007/s10836-012-5339-7
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- Article
PCB分压离子阱性能优化的理论模拟研究.
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- Journal of Chinese Mass Spectrometry Society, 2017, v. 38, n. 3, p. 265, doi. 10.7538/zpxb.youxian.2016.0056
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- Article
Materials progress: Heat treating/coating.
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- Advanced Materials & Processes, 1997, v. 152, n. 3, p. 15
- Publication type:
- Article