Works matching DE "PRINTED circuit manufacturing"

Results: 69

Finite element simulation of octaaminophenyl polysilsesquioxane-modified Al2O3/polyimide composite thin film materials in a flexible display model.

Published in:

Journal of Polymer Research, 2025, v. 32, n. 4, p. 1, doi. 10.1007/s10965-025-04366-4

By:

Gu, Yulong;
Wu, Hongmei;
Chen, Jian;
Fu, Yihui

Publication type:

Article

Preparation of polyarylene ether nitriles/fullerene composites with low dielectric constant by cosolvent evaporation.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 20, p. 18297, doi. 10.1007/s10854-019-02145-8

By:

Lei, Xiting;
Tong, Lifen;
Pan, Hai;
Yang, Guangyao;
Liu, Xiaobo

Publication type:

Article

Fabrication of silver electrically conductive adhesive to apply in through-hole filling for PCB interconnection.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 9, p. 9186, doi. 10.1007/s10854-016-4955-x

By:

Zhou, Guoyun;
Mao, Yingjie;
Wang, Chong;
Wang, Shouxu;
Chen, Yuanming;
He, Wei

Publication type:

Article

SMT defect classification by feature extraction region optimization and machine learning.

Published in:

International Journal of Advanced Manufacturing Technology, 2019, v. 101, n. 5-8, p. 1303, doi. 10.1007/s00170-018-3022-6

By:

Song, Ji-Deok;
Kim, Young-Gyu;
Park, Tae-Hyoung

Publication type:

Article

某印制电路板企业清洁生产评价体系构建与探讨.

Published in:

Electroplating & Finishing, 2022, v. 41, n. 21, p. 1558, doi. 10.19289/j.1004-227x.2022.21.013

By:

陈妤;
魏喆;
叶茂盛;
李杨杨;
魏立安

Publication type:

Article

Effects of torrefaction and water washing on the properties and combustion reactivity of various wastes.

Published in:

International Journal of Energy Research, 2021, v. 45, n. 6, p. 8125, doi. 10.1002/er.5458

By:

Chen, Chia‐Yang;
Chen, Wei‐Hsin;
Ilham, Zul

Publication type:

Article

PCB defect detection algorithm based on CDI-YOLO.

Published in:

Scientific Reports, 2024, v. 14, n. 1, p. 1, doi. 10.1038/s41598-024-57491-3

By:

Xiao, Gaoshang;
Hou, Shuling;
Zhou, Huiying

Publication type:

Article

An MILP model and a hybrid evolutionary algorithm for integrated operation optimisation of multi-head surface mounting machines in PCB assembly.

Published in:

International Journal of Production Research, 2017, v. 55, n. 1, p. 145, doi. 10.1080/00207543.2016.1200154

By:

Luo, Jiaxiang;
Liu, Jiyin;
Hu, Yueming

Publication type:

Article

Optimal locations of on-line and off-line rework stations in a serial production system.

Published in:

International Journal of Production Research, 2016, v. 54, n. 12, p. 3603, doi. 10.1080/00207543.2015.1117676

By:

Hossain, Md. Shahriar J.;
Sarker, Bhaba R.

Publication type:

Article

Demand satisfaction and decision-making for a PCB manufacturing system with production lines in parallel.

Published in:

International Journal of Production Research, 2015, v. 53, n. 11, p. 3193, doi. 10.1080/00207543.2014.965851

By:

Lin, Yi-Kuei;
Chang, Ping-Chen

Publication type:

Article

Collaborative design environment between ECAD and MCAD engineers in high-tech products development.

Published in:

International Journal of Production Research, 2014, v. 52, n. 20, p. 6161, doi. 10.1080/00207543.2014.918289

By:

Son, Seokbae;
Na, Sangwook;
Kim, Kukjin;
Lee, Shinyoung

Publication type:

Article

Recovery of Heavy Metals from Spent Etching Waste Solution of Printed Circuit Board (PCB) Manufacturing.

Published in:

Pertanika Journal of Science & Technology, 2013, v. 21, n. 2, p. 375

By:

Ali, A. H. M.;
Sobri, S.;
Salmiaton, A.;
Faizah, M. Y.

Publication type:

Article

Utility of nonwovens in the production of integrated electrical circuits via printing conductive inks.

Published in:

Journal of the Textile Institute, 2008, v. 99, n. 1, p. 37, doi. 10.1080/00405000701547748

By:

Karaguzel, B.;
Merritt, C.R.;
Kang, T.;
Wilson, J.M.;
Nagle, H.T.;
Grant, E.;
Pourdeyhimi, B.

Publication type:

Article

Worth the paper it's printed on.

Published in:: Electronics Letters (Wiley-Blackwell), 2019, v. 55, n. 5, p. 231, doi. 10.1049/el.2019.0508
Publication type:: Article

INTELLECTUAL SYSTEM FOR PRINTED CIRCUIT BOARD MANUFACTURE BASED ON MIRAE MX-200.

Published in:

Electronics & Control Systems, 2021, v. 68, n. 2, p. 38, doi. 10.18372/1990-5548.68.16090

By:

Sineglazov, V. M.;
Plodistyi, B. O.

Publication type:

Article

Reflection Phase Shift for PWB and PCBA Production Testing.

Published in:

Journal of Microelectronic & Electronic Packaging, 2012, v. 9, n. 1, p. 1, doi. 10.4071/imaps.315

By:

Renbi, Abdelghani;
Delsing, Jerker

Publication type:

Article

Construção de um luxímetro digital utilizando plataforma Arduino para uso em laboratórios didáticos.

Published in:

Caderno Brasileiro de Ensino de Física, 2021, v. 43, p. 1, doi. 10.1590/1806-9126-RBEF-2020-0502

By:

Pereira, C. B.;
Berleze, S. L. M.;
Soares, W. A.;
Serbena, J. P. M.

Publication type:

Article

Enhancing peel strength between liquid crystal polymer and copper with plasma treatment, surface oxidation, and silane coating.

Published in:

Journal of Applied Polymer Science, 2022, v. 139, n. 29, p. 1, doi. 10.1002/app.52644

By:

Chen, Yuanming;
Feng, Hongcheng;
Su, Yuanzhang;
Li, Jiaqi;
Xu, Zhenlin;
Li, Yifeng;
Li, Nengbin;
He, Yaozong;
Hong, Yan;
Wang, Shouxu;
Zhou, Guoyun;
Wang, Chong;
Du, Yongjie;
He, Wei

Publication type:

Article

Equilibrado de lineas de montaje con ventanas de visibilidad.

Published in:

DYNA - Ingeniería e Industria, 2014, v. 89, n. 5, p. 552, doi. 10.6036/7051

By:

Calleja-Sanz, Gema;
Corominas-Subias, Albert;
García-Villoria, Alberto;
Pastor-Moreno, Rafael

Publication type:

Article

Liquid Metal‐Based High‐Density Interconnect Technology for Stretchable Printed Circuits.

Published in:

Advanced Functional Materials, 2024, v. 34, n. 31, p. 1, doi. 10.1002/adfm.202309707

By:

Wang, Bei;
Prasad, Sonal;
Hellman, Oskar;
Li, Hao;
Fridberger, Anders;
Hjort, Klas

Publication type:

Article

Establishing process parameter levels for double-sided PCBs.

Published in:

International Journal of Advanced Manufacturing Technology, 2010, v. 50, n. 9-12, p. 1025, doi. 10.1007/s00170-010-2591-9

By:

Pradhan, Biswabrata

Publication type:

Article

Experimental investigation of parameters influencing electrostatic motor’s performance with air bearing operation.

Published in:

International Journal of Advanced Manufacturing Technology, 2009, v. 43, n. 3/4, p. 211, doi. 10.1007/s00170-008-1710-3

By:

Dadkhah, Mohammad;
Hojjat, Yousef;
Modabberifar, Mehdi;
Higuchi, Toshiro

Publication type:

Article

Method to Reduce Coupon Lengths for Transmission Line S-parameter Measurements through Elimination of Guided-wave Multiple Reflections.

Published in:

PIERS Proceedings, 2014, p. 2502

By:

Shaowu Huang;
Loyer, Jeff;
Kunze, Richard;
Boping Wu

Publication type:

Article

Monitoring and Interpretation of Process Variability Generated from the Integration of the Multivariate Cumulative Sum Control Chart and Artificial Intelligence.

Published in:

Applied Sciences (2076-3417), 2024, v. 14, n. 21, p. 9705, doi. 10.3390/app14219705

By:

Ruelas-Santoyo, Edgar Augusto;
Figueroa-Fernández, Vicente;
Tapia-Esquivias, Moisés;
Pantoja-Pacheco, Yaquelin Verenice;
Bravo-Santibáñez, Edgar;
Cruz-Salgado, Javier

Publication type:

Article

Development of an Image Processing Application for Element Detection in a Printed Circuit Board Manufacturing Cell.

Published in:

Applied Sciences (2076-3417), 2024, v. 14, n. 13, p. 5679, doi. 10.3390/app14135679

By:

Trejo-Morales, Antonio;
Bautista-Ortega, Milton;
Barriga-Rodríguez, Leonardo;
Cruz-González, Celso Eduardo;
Franco-Urquiza, Edgar Adrián

Publication type:

Article

A Photonically-Excited Leaky-Wave Antenna Array at E-Band for 1-D Beam Steering.

Published in:

Applied Sciences (2076-3417), 2020, v. 10, n. 10, p. 3474, doi. 10.3390/app10103474

By:

Pascual-Gracia, Álvaro J.;
Ali, Muhsin;
Carpintero Del Barrio, Guillermo;
Ferrero, Fabien;
Brochier, Laurent;
Sauleau, Ronan;
García-Muñoz, Luis Enrique;
González-Ovejero, David

Publication type:

Article

High Refractive Index Electromagnetic Devices in Printed Technology Based on Glide-Symmetric Periodic Structures.

Published in:

Applied Sciences (2076-3417), 2020, v. 10, n. 9, p. 3216, doi. 10.3390/app10093216

By:

Arnberg, Philip;
Barreira Petersson, Oscar;
Zetterstrom, Oskar;
Ghasemifard, Fatemeh;
Quevedo-Teruel, Oscar

Publication type:

Article

CONSIDERATIONS ABOUT COOPER ETCHING BY PHOTOCHEMICAL MACHINING.

Published in:

Nonconventional Technologies Review / Revista de Tehnologii Neconventionale, 2022, v. 26, n. 1, p. 3

By:

Botis, Mihaela

Publication type:

Article

A stretchable and large-scale guided wave sensor network for aircraft smart skin of structural health monitoring.

Published in:

Structural Health Monitoring, 2021, v. 20, n. 3, p. 861, doi. 10.1177/1475921719850641

By:

Wang, Yu;
Qiu, Lei;
Luo, Yijie;
Ding, Rui

Publication type:

Article

Reversible Conversion of Dominant Polarity in Ambipolar Polymer/Graphene Oxide Hybrids.

Published in:

Scientific Reports, 2015, p. 9446, doi. 10.1038/srep09446

By:

Zhou, Ye;
Han, Su-Ting;
Sonar, Prashant;
Ma, Xinlei;
Chen, Jihua;
Zheng, Zijian;
Roy, V. A. L.

Publication type:

Article

A TABU SEARCH FOR TIME MINIMIZATION IN PRINTED CIRCUIT BOARD ASSEMBLY.

Published in:

Academic Journal of Manufacturing Engineering, 2021, v. 19, n. 2, p. 5

By:

DODU, Cristina Elena;
ANCĂU, Mircea

Publication type:

Article

High-reliability flexible optical printed circuit board for opto-electric interconnections.

Published in:

Optical Engineering, 2009, v. 48, n. 1, p. 15401, doi. 10.1117/1.3072957

By:

Byung Sup Rho;
Woo-Jin Lee;
Jung Woon Lim;
Gye Won Kim;
Che Hyun Cho;
Sung Hwan Hwang

Publication type:

Article

Telemetric angle and position sensing using millimeter-wave metamaterial and a frequency-modulated continuous-wave (FMCW) chip.

Published in:

Journal of Sensors & Sensor Systems, 2024, v. 13, n. 1, p. 31, doi. 10.5194/jsss-13-31-2024

By:

Schossmann, Alexander;
Töfferl, Michael;
Schmidt, Christoph;
Bergmann, Alexander

Publication type:

Article

A novel approach for road surface wetness detection with planar capacitive sensors.

Published in:

Journal of Sensors & Sensor Systems, 2019, v. 8, n. 1, p. 57, doi. 10.5194/jsss-8-57-2019

By:

Döring, Jakob;
Tharmakularajah, Lakshan;
Happel, Jakob;
Krieger, Karl-Ludwig

Publication type:

Article

Estimating printed circuit board assembly times using neural networks.

Published in:

International Journal of Production Research, 2010, v. 48, n. 8, p. 2201, doi. 10.1080/00207540802572574

By:

Vainio, Frans;
Maier, Michael;
Knuutila, Timo;
Alhoniemi, Esa;
Johnsson, Mika;
Nevalainen, Olli S.

Publication type:

Article

Planar realization of a Q-band triple-mode filter using high-order resonances.

Published in:

Microwave & Optical Technology Letters, 2009, v. 51, n. 3, p. 600, doi. 10.1002/mop.24114

By:

Dong, Yuandan;
Hong, Wei;
Tang, Hongjun;
Chen, Jixin;
Wu, Ke

Publication type:

Article

Encapsulation of nonmetallic fractions recovered from printed circuit boards waste with thermoplastic.

Published in:

Journal of the Air & Waste Management Association (Taylor & Francis Ltd), 2014, v. 64, n. 9, p. 1085, doi. 10.1080/10962247.2014.911221

By:

Muniyandi, Shantha Kumari;
Sohaili, Johan;
Hassan, Azman

Publication type:

Article

A Novel Photoplethysmography Sensor for Vital Signs Monitoring from the Human Trachea.

Published in:

Biosensors (2079-6374), 2019, v. 9, n. 4, p. 119, doi. 10.3390/bios9040119

By:

May, James M.;
Phillips, Justin P.;
Fitchat, Tracey;
Ramaswamy, Shankar;
Snidvongs, Saowarat;
Kyriacou, Panayiotis A.

Publication type:

Article

NEW NASA METHOD SPOTS FAILING INFRASTRUCTURE FROM SPACE.

Published in:: Advanced Materials & Processes, 2019, v. 177, n. 6, p. 12
Publication type:: Article

MODELING OF GRINDING PROCESS BY PRINTED CIRCUIT BOARDS RECYCLING.

Published in:

Annals of DAAAM & Proceedings, 2010, p. 475

By:

Charvatova, H.

Publication type:

Article

FABS and LABS.

Published in:: Microwave Journal, 2015, v. 58, n. 10, p. 162
Publication type:: Article

丙烯酸树脂活化银胶的制备、结构与性能.

Published in:

Journal of Functional Polymers, 2018, v. 31, n. 6, p. 609, doi. 10.14133/j.cnki.1008-9357.20180304001

By:

聂旭坤;
方斌;
袁双龙;
梁莹

Publication type:

Article

The influence of the PCB design and the process of their manufacturing on the possibility of a defect-free production.

Published in:

Przegląd Elektrotechniczny, 2021, v. 97, n. 3, p. 91, doi. 10.15199/48.2021.03.18

By:

VASILYEV, Fedor;
ISAEV, Vladimir;
KOROBKOV, Maksim

Publication type:

Article

Techniki szybkiego wytwarzania prototypowych obwodów drukowanych.

Published in:

Przegląd Elektrotechniczny, 2019, v. 95, n. 9, p. 165, doi. 10.15199/48.2019.09.35

By:

DĄBROWSKI, Jacek

Publication type:

Article

Frequency Shift in Microwave Circuits Manufactured with Circuit Board Plotters: Case Study of a Parallel Coupled Lines Filter.

Published in:

Electronics (2079-9292), 2024, v. 13, n. 15, p. 3100, doi. 10.3390/electronics13153100

By:

Ferro, Luigi;
Cardillo, Emanuele

Publication type:

Article

Enhancement of Product-Inspection Accuracy Using Convolutional Neural Network and Laplacian Filter to Automate Industrial Manufacturing Processes.

Published in:

Electronics (2079-9292), 2023, v. 12, n. 18, p. 3795, doi. 10.3390/electronics12183795

By:

Jun, Hyojae;
Jung, Im Y.

Publication type:

Article

Transcriptome Analysis of Cyanide-Treated Rice Seedlings: Insights into Gene Functional Classifications.

Published in:

Life (2075-1729), 2022, v. 12, n. 11, p. 1701, doi. 10.3390/life12111701

By:

Li, Cheng-Zhi;
Lin, Yu-Juan;
Yu, Xiao-Zhang

Publication type:

Article

Analyzing Investment Regions in Mainland China for Taiwanese Firms by Association Rule Mining.

Published in:

Asia Pacific Management Review, 2013, v. 18, n. 2, p. 143, doi. 10.6126/APMR.2013.18.2.02

By:

Yi-Chung Hu;
Jan-Yan Lin;
Lin, Angel

Publication type:

Article

PCB Defect Classification with Data Augmentation-Based Ensemble Method for Sustainable Smart Manufacturing.

Published in:

Sustainability (2071-1050), 2024, v. 16, n. 23, p. 10417, doi. 10.3390/su162310417

By:

Jang, Jaeseok;
Tang, Qing;
Jung, Hail

Publication type:

Article

The evolution of Industry 4.0, through the eyes of the PCB manufacturer.

Published in:

EE: Evaluation Engineering, 2017, v. 56, n. 7, p. 20

By:

Spinzi, Shavi

Publication type:

Article