Cyanate Ester-Based Encapsulation Material for High-Temperature Applications.
- Published in:
- Journal of Electronic Materials, 2013, v. 42, n. 9, p. 2803, doi. 10.1007/s11664-013-2665-1
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- Publication type:
- Article
Works matching DE "POTTING compounds (Electronics)"
Results: 4
1
2
Identification of markers for PCB exposure in plasma from Swedish construction workers removing old elastic sealants.
- Published in:
- Annals of Occupational Hygiene, 2006, v. 50, n. 1, p. 65, doi. 10.1093/annhyg/mei063
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- Publication type:
- Article
3
Measuring Selected Parameters of Polypropylene Fibre Heat Exchangers.
- Published in:
- Journal of Mechanical Engineering / Strojniški Vestnik, 2016, v. 62, n. 6, p. 381, doi. 10.5545/sv-jme.2015.3202
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- Publication type:
- Article
4
An architecture of small-scaled neuro-hardware using probabilistically coded pulse neurons.
- Published in:
- Electrical Engineering in Japan, 2002, v. 139, n. 4, p. 48, doi. 10.1002/eej.1168
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- Publication type:
- Article