Works matching DE "PRINTED circuit design"
Results: 314
Design and Development of Sensing Unit for Wire Rope Tester.
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- IETE Journal of Research, 2025, v. 71, n. 1, p. 211, doi. 10.1080/03772063.2024.2409716
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- Article
A modified relay-race algorithm for floorplanning in PCB and IC design.
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- Turkish Journal of Electrical Engineering & Computer Sciences, 2020, v. 28, n. 2, p. 679, doi. 10.3906/elk-1903-122
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- Article
基于可变形残差卷积与伸缩式特征金字塔 算法的 PCB 缺陷检测.
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- Telecommunication Engineering, 2023, v. 63, n. 6, p. 798, doi. 10.20079/j.issn.1001-893x.220217002
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- Article
一种宽频段软件无线电平台的设计与实现.
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- Telecommunication Engineering, 2022, v. 62, n. 7, p. 898, doi. 10.3969/j.issn.1001-893x.2022.07.009
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- Article
МОДЕЛЬ И МЕТОД ОПРЕДЕЛЕНИЯ РАЗМЕРОВ ПЕЧАТНЫХ ПЛАТ С УЧЕТОМ МНОЖЕСТВА ФАКТОРОВ
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- Radio Electronics, Computer Science, Control, 2020, n. 1, p. 18, doi. 10.15588/1607-3274-2020-1-2
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- Article
Design of a New Modular Reconfigurable Gripper.
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- TEM Journal, 2022, v. 11, n. 2, p. 763, doi. 10.18421/TEM112-33
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- Article
Design of Printed Circuit Board Production using Water Jet Technology.
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- TEM Journal, 2019, v. 8, n. 4, p. 1313, doi. 10.18421/TEM84-30
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- Article
Design and implementation of AEM10941 based solar energy system harvester for domestic lighting as a sustainable lighting solution for rural areas.
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- Scientific Reports, 2024, v. 14, n. 1, p. 1, doi. 10.1038/s41598-024-64641-0
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- Article
Sensitive Detection of Oral Leukoplakia: Analyzing P90 Biomarkers in Saliva and Tissue.
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- Biosensors (2079-6374), 2024, v. 14, n. 6, p. 281, doi. 10.3390/bios14060281
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- Article
An Open-Hardware Insemination Device for Small-Bodied Live-Bearing Fishes to Support Development and Use of Germplasm Repositories.
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- Animals (2076-2615), 2022, v. 12, n. 8, p. N.PAG, doi. 10.3390/ani12080961
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- Article
ASSESSING COMPATIBILITY OF ADVANCED IC PACKAGES TO X-RAY BASED PHYSICAL INSPECTION.
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- Electronic Device Failure Analysis, 2024, v. 26, n. 3, p. 14, doi. 10.31399/asm.edfa.2024-3.p014
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- Article
HIGH SPEED X-RAY TOMOGRAPHY WITH SUBMICRON RESOLUTION FOR FA AND REVERSE ENGINEERING OF PACKAGES, PCBs, AND 300 mm WAFERS.
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- Electronic Device Failure Analysis, 2022, v. 24, n. 3, p. 32, doi. 10.31399/asm.edfa.2022-3.p032
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- Article
PHYSICAL SECURITY ROADMAP FOR HETEROGENEOUS INTEGRATION TECHNOLOGY.
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- Electronic Device Failure Analysis, 2022, v. 24, n. 2, p. 24, doi. 10.31399/asm.edfa.2022-2.p024
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- Article
FAILURE ANALYSIS FOR HARDWARE ASSURANCE AND SECURITY.
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- Electronic Device Failure Analysis, 2019, v. 21, n. 3, p. 16, doi. 10.31399/asm.edfa.2019-3.p016
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- Article
Opportunities for High Frequency Materials in 5G and the IoT.
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- Microwave Journal, 2017, v. 60, n. 1, p. 88
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- Article
Printed Circuit Board (PCB) Laminate.
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- Microwave Journal, 2015, v. 58, n. 2, p. 154
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- Article
New Thermoset PCB Material Emerging for mmWave Applications.
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- Microwave Journal, 2015, v. 58, n. 2, p. 24
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- Article
Proper Stack-Up in a Multilayer PCB to Reduce Noise Coupling and Improve EMI.
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- Microwave Journal, 2012, v. 55, n. 2, p. 70
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- Article
All-passive microwave-diode nonreciprocal metasurface.
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- Communications Physics, 2023, v. 6, n. 1, p. 1, doi. 10.1038/s42005-023-01445-0
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- Article
基于 ADS 和 HFSS 的矿井 UWB 射频前端电磁联合仿真方法.
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- Journal of Mine Automation, 2023, v. 49, n. 2, p. 85, doi. 10.13272/j.issn.1671-251x.18073
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- Article
Advances in Producing Functional Circuits on Biodegradable PCBs.
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- Periodica Polytechnica: Electrical Engineering & Computer Science, 2016, v. 60, n. 4, p. 223, doi. 10.3311/PPee.9690
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- Article
Numerical Modeling and Structure Optimization for Magnetic Levitation Planar Machine Using PCB Coils.
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- Actuators, 2025, v. 14, n. 1, p. 33, doi. 10.3390/act14010033
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- Article
60 GHz 개구면 결합 패치 안테나의 기판 위치에 따른 이득 변화 및 주기적 특성.
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- Journal of Korean Institute of Electromagnetic Engineering & Science / Han-Guk Jeonjapa Hakoe Nonmunji, 2019, v. 30, n. 10, p. 803, doi. 10.5515/KJKIEES.2019.30.10.803
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- Article
Efficient hybrid group search optimizer for assembling printed circuit boards.
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- AI EDAM, 2019, v. 33, n. 3, p. 259, doi. 10.1017/S0890060418000240
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- Article
Über die Detektierbarkeit von Objekten in Bildern mittels quantisierter neuronaler Netze.
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- Technisches Messen, 2019, v. 86, n. 11, p. 651, doi. 10.1515/teme-2019-0068
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- Article
DESIGN OF HIGH PERFORMANCE PULSE GENERATOR TO PERFORM AUTOMATIC TEST IN VLSI CIRCUITS.
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- i-Manager's Journal on Electronics Engineering, 2019, v. 9, n. 3, p. 26, doi. 10.26634/jele.9.3.15953
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- Article
Using Deep Learning to Automatic Inspection System of Printed Circuit Board in Manufacturing Industry under the Internet of Things.
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- Computer Science & Information Systems, 2023, v. 20, n. 2, p. 723, doi. 10.2298/CSIS220718020Z
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- Article
SolderNet: Towards trustworthy visual inspection of solder joints in electronics manufacturing using explainable artificial intelligence.
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- AI Magazine, 2023, v. 44, n. 4, p. 442, doi. 10.1002/aaai.12129
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- Article
Development of real-time Internet of Things motion detection platform applying non-contact sensor based on open source hardware.
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- International Journal of Distributed Sensor Networks, 2020, v. 16, n. 7, p. 1, doi. 10.1177/1550147720944024
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- Article
A lamination-based piezoelectric insole gait analysis system for massive production for Internet-of-health things.
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- International Journal of Distributed Sensor Networks, 2020, v. 16, n. 3, p. 1, doi. 10.1177/1550147720905431
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- Article
Four-Channels High-Resolution Frequency Counter for QCM Sensor Array Using Generic FPGA XC6SLX9 Board.
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- Journal of Electrical & Computer Engineering, 2023, p. 1, doi. 10.1155/2023/5182455
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- Article
Evaluation and Implementation of EMI/EMC Compliance for a Proposed Power Electronics-Based Converter Topology for Electric Vehicles.
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- Electronics & Electrical Engineering, 2024, v. 30, n. 5, p. 22, doi. 10.5755/j02.eie.38216
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- Article
Design and Implementation of a New Monitoring System for Electrical Energy Consumption with Smart Metering based on Intenet of Things (IoT).
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- International Journal of Simulation: Systems, Science & Technology, 2019, v. 20, n. 2, p. 1, doi. 10.5013/IJSSST.a.20.02.11
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- Article
Design of a Power Converter Based on UC3842 for Blade Electric Vehicle.
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- International Journal of Simulation: Systems, Science & Technology, 2016, v. 17, n. 33, p. 1, doi. 10.5013/IJSSST.a.17.33.20
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- Article
Evaluation of the effect of size reduction and thermal treatment on metal extraction from PCBs of mother board and digital video drive of desktop PC.
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- Current Science (00113891), 2016, v. 110, n. 5, p. 800, doi. 10.18520/cs/v110/i5/800-807
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- Article
240 GHz Silicon Transceiver for Automotive Radar Systems.
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- Microwave Journal, 2024, v. 67, n. 10, p. 94
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- Article
PCB Design for Multichannel Beamformer RF Integrated Circuits.
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- Microwave Journal, 2024, v. 67, n. 10, p. 56
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- Article
NEW PRODUCTS.
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- 2024
- Publication type:
- Product Review
NEW PRODUCTS.
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- 2024
- Publication type:
- Product Review
Aerospace and Defense Applications Push Connector Boundaries and Require New Solutions.
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- Microwave Journal, 2023, v. 66, n. 12, p. 68
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- Article
The 5G CAN: A Scalable Dual-Polarized Omnidirectional Tx/Rx Front-end Module.
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- Microwave Journal, 2023, v. 66, n. 8, p. 100
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- Article
How to Reliably Align Compression Connectors for mmWave Applications.
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- Microwave Journal, 2023, v. 66, n. 3, p. 70
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- Article
Handheld Spectrum Analyzer Balances Price and Performance.
- Published in:
- 2023
- Publication type:
- Product Review
Around the Circuit.
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- Microwave Journal, 2023, v. 66, n. 1, p. 42
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- Article
mmWave CMOS Integration Enables Fixed Wireless Access in Unlicensed Bands.
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- Microwave Journal, 2022, v. 65, n. 12, p. 58
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- Article
Anatomy of the 5G Small Cell.
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- Microwave Journal, 2022, v. 65, n. 5, p. 24
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- Article
Embedded PCB Antennas for IoT: Design and Implementation Considerations.
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- Microwave Journal, 2021, v. 64, n. 11, p. 84
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- Article
Cadence AWR Design Environment Version 16 Enables Integration of Heterogenous Technologies.
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- Microwave Journal, 2021, v. 64, n. 7, p. 38
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- Article
Simulation-Driven Virtual Prototyping of Smart Products.
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- Microwave Journal, 2021, v. 64, n. 7, p. 22
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- Article
Packaging Technology Key to Enabling mmWave Antenna Arrays.
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- Microwave Journal, 2020, v. 63, n. 9, p. 62
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- Article