Reduction of the small gain condition for large-scale interconnections.
- Published in:
- International Journal of Robust & Nonlinear Control, 2015, v. 25, n. 6, p. 842, doi. 10.1002/rnc.3111
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- Publication type:
- Article
Works matching DE "PRINTED circuit interconnections"
Results: 7
1
2
Boundary scan pioneers go deep.
- Published in:
- EE: Evaluation Engineering, 2015, v. 54, n. 5, p. 18
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- Publication type:
- Article
3
Elevated Standoff Heights of Solder Joint Interconnections Can Result in Appreciable Stress and Warpage Relief.
- Published in:
- Journal of Microelectronic & Electronic Packaging, 2019, v. 16, n. 1, p. 13, doi. 10.4071/imaps.735566
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- Publication type:
- Article
4
Ultra Low Weight Spacer for PCB to PCB Interconnections.
- Published in:
- Journal of Microelectronic & Electronic Packaging, 2014, v. 11, n. 1, p. 42, doi. 10.4071/imaps.396
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- Publication type:
- Article
5
Energy-efficient and temperature-stable oxide-confined 980 nm VCSELs operating error-free at 38 Gbit/s at 85°C.
- Published in:
- Electronics Letters (Wiley-Blackwell), 2014, v. 50, n. 2, p. 1, doi. 10.1049/el.2013.3941
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- Publication type:
- Article
6
Surface and Electrical Characterization of Ag/AgCl Pseudo-Reference Electrodes Manufactured with Commercially Available PCB Technologies.
- Published in:
- Sensors (14248220), 2015, v. 15, n. 8, p. 18102, doi. 10.3390/s150818102
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- Publication type:
- Article
7
DPI With Integrated Current and Voltage Measurement.
- Published in:
- Microwave Journal, 2016, p. 24
- By:
- Publication type:
- Article