Works matching DE "PLASTIC embedment of electronic equipment"
Results: 154
Failure detectors encapsulate fairness.
- Published in:
- Distributed Computing, 2012, v. 25, n. 4, p. 313, doi. 10.1007/s00446-012-0164-x
- By:
- Publication type:
- Article
Structural integrity investigations of spent nuclear fuel with finite element modeling.
- Published in:
- Safety of Nuclear Waste Disposal, 2021, v. 1, p. 13, doi. 10.5194/sand-1-13-2021
- By:
- Publication type:
- Article
Injection moulding of high precision optics for light-emitting diodes made of liquid silicone rubber.
- Published in:
- Journal of Elastomers & Plastics, 2017, v. 49, n. 1, p. 62, doi. 10.1177/0095244315627856
- By:
- Publication type:
- Article
Pulsed electric field-induced remote decapsulation of nanocomposite liposomes with implanted conducting nanoparticles.
- Published in:
- Journal of Communications Technology & Electronics, 2015, v. 60, n. 10, p. 1097, doi. 10.1134/S1064226915100034
- By:
- Publication type:
- Article
Temporal dynamics of the encapsulation response towards a synthetic immune challenge in Acheta domesticus.
- Published in:
- Physiological Entomology, 2007, v. 32, n. 3, p. 240, doi. 10.1111/j.1365-3032.2007.00572.x
- By:
- Publication type:
- Article
Combining Encryption and Proof of Knowledge in the Random Oracle Model.
- Published in:
- Computer Journal, 2004, v. 47, n. 1, p. 58, doi. 10.1093/comjnl/47.1.58
- By:
- Publication type:
- Article
What is a reed relay?
- Published in:
- EE: Evaluation Engineering, 2016, v. 55, n. 4, p. 18
- By:
- Publication type:
- Article
Local endostatin treatment of gliomas administered by microencapsulated producer cells.
- Published in:
- Nature Biotechnology, 2001, v. 19, n. 1, p. 29, doi. 10.1038/83471
- By:
- Publication type:
- Article
Synthesis and Enhanced Field-Emission of Thin-Walled, Open-Ended, and Well-Aligned N-Doped Carbon Nanotubes.
- Published in:
- Nanoscale Research Letters, 2010, v. 5, n. 6, p. 941, doi. 10.1007/s11671-010-9586-1
- By:
- Publication type:
- Article
Encapsulación de Aditivos para la Industria de Alimentos.
- Published in:
- Ingeniería y Competitividad, 2004, v. 5, n. 2, p. 73
- By:
- Publication type:
- Article
Meeting High-Power and High Frequency Challenges with Adhesives and Potting Compounds.
- Published in:
- Microwave Journal, 2018, v. 61, n. 1, p. 96
- By:
- Publication type:
- Article
Izvlečki.
- Published in:
- 2011
- Publication type:
- Abstract
Foldable and washable textile-based OLEDs with a multi-functional near-room-temperature encapsulation layer for smart e-textiles.
- Published in:
- NPJ Flexible Electronics, 2021, v. 5, n. 1, p. 1, doi. 10.1038/s41528-021-00112-0
- By:
- Publication type:
- Article
Plastic zone size estimation under cyclic loadings using in situ optical microscopy fatigue testing.
- Published in:
- Fatigue & Fracture of Engineering Materials & Structures, 2011, v. 34, n. 9, p. 717, doi. 10.1111/j.1460-2695.2011.01567.x
- By:
- Publication type:
- Article
Key recovery for the commercial environment.
- Published in:
- International Journal of Information Security, 2002, v. 1, n. 3, p. 161, doi. 10.1007/s10207-002-0014-0
- By:
- Publication type:
- Article
Determining the Thermal Resistance of Buried and/or Encapsulated Ducts.
- Published in:
- ASHRAE Transactions, 2013, v. 119, n. 2, p. 1
- By:
- Publication type:
- Article
REZULTATUL CERCETĂRILOR TEORETICE ŞI EXPERIMENTALE PRIVIND ASAMBLAREA DISPOZITIVELOR ELECTRICE DE APRINDERE PRIN PROCEDEUL R.P.K.
- Published in:
- Fiability & Durability / Fiabilitate si Durabilitate, 2009, n. 2, p. 33
- By:
- Publication type:
- Article
Mikrokapsül uygulanmış kumaşı Chitosan ile kaplamanın mikrokapsüllerin yıkama dayanımı üzerine etkileri.
- Published in:
- ITU Journal Series D: Engineering, 2010, v. 9, n. 2, p. 135
- By:
- Publication type:
- Article
UNIFIED COHESION MEASURES FOR ASPECT-ORIENTED SYSTEMS.
- Published in:
- International Journal of Software Engineering & Knowledge Engineering, 2011, v. 21, n. 1, p. 143, doi. 10.1142/S0218194011005128
- By:
- Publication type:
- Article
FSI ANALYSIS OF WIRE SWEEP IN ENCAPSULATION PROCESS OF PLASTIC BALL GRID ARRAY PACKAGING.
- Published in:
- Journal of Thermal Science & Technology / Isı Bilimi ve Tekniği Dergisi, 2013, v. 33, n. 1, p. 101
- By:
- Publication type:
- Article
Metal Ceramic Segmented Ring Transducer under Deep Submergence Conditions.
- Published in:
- Defence Science Journal, 2017, v. 67, n. 6, p. 612, doi. 10.14429/dsj.67.11201
- By:
- Publication type:
- Article
High‐temperature thin‐film barriers for foldable AMOLED displays.
- Published in:
- Journal of the Society for Information Display, 2018, v. 26, n. 4, p. 214, doi. 10.1002/jsid.647
- By:
- Publication type:
- Article
Sir Georg Solti and the Record Industry.
- Published in:
- ARSC Journal, 2010, v. 41, n. 2, p. 200
- By:
- Publication type:
- Article
A New Computer Architecture Supporting Object-Oriented Programming.
- Published in:
- International Review on Computers & Software, 2013, v. 8, n. 1, p. 174
- By:
- Publication type:
- Article
Improving performance and energy efficiency of embedded processors via post-fabrication instruction set customization.
- Published in:
- Journal of Supercomputing, 2012, v. 60, n. 2, p. 196, doi. 10.1007/s11227-010-0505-0
- By:
- Publication type:
- Article
The preparation of organic light-emitting diode encapsulation barrier layer by low-temperature plasma-enhanced chemical vapor deposition: a study on the $$\hbox {SiO}_\mathrm{x}\hbox {N}_\mathrm{y}$$ film parameter optimization.
- Published in:
- Journal of Intelligent Manufacturing, 2016, v. 27, n. 3, p. 581, doi. 10.1007/s10845-014-0893-8
- By:
- Publication type:
- Article
China set to make fusion history.
- Published in:
- Nature, 2006, v. 442, n. 7105, p. 853, doi. 10.1038/442853a
- By:
- Publication type:
- Article
30 Years of Sensors' Assembly and Packaging 1988 to 2018.
- Published in:
- Sensors & Materials, 2018, v. 30, n. 9, p. 1935, doi. 10.18494/SAM.2018.1859
- By:
- Publication type:
- Article
Secure certificate-based encryption against entropy and key leakage.
- Published in:
- Application Research of Computers / Jisuanji Yingyong Yanjiu, 2014, v. 31, n. 1, p. 210, doi. 10.3969/j.issn.1001-3695.2014.01.049
- By:
- Publication type:
- Article
Adhesion of underfill and components in flip chip encapsulation.
- Published in:
- Journal of Adhesion Science & Technology, 2002, v. 16, n. 2, p. 213, doi. 10.1163/156856102317293713
- By:
- Publication type:
- Article
An architecture of small-scaled neuro-hardware using probabilistically coded pulse neurons.
- Published in:
- Electrical Engineering in Japan, 2002, v. 139, n. 4, p. 48, doi. 10.1002/eej.1168
- By:
- Publication type:
- Article
An orthogonal array based genetic algorithm for developing neural network based process models of fluid dispensing.
- Published in:
- International Journal of Production Research, 2006, v. 44, n. 22, p. 4815, doi. 10.1080/00207540600620880
- By:
- Publication type:
- Article
Fuzzy regression approach to process modelling and optimization of epoxy dispensing.
- Published in:
- International Journal of Production Research, 2005, v. 43, n. 12, p. 2359, doi. 10.1080/00207540500046137
- By:
- Publication type:
- Article
Water Vapor-Impermeable AlON/HfO x Bilayer Films Deposited by Hybrid High-Power Impulse Magnetron Sputtering/Radio-Frequency Magnetron Sputtering Processes.
- Published in:
- Materials (1996-1944), 2024, v. 17, n. 22, p. 5453, doi. 10.3390/ma17225453
- By:
- Publication type:
- Article
DC electrical stimulation enhances proliferation and differentiation on N2a and MC3T3 cell lines.
- Published in:
- Journal of Biological Engineering, 2022, v. 16, n. 1, p. 1, doi. 10.1186/s13036-022-00306-8
- By:
- Publication type:
- Article
An Embedded Control Software Development Environment with Simulink Models and UML Models.
- Published in:
- IAENG International Journal of Computer Science, 2012, v. 39, n. 3, p. 261
- By:
- Publication type:
- Article
Biodegradable baked foam made with chayotextle starch mixed with plantain flour and wood fiber.
- Published in:
- Journal of Applied Polymer Science, 2017, v. 134, n. 48, p. n/a, doi. 10.1002/app.45565
- By:
- Publication type:
- Article
Teaching Kinematics and Dynamics of Multibody Mechanical System Using the Object Oriented Language Modelica.
- Published in:
- International Journal of Online Engineering, 2009, v. 5, p. 33, doi. 10.3991/ijoe.v5s2.1096
- By:
- Publication type:
- Article
Benefits of Sophisticated Motor & Drive Technologies.
- Published in:
- Chemical Engineering, 2017, v. 124, n. 6, p. 26
- Publication type:
- Article
Flexible organic transistors and circuits with extreme bending stability.
- Published in:
- Nature Materials, 2010, v. 9, n. 12, p. 1015, doi. 10.1038/nmat2896
- By:
- Publication type:
- Article
Modeling embroidered contacts for electronics in textiles.
- Published in:
- Journal of the Textile Institute, 2012, v. 103, n. 6, p. 644, doi. 10.1080/00405000.2011.597568
- By:
- Publication type:
- Article
PROTOCOL LAYERING AND INTERNET POLICY.
- Published in:
- University of Pennsylvania Law Review, 2013, v. 161, n. 6, p. 1707
- By:
- Publication type:
- Article
FRACTURE MECHANICAL CHARACTERIZATION OF IC-DEVICE INTERFACES.
- Published in:
- Quality & Reliability Engineering International, 1995, v. 11, n. 4, p. 299, doi. 10.1002/qre.4680110415
- By:
- Publication type:
- Article
Reports from DELTA.
- Published in:
- Quality & Reliability Engineering International, 1994, v. 10, n. 3, p. 244
- Publication type:
- Article
FAILURE ANALYSIS OF MULTILEVEL METALLIZED LSI USING OPTICAL BEAM INDUCED CURRENT.
- Published in:
- Quality & Reliability Engineering International, 1992, v. 8, n. 3, p. 239, doi. 10.1002/qre.4680080311
- By:
- Publication type:
- Article
ENVIRONMENTAL TESTING AND COMPONENT RELIABILITY OBSERVATIONS OF TELECOMMUNICATIONS EQUIPMENT OPERATED IN TROPICAL CLIMATIC. CONDITIONS.
- Published in:
- Quality & Reliability Engineering International, 1992, v. 8, n. 3, p. 189, doi. 10.1002/qre.4680080306
- By:
- Publication type:
- Article
PLASTIC ENCAPSULATED ICs IN MILITARY EQUIPMENT RELIABILITY PREDICTION MODELLING.
- Published in:
- Quality & Reliability Engineering International, 1992, v. 8, n. 3, p. 195, doi. 10.1002/qre.4680080307
- By:
- Publication type:
- Article
HUMIDITY ACCELERATION FACTOR FOR PLASTIC PACKAGED ELECTRONIC DEVICES.
- Published in:
- Quality & Reliability Engineering International, 1991, v. 7, n. 5, p. 365, doi. 10.1002/qre.4680070505
- By:
- Publication type:
- Article
A RAPID TECHNIQUE FOR ASSESSING THE MOISTURE INGRESS SUSCEPTIBILITY OF PLASTIC- ENCAPSULATED INTEGRATED CIRCUITS.
- Published in:
- Quality & Reliability Engineering International, 1987, v. 3, n. 3, p. 185, doi. 10.1002/qre.4680030309
- By:
- Publication type:
- Article
Reliability Analysis Center (U.S.A.) Study of Effects of IC Quality.
- Published in:
- Quality & Reliability Engineering International, 1985, v. 1, n. 3, p. 216, doi. 10.1002/qre.4680010320
- Publication type:
- Article