Works matching DE "PLASTIC embedment of electronic equipment"
Results: 155
The effect of cooling press on the encapsulation properties of crystalline photovoltaic modules: residual stress and adhesion.
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- Progress in Photovoltaics, 2015, v. 23, n. 2, p. 160, doi. 10.1002/pip.2409
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Life prediction for CIGS solar modules part 2: degradation kinetics, accelerated testing, and encapsulant effects.
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- Progress in Photovoltaics, 2013, v. 21, n. 2, p. 173, doi. 10.1002/pip.1171
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Optical transmission as a fast and non-destructive tool for determination of ethylene-co-vinyl acetate curing state in photovoltaic modules.
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- Progress in Photovoltaics, 2013, v. 21, n. 2, p. 187, doi. 10.1002/pip.1175
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Preparation of Nacre‐Like Polyimide/Montmorillonite Composite Films with Excellent Water Vapor Barrier Properties by Gravity‐Induced Deposition.
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- Advanced Materials Interfaces, 2021, v. 8, n. 3, p. 1, doi. 10.1002/admi.202001786
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PbI<sub>2</sub>/CH<sub>3</sub>NH<sub>3</sub>Cl Mixed Precursor–Induced Micrometer‐Scale Grain Perovskite Film and Room‐Temperature Film Encapsulation toward High Efficiency and Stability of Planar Perovskite Solar Cells.
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- Advanced Materials Interfaces, 2018, v. 5, n. 15, p. 1, doi. 10.1002/admi.201800499
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Bifunctional Hybrid Ni/Ni<sub>2</sub>P Nanoparticles Encapsulated by Graphitic Carbon Supported with N, S Modified 3D Carbon Framework for Highly Efficient Overall Water Splitting.
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- Advanced Materials Interfaces, 2018, v. 5, n. 15, p. 1, doi. 10.1002/admi.201800473
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Features of Formation of Ohmic Contacts and Gate on Epitaxial Heterostructure of AlGaN / GaN High Electron Mobility Transistor.
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- Journal of Nano- & Electronic Physics, 2016, v. 8, n. 2, p. 1, doi. 10.21272/jnep.8(2).02044
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Physical property characterization of single step synthesized NdFeAsOF bulk 50 K superconductor.
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- European Physical Journal B: Condensed Matter, 2011, v. 79, n. 2, p. 139, doi. 10.1140/epjb/e2010-10674-x
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Estimation of the time needed to set up a covert channel.
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- Discrete Mathematics & Applications, 2003, v. 13, n. 3, p. 257, doi. 10.1515/156939203322385856
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- Article
REZULTATUL CERCETĂRILOR TEORETICE ŞI EXPERIMENTALE PRIVIND ASAMBLAREA DISPOZITIVELOR ELECTRICE DE APRINDERE PRIN PROCEDEUL R.P.K.
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- Fiability & Durability / Fiabilitate si Durabilitate, 2009, n. 2, p. 33
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- Article
The design of the VERS encapsulated object experience with an archival information package.
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- International Journal on Digital Libraries, 2006, v. 6, n. 2, p. 184, doi. 10.1007/s00799-005-0135-y
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Local endostatin treatment of gliomas administered by microencapsulated producer cells.
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- Nature Biotechnology, 2001, v. 19, n. 1, p. 29, doi. 10.1038/83471
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- Article
A New Computer Architecture Supporting Object-Oriented Programming.
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- International Review on Computers & Software, 2013, v. 8, n. 1, p. 174
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China set to make fusion history.
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- Nature, 2006, v. 442, n. 7105, p. 853, doi. 10.1038/442853a
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Effectiveness of methods of eliminating encapsulation during extrusion of rubber mixtures.
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- Chemical & Petroleum Engineering, 2009, v. 45, n. 1/2, p. 7, doi. 10.1007/s10556-009-9134-y
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Structural integrity investigations of spent nuclear fuel with finite element modeling.
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- Safety of Nuclear Waste Disposal, 2021, v. 1, p. 13, doi. 10.5194/sand-1-13-2021
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Concept Analysis for Module Restructuring.
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- IEEE Transactions on Software Engineering, 2001, v. 27, n. 4, p. 351, doi. 10.1109/32.917524
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Encapsulated fiber Bragg grating sensor for high temperature measurements.
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- Optical Engineering, 2011, v. 50, n. 11, p. 114401, doi. 10.1117/1.3644534
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- Article
Fatigue lifetime study of piezoceramic patch transducers.
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- Acta Mechanica, 2013, v. 224, n. 11, p. 2529, doi. 10.1007/s00707-013-0953-8
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- Article
Combining Encryption and Proof of Knowledge in the Random Oracle Model.
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- Computer Journal, 2004, v. 47, n. 1, p. 58, doi. 10.1093/comjnl/47.1.58
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- Article
Beyond Thermal Interaction between Ocean and Atmosphere: On the Extratropical Climate Variability due to the Wind-Induced SST.
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- Journal of Climate, 2008, v. 21, n. 10, p. 2001, doi. 10.1175/2007JCLI1532.1
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Converged Digital TV Services: The Role of Middleware and Future Directions of Interactive Television.
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- International Journal of Digital Multimedia Broadcasting, 2009, v. 2009, p. 1, doi. 10.1155/2009/643680
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- Article
AL-FEC for Improved Mobile Reception of MPEG-2 DVB-T Transport Streams.
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- International Journal of Digital Multimedia Broadcasting, 2009, v. 2009, p. 1, doi. 10.1155/2009/614178
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- Article
UNIFIED COHESION MEASURES FOR ASPECT-ORIENTED SYSTEMS.
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- International Journal of Software Engineering & Knowledge Engineering, 2011, v. 21, n. 1, p. 143, doi. 10.1142/S0218194011005128
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- Article
FSI ANALYSIS OF WIRE SWEEP IN ENCAPSULATION PROCESS OF PLASTIC BALL GRID ARRAY PACKAGING.
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- Journal of Thermal Science & Technology / Isı Bilimi ve Tekniği Dergisi, 2013, v. 33, n. 1, p. 101
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DC electrical stimulation enhances proliferation and differentiation on N2a and MC3T3 cell lines.
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- Journal of Biological Engineering, 2022, v. 16, n. 1, p. 1, doi. 10.1186/s13036-022-00306-8
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Rational design of vapor‐deposited self‐crosslinking polymer for transparent flexible oxygen barrier coatings.
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- Journal of Applied Polymer Science, 2021, v. 138, n. 21, p. 1, doi. 10.1002/app.50505
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- Article
Synthesis and Enhanced Field-Emission of Thin-Walled, Open-Ended, and Well-Aligned N-Doped Carbon Nanotubes.
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- Nanoscale Research Letters, 2010, v. 5, n. 6, p. 941, doi. 10.1007/s11671-010-9586-1
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- Article
Optimization of Solar Module Encapsulant Lamination by Optical Constant Determination of Ethylene-Vinyl Acetate.
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- International Journal of Photoenergy, 2015, v. 2015, p. 1, doi. 10.1155/2015/276404
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QML Class P: A New Standard for Radiation-Hardened Electronics in Plastic Packaging.
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- Microwave Journal, 2024, v. 67, n. 10, p. 88
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- Article
Meeting High-Power and High Frequency Challenges with Adhesives and Potting Compounds.
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- Microwave Journal, 2018, v. 61, n. 1, p. 96
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Thermal behavior of epoxy blends for light emitting diode encapsulation.
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- e-Polymers, 2012, n. 91, p. 1
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Thermoplastic encapsulations of a sensor platform by high‐temperature injection molding up to 360°C.
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- Polymer Engineering & Science, 2019, v. 59, n. 7, p. 1315, doi. 10.1002/pen.25114
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A graphical peak analysis method for characterizing impurities in SiC, GaN and diamond from temperature-dependent majority-carrier concentration.
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- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 8/9, p. 720, doi. 10.1007/s10854-007-9390-6
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- Article
Encapsulation and backsheet adhesion metrology for photovoltaic modules.
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- Progress in Photovoltaics, 2017, v. 25, n. 1, p. 87, doi. 10.1002/pip.2817
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- Article
Durability of polymeric encapsulation materials in a PMMA/glass concentrator photovoltaic system.
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- Progress in Photovoltaics, 2016, v. 24, n. 11, p. 1385, doi. 10.1002/pip.2796
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- Article
Reducing shadowing losses with femtosecond-laser-written deflective optical elements in the bulk of EVA encapsulation.
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- Progress in Photovoltaics, 2015, v. 23, n. 9, p. 1120, doi. 10.1002/pip.2530
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- Article
Reducing component stress during encapsulation of electronics: a simulative examination of thermoplastic foam injection molding.
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- Journal of Polymer Engineering, 2023, v. 43, n. 2, p. 179, doi. 10.1515/polyeng-2022-0150
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- Article
The Effect of Encapsulation Geometry on the Performance of Stretchable Interconnects.
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- Micromachines, 2018, v. 9, n. 12, p. 645, doi. 10.3390/mi9120645
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- Article
Tunnel Encapsulation Technology for Durability Improvement in Stretchable Electronics Fabrication.
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- Micromachines, 2018, v. 9, n. 10, p. 519, doi. 10.3390/mi9100519
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- Article
Encapsulation of Piezoelectric Transducers for Sensory Augmentation and Substitution with Wearable Haptic Devices.
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- Micromachines, 2017, v. 8, n. 9, p. 270, doi. 10.3390/mi8090270
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- Article
Hacking Summon 2.0 The Elegant Way.
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- Code4Lib Journal, 2014, n. 26, p. 1
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What is a reed relay?
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- EE: Evaluation Engineering, 2016, v. 55, n. 4, p. 18
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Teaching Kinematics and Dynamics of Multibody Mechanical System Using the Object Oriented Language Modelica.
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- International Journal of Online Engineering, 2009, v. 5, p. 33, doi. 10.3991/ijoe.v5s2.1096
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Benefits of Sophisticated Motor & Drive Technologies.
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- Chemical Engineering, 2017, v. 124, n. 6, p. 26
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- Article
Self-repair of thermal cracks in concrete sandwich panels.
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- Structural Concrete, 2015, v. 16, n. 2, p. 273, doi. 10.1002/suco.201400055
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Translational Neuroelectronics.
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- Advanced Functional Materials, 2020, v. 30, n. 29, p. 1, doi. 10.1002/adfm.201909165
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Designing Thin, Ultrastretchable Electronics with Stacked Circuits and Elastomeric Encapsulation Materials.
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- Advanced Functional Materials, 2017, v. 27, n. 4, p. n/a, doi. 10.1002/adfm.201604545
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- Article
A knowledge encapsulation approach to ontology modularization.
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- Knowledge & Information Systems, 2011, v. 26, n. 2, p. 249, doi. 10.1007/s10115-009-0279-y
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- Article
Failure detectors encapsulate fairness.
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- Distributed Computing, 2012, v. 25, n. 4, p. 313, doi. 10.1007/s00446-012-0164-x
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- Article