Simultaneous Switching Noise Enabler in High-Speed Biomedical Systems by Integrated Plane Coupling.
- Published in:
- Instrumentation Science & Technology, 2015, v. 43, n. 5, p. 497, doi. 10.1080/10739149.2015.1017767
- By:
- Publication type:
- Article
Works matching DE "PRINTED circuit equipment"
Results: 11
1
2
An Assessment of Immersion Silver Surface Finish for Lead-Free Electronics.
- Published in:
- Journal of Electronic Materials, 2009, v. 38, n. 6, p. 815, doi. 10.1007/s11664-009-0761-z
- By:
- Publication type:
- Article
3
Intermetallic Compound Formation and Evolution in Solid-State Sn/Immersion-Ag/Cu Trilayer Interfacial Reactions on a Flexible Polymer Board.
- Published in:
- Journal of Electronic Materials, 2009, v. 38, n. 6, p. 908, doi. 10.1007/s11664-009-0778-3
- By:
- Publication type:
- Article
4
Systematic design method of a mobile multiple antenna system using the theory of characteristic modes.
- Published in:
- IET Microwaves, Antennas & Propagation (Wiley-Blackwell), 2014, v. 8, n. 12, p. 887, doi. 10.1049/iet-map.2013.0534
- By:
- Publication type:
- Article
5
Ultimate noise isolation in high-speed digital systems on packages and printed circuit boards.
- Published in:
- Electronics Letters (Wiley-Blackwell), 2013, v. 49, n. 9, p. 1, doi. 10.1049/el.2012.4303
- By:
- Publication type:
- Article
6
Optimization of Solder Volume in Printed Circuit Board Assembly Through an Operating Window Experiment-A Case Study.
- Published in:
- Experimental Techniques, 2017, v. 41, n. 3, p. 309, doi. 10.1007/s40799-017-0168-3
- By:
- Publication type:
- Article
7
Visual positioning for round pin chips based on a parametric deformable template.
- Published in:
- Optical Engineering, 2014, v. 53, n. 5, p. 1, doi. 10.1117/1.OE.53.5.053110
- By:
- Publication type:
- Article
8
New Thermoset PCB Material Emerging for mmWave Applications.
- Published in:
- Microwave Journal, 2015, v. 58, n. 2, p. 24
- By:
- Publication type:
- Article
9
Chokes.
- Published in:
- 2016
- Publication type:
- Product Review
10
RESEARCHING THE MASS, SIZE AND THERMAL CHARACTERISTICS OF ELECTRONIC DEVICE SEALED UNIT.
- Published in:
- Radio Electronics, Computer Science, Control, 2013, n. 2, p. 42, doi. 10.15588/1607-3274-2013-2-7
- By:
- Publication type:
- Article
11
Development and assembly of Radio Frequency Module using components with SMD technology for educational purposes.
- Published in:
- Latin-American Journal of Physics Education, 2017, v. 11, n. 1, p. 1
- By:
- Publication type:
- Article