Works matching DE "PLASTIC embedment of electronic equipment"

Results: 160

A graphical peak analysis method for characterizing impurities in SiC, GaN and diamond from temperature-dependent majority-carrier concentration.

Published in:

Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 8/9, p. 720, doi. 10.1007/s10854-007-9390-6

By:

Matsuura, Hideharu

Publication type:

Article

30 Years of Sensors' Assembly and Packaging 1988 to 2018.

Published in:

Sensors & Materials, 2018, v. 30, n. 9, p. 1935, doi. 10.18494/SAM.2018.1859

By:

Wilde, Juergen

Publication type:

Article

The use of polyimide-modified aluminum nitride fillers in AlN@PI/Epoxy composites with enhanced thermal conductivity for electronic encapsulation.

Published in:

Scientific Reports, 2014, p. 1, doi. 10.1038/srep04779

By:

Yongcun Zhou;
Yagang Yao;
Chia-Yun Chen;
Kyoungsik Moon;
Hong Wang;
Ching-ping Wong

Publication type:

Article

Accounting for data encapsulation in the measurement of object-oriented class cohesion.

Published in:

Journal of Software: Evolution & Process, 2015, v. 27, n. 5, p. 373, doi. 10.1002/smr.1714

By:

Al Dallal, Jehad

Publication type:

Article

Features of Formation of Ohmic Contacts and Gate on Epitaxial Heterostructure of AlGaN / GaN High Electron Mobility Transistor.

Published in:

Journal of Nano- & Electronic Physics, 2016, v. 8, n. 2, p. 1, doi. 10.21272/jnep.8(2).02044

By:

Rogachev, I. A.;
Knyazkov, A. V.;
Meshkov, O. I.;
Kurochka, A. S.

Publication type:

Article

Plastic zone size estimation under cyclic loadings using in situ optical microscopy fatigue testing.

Published in:

Fatigue & Fracture of Engineering Materials & Structures, 2011, v. 34, n. 9, p. 717, doi. 10.1111/j.1460-2695.2011.01567.x

By:

ZHANG, W.;
LIU, Y.

Publication type:

Article

ESRI Conference Serves Up GIS.

Published in:: 2003
Publication type:: Proceeding

Physical property characterization of single step synthesized NdFeAsOF bulk 50 K superconductor.

Published in:

European Physical Journal B: Condensed Matter, 2011, v. 79, n. 2, p. 139, doi. 10.1140/epjb/e2010-10674-x

By:

Awana, V. P.S.;
Meena, R. S.;
Pal, A.;
Vajpayee, A.;
Rao, K. V.R.;
Kishan, H.

Publication type:

Article

Solar Thermionic‐Thermoelectric Generator (ST<sup>2</sup>G): Concept, Materials Engineering, and Prototype Demonstration.

Published in:

Advanced Energy Materials, 2018, v. 8, n. 32, p. N.PAG, doi. 10.1002/aenm.201802310

By:

Trucchi, Daniele Maria;
Bellucci, Alessandro;
Girolami, Marco;
Calvani, Paolo;
Cappelli, Emilia;
Orlando, Stefano;
Polini, Riccardo;
Silvestroni, Laura;
Sciti, Diletta;
Kribus, Abraham

Publication type:

Article

Low Substrate Temperature Encapsulation for Flexible Electrodes and Organic Photovoltaics.

Published in:

Advanced Energy Materials, 2015, v. 5, n. 6, p. n/a, doi. 10.1002/aenm.201401442

By:

Chen, Nan;
Kovacik, Peter;
Howden, Rachel M.;
Wang, Xiaoxue;
Lee, Sunghwan;
Gleason, Karen K.

Publication type:

Article

Effects of the Encapsulating Resin on the Junction Temperature of the QFN16 and QFN32 Electronic Packages Subjected to Free Convection.

Published in:

Heat Transfer Engineering, 2018, v. 39, n. 4, p. 353, doi. 10.1080/01457632.2017.1305834

By:

Baïri, Abderrahmane;
Haddad, Oriana;
Guinart, Jean-Pascal;
Adeyeye, Kemi;
Alilat, Nacim

Publication type:

Article

Loading and selective release of cargo in DNA nanotubes with longitudinal variation.

Published in:

Nature Chemistry, 2010, v. 2, n. 4, p. 319, doi. 10.1038/nchem.575

By:

Pik Kwan Lo;
Karam, Pierre;
Aldaye, Faisal A.;
McLaughlin, Christopher K.;
Hamblin, Graham D.;
Cosa, Gonzalo;
Sleiman, Hanadi F.

Publication type:

Article

On the Construction of Public Key Encryption with Sender Recovery.

Published in:

International Journal of Foundations of Computer Science, 2015, v. 26, n. 1, p. 1, doi. 10.1142/S012905411550001X

By:

Wei, Puwen;
Zheng, Yuliang

Publication type:

Article

Local endostatin treatment of gliomas administered by microencapsulated producer cells.

Published in:

Nature Biotechnology, 2001, v. 19, n. 1, p. 29, doi. 10.1038/83471

By:

Read, Tracy-Ann;
Sorensen, Dag R.;
Mahesparan, Rupavathana;
Enger, Per Ø.;
Timpl, Rupert;
Olsen, Bjørn R.;
Hjelstuen, Mari H.B;
Haraldseth, Olav;
Bjerkvig, Rolf

Publication type:

Article

FRACTURE MECHANICAL CHARACTERIZATION OF IC-DEVICE INTERFACES.

Published in:

Quality & Reliability Engineering International, 1995, v. 11, n. 4, p. 299, doi. 10.1002/qre.4680110415

By:

Burger, K.

Publication type:

Article

Reports from DELTA.

Published in:: Quality & Reliability Engineering International, 1994, v. 10, n. 3, p. 244
Publication type:: Article

FAILURE ANALYSIS OF MULTILEVEL METALLIZED LSI USING OPTICAL BEAM INDUCED CURRENT.

Published in:

Quality & Reliability Engineering International, 1992, v. 8, n. 3, p. 239, doi. 10.1002/qre.4680080311

By:

Mitsuhashi, J.;
Komori, S.;
Tsubouchi, N.

Publication type:

Article

PLASTIC ENCAPSULATED ICs IN MILITARY EQUIPMENT RELIABILITY PREDICTION MODELLING.

Published in:

Quality & Reliability Engineering International, 1992, v. 8, n. 3, p. 195, doi. 10.1002/qre.4680080307

By:

Brizoux, M.;
Deleuze, G.

Publication type:

Article

ENVIRONMENTAL TESTING AND COMPONENT RELIABILITY OBSERVATIONS OF TELECOMMUNICATIONS EQUIPMENT OPERATED IN TROPICAL CLIMATIC. CONDITIONS.

Published in:

Quality & Reliability Engineering International, 1992, v. 8, n. 3, p. 189, doi. 10.1002/qre.4680080306

By:

Sinnadurai, Nihal;
Kuppuswamy, T. S.;
Chandramouli, R.;
Rao, B. K. N.

Publication type:

Article

HUMIDITY ACCELERATION FACTOR FOR PLASTIC PACKAGED ELECTRONIC DEVICES.

Published in:

Quality & Reliability Engineering International, 1991, v. 7, n. 5, p. 365, doi. 10.1002/qre.4680070505

By:

Klinger, David J.

Publication type:

Article

A RAPID TECHNIQUE FOR ASSESSING THE MOISTURE INGRESS SUSCEPTIBILITY OF PLASTIC- ENCAPSULATED INTEGRATED CIRCUITS.

Published in:

Quality & Reliability Engineering International, 1987, v. 3, n. 3, p. 185, doi. 10.1002/qre.4680030309

By:

Chwastek, E. J.;
Shaw, R. N.

Publication type:

Article

Reliability Analysis Center (U.S.A.) Study of Effects of IC Quality.

Published in:: Quality & Reliability Engineering International, 1985, v. 1, n. 3, p. 216, doi. 10.1002/qre.4680010320
Publication type:: Article

METHODS AND LIMITATIONS OF ASSESSING THE HERMETICITY OF SEMICONDUCTOR COMPONENT ENCAPSULATIONS.

Published in:

Quality & Reliability Engineering International, 1985, v. 1, n. 1, p. 3, doi. 10.1002/qre.4680010103

By:

Merrett, R. P.

Publication type:

Article

China set to make fusion history.

Published in:

Nature, 2006, v. 442, n. 7105, p. 853, doi. 10.1038/442853a

By:

Fuyuno, Ichiko

Publication type:

Article

Concept Analysis for Module Restructuring.

Published in:

IEEE Transactions on Software Engineering, 2001, v. 27, n. 4, p. 351, doi. 10.1109/32.917524

By:

Tonella, Paolo

Publication type:

Article

Thermomechanical Impact of Polyurethane Potting on Gun Launched Electronics.

Published in:

Journal of Engineering (2314-4912), 2013, p. 1, doi. 10.1155/2013/148362

By:

Haynes, A. S.;
Cordes, J. A.;
Krug, J.

Publication type:

Article

Secure certificate-based encryption against entropy and key leakage.

Published in:

Application Research of Computers / Jisuanji Yingyong Yanjiu, 2014, v. 31, n. 1, p. 210, doi. 10.3969/j.issn.1001-3695.2014.01.049

By:

YU Qi-hong;
LI Ji-guo

Publication type:

Article

New Products.

Published in:: 2012
Publication type:: Product Review

Reducing component stress during encapsulation of electronics: a simulative examination of thermoplastic foam injection molding.

Published in:

Journal of Polymer Engineering, 2023, v. 43, n. 2, p. 179, doi. 10.1515/polyeng-2022-0150

By:

Ott, Constantin;
Drummer, Dietmar

Publication type:

Article

Adhesion of underfill and components in flip chip encapsulation.

Published in:

Journal of Adhesion Science & Technology, 2002, v. 16, n. 2, p. 213, doi. 10.1163/156856102317293713

By:

Fan, Lianhua;
Moon, Kyoung-Sik;
Wong, C. P.

Publication type:

Article

Mejora de procesos para el desarrollo de dispositivos prostéticos de mano.

Published in:

Ingenium, 2010, n. 21, p. 92

By:

Cabrera, Juan Sebastián;
Jaramillo, Hector Fabio

Publication type:

Article

Advanced encapsulation for photovoltaics: where are the opportunities?

Published in:

Photovoltaics International, 2011, n. 11, p. 160

By:

Markowitz, Paul

Publication type:

Article

Luminescent encapsulation layers for multicrystalline silicon PV modules.

Published in:

Photovoltaics International, 2011, n. 11, p. 104

By:

Richards, Bryce S.;
Kiampaftis, Efthymios

Publication type:

Article

Encapsulation polymers -- a key issue in module reliability.

Published in:

Photovoltaics International, 2011, n. 11, p. 118

By:

Schulze, Stefan-H.;
Pander, Matthias;
Dietrich, Sascha;
Ebert, Matthias

Publication type:

Article

Trends and developments in the lamination process of PV modules (part 1).

Published in:

Photovoltaics International, 2009, n. 5, p. 160

By:

Osborne, Mark

Publication type:

Article

Uhderstanding moisture ingress and packaging requirements for photovoltaic modules.

Published in:

Photovoltaics International, 2009, n. 5, p. 121

By:

Dameron, Arrelaine A.;
Reese, Matthew O.;
Moricone, Thomas J.;
Kempe, Michael D.

Publication type:

Article

Converged Digital TV Services: The Role of Middleware and Future Directions of Interactive Television.

Published in:

International Journal of Digital Multimedia Broadcasting, 2009, v. 2009, p. 1, doi. 10.1155/2009/643680

By:

Tsekleves, Emmanuel;
Cosmas, John;
Aggoun, Amar;
Loo, Jonathan

Publication type:

Article

AL-FEC for Improved Mobile Reception of MPEG-2 DVB-T Transport Streams.

Published in:

International Journal of Digital Multimedia Broadcasting, 2009, v. 2009, p. 1, doi. 10.1155/2009/614178

By:

Gozálvez, David;
Gómez-Barquero, David;
Stockhammer, Thomas;
Luby, Michael

Publication type:

Article

What is a reed relay?

Published in:

EE: Evaluation Engineering, 2016, v. 55, n. 4, p. 18

By:

Dale, Graham

Publication type:

Article

Decorated Phrase Model and Syntax-Based Reordering Model for Statistical Machine Translation.

Published in:

International Journal of Fuzzy Systems, 2012, v. 14, n. 2, p. 314

By:

Huashen Liang;
Yongzeng Xue;
Tiejun Zhao

Publication type:

Article

Cyanate Ester-Based Encapsulation Material for High-Temperature Applications.

Published in:

Journal of Electronic Materials, 2013, v. 42, n. 9, p. 2803, doi. 10.1007/s11664-013-2665-1

By:

Chidambaram, Vivek;
Rong, Eric;
Lip, Gan;
Daniel, Rhee

Publication type:

Article

Pharmacokinetic modeling of paclitaxel encapsulation in Cremophor EL micelles.

Published in:

Cancer Chemotherapy & Pharmacology, 2001, v. 47, n. 4, p. 309, doi. 10.1007/s002800000215

By:

van Zuylen, Lia;
Karlsson, Mats O.;
Verweij, Jaap;
Brouwer, Eric;
de Bruijn, Peter;
Nooter, Kees;
Stoter, Gerrit;
Sparreboom, Alex

Publication type:

Article

Foldable and washable textile-based OLEDs with a multi-functional near-room-temperature encapsulation layer for smart e-textiles.

Published in:

NPJ Flexible Electronics, 2021, v. 5, n. 1, p. 1, doi. 10.1038/s41528-021-00112-0

By:

Jeong, So Yeong;
Shim, Hye Rin;
Na, Yunha;
Kang, Ki Suk;
Jeon, Yongmin;
Choi, Seungyeop;
Jeong, Eun Gyo;
Park, Yong Cheon;
Cho, Ha-Eun;
Lee, Junwoo;
Kwon, Jeong Hyun;
Im, Sung Gap;
Choi, Kyung Cheol

Publication type:

Article

An examination of household solid waste generation in a Mekong Delta City, Vietnam.

Published in:

Journal of Solid Waste Technology & Management, 2010, v. 36, n. 1, p. 526

By:

Thanh, Nguyen P.;
Matsui, Yasuhiro;
Fujiwara, Takeshi

Publication type:

Article

Aerodynamic Characteristics and Design Guidelines of Push–Pull Ventilation Systems.

Published in:

Annals of Occupational Hygiene, 2005, v. 49, n. 1, p. 1, doi. 10.1093/annhyg/meh065

By:

HUANG, R. F.;
LIN, S. Y.;
JAN, S.-Y.;
HSIEH, R. H.;
CHEN, Y.-K.;
CHEN, C.-W.;
YEH, W.-Y.;
CHANG, C.-P.;
SHIH, T.-S.;
CHEN, C.-C.

Publication type:

Article

Encapsulation of implantable integrated MEMS pressure sensors using polyimide epoxy composite and atomic layer deposition.

Published in:

Journal of Sensors & Sensor Systems, 2014, v. 3, n. 2, p. 335, doi. 10.5194/jsss-3-335-2014

By:

Gembaczka, P.;
Görtz, M.;
Celik, Y.;
Jupe, A.;
Stühlmeyer, M.;
Goehlich, A.;
Vogt, H.;
Mokwa, W.;
Kraft, M.

Publication type:

Article

Low-cost and prototype-friendly method for biocompatible encapsulation of implantable electronics with epoxy overmolding, hermetic feedthroughs and P3HT coating.

Published in:

Scientific Reports, 2023, v. 13, n. 1, p. 1, doi. 10.1038/s41598-023-28699-6

By:

Novák, Marek;
Rosina, Jozef;
Bendová, Hana;
Kejlová, Kristina;
Vlková, Alena;
Rucki, Marian;
Svobodová, Lada;
Gürlich, Robert;
Hajer, Jan

Publication type:

Article

Temporal dynamics of the encapsulation response towards a synthetic immune challenge in Acheta domesticus.

Published in:

Physiological Entomology, 2007, v. 32, n. 3, p. 240, doi. 10.1111/j.1365-3032.2007.00572.x

By:

RYDER, JONATHAN J.

Publication type:

Article

Fatigue lifetime study of piezoceramic patch transducers.

Published in:

Acta Mechanica, 2013, v. 224, n. 11, p. 2529, doi. 10.1007/s00707-013-0953-8

By:

Gall, Monika;
Thielicke, Bärbel

Publication type:

Article

Estimation of the time needed to set up a covert channel.

Published in:

Discrete Mathematics & Applications, 2003, v. 13, n. 3, p. 257, doi. 10.1515/156939203322385856

By:

Grusho, A. A.;
Timonina, E. E.

Publication type:

Article