Works matching DE "PLATING baths"


Results: 478
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    Void-free copper deposition.

    Published in:
    Solid State Technology, 2001, v. 44, n. 11, p. 97
    By:
    • Su, Zhi-Wen;
    • Dixit, Girish
    Publication type:
    Article
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    Electrodeposition of tin: a simple approach.

    Published in:
    Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 6, p. 553, doi. 10.1007/s10854-007-9385-3
    By:
    • He, Anqiang;
    • Liu, Qi;
    • Ivey, Douglas G.
    Publication type:
    Article
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    碳纤维化学镀银工艺.

    Published in:
    Electroplating & Finishing, 2023, v. 42, n. 3, p. 1, doi. 10.19289/j.1004-227x.2023.03.001
    By:
    • 路杨;
    • 付翀;
    • 李旭;
    • 周雄飞;
    • 刘宇昕;
    • 李振阳
    Publication type:
    Article
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    添加剂对 ABS 化学镀铜的影响.

    Published in:
    Electroplating & Finishing, 2022, v. 41, n. 21, p. 1510, doi. 10.19289/j.1004-227x.2022.21.004
    By:
    • 程熠;
    • 宋晅;
    • 朱皓;
    • 赵文霞;
    • 回凯宏;
    • 李鑫巍;
    • 刘欣;
    • 陈怀军
    Publication type:
    Article