Works about PLASMA etching

Results: 797

Control of Electrohydrodynamic‐Induced Defects in Nanoimprinted Nanopillars for Optimized GaN Pendeoepitaxy.

Published in:

Journal of Applied Polymer Science, 2025, v. 142, n. 29, p. 1, doi. 10.1002/app.57173

By:

Labchir, N.;
Masclaux, C.;
Labau, S.;
Petit‐Etienne, C.;
Panabière, M.;
Reche, J.;
Charles, M.;
Gourgon, C.

Publication type:

Article

Radial Stress Distribution in Micro Dry‐Etched Perfluorinated Polymer Optical Fibers.

Published in:

IEEJ Transactions on Electrical & Electronic Engineering, 2025, v. 20, n. 7, p. 1141, doi. 10.1002/tee.24257

By:

Nakanishi, Takuto;
Nakashima, Ryo;
Ishida, Keito;
Wada, Yuji;
Lo, Cheng‐Yao;
Nakamura, Kentaro;
Lee, Heeyoung;
Mizuno, Yosuke;
Yamane, Daisuke

Publication type:

Article

C4F6 Etching Characteristics for High‐Aspect‐Ratio Etching of SiO2 Films Using an Inductively Coupled Plasma Etching System With Low‐Frequency Bias Power.

Published in:

Plasma Processes & Polymers, 2025, v. 22, n. 6, p. 1, doi. 10.1002/ppap.70012

By:

Wei, Jiachen;
Woo, Byungjun;
Lee, DaeKug;
Jeong, Ki‐Hyeok;
Kwon, Kwang‐Ho

Publication type:

Article

Permanent Plasma Surface Functionalization of Internal Surface Areas.

Published in:

Advanced Materials Interfaces, 2025, v. 12, n. 8, p. 1, doi. 10.1002/admi.202400727

By:

Hegemann, Dirk;
Janůšová, Martina;
Navascués, Paula;
Zajíčková, Lenka;
Guex, Anne Géraldine

Publication type:

Article

Fabrication of Anti-Reflective Composite Structures on Inverted Pyramids Using Inductively Coupled Plasma Etching.

Published in:

Micromachines, 2025, v. 16, n. 5, p. 503, doi. 10.3390/mi16050503

By:

Fan, Zhiwei;
Xu, Liang;
Zhou, Biyun;
Chen, Tao

Publication type:

Article

Manufacturing Process and Characteristics of Silica Nanostructures for Anti-Reflection at 355 nm.

Published in:

Coatings (2079-6412), 2025, v. 15, n. 5, p. 556, doi. 10.3390/coatings15050556

By:

Gärtner, Anne;
Mureșan, Mihai-George;
Mühlig, Christian;
Herffurth, Tobias;
Felde, Nadja;
Wagner, Hanjörg;
Schulz, Ulrike;
Bingel, Astrid;
Schröder, Sven;
Mocek, Tomáš;
Tünnermann, Andreas

Publication type:

Article

APC for plasma etch.

Published in:

Solid State Technology, 2001, v. 44, n. 10, p. 71

By:

Tegeder, Volker;
Ronchi, Robert;
Muezler, Sven;
Hofmann, Mathias

Publication type:

Article

Asuka project to select tools this year.

Published in:: Solid State Technology, 2001, v. 44, n. 8, p. S4
Publication type:: Article

Plasma etch rates: The impact of mask transmittance.

Published in:

Solid State Technology, 2001, v. 44, n. 8, p. 55

By:

Pindo, Massimiliano

Publication type:

Article

Laser etching for flip-chip de-bug and inverse stereolithography for MEMS.

Published in:

Solid State Technology, 2001, v. 44, n. 6, p. 145

By:

Ehrlich, Daniel;
Silverman, Scott;
Aucoin, Richard;
Burns, Michael

Publication type:

Article

Optimizing plasma etch for MEMS devices.

Published in:

Solid State Technology, 2001, v. 44, n. 6, p. 135

By:

Werbaneth, Paul

Publication type:

Article

Ccd-controlled in situ interferometry for dry etch process monitoring.

Published in:

Solid State Technology, 2001, v. 44, n. 6, p. 117

By:

John, Wilfred;
Weixelbaum, Leonhard;
Witrich, Harald;
Wurfl, Joachim

Publication type:

Article

Evaluating plasma-etch resistance of high-performance plastics.

Published in:

Solid State Technology, 2001, v. 44, n. 4, p. 91

By:

Campbell, Richard W.

Publication type:

Article

Implementation of extended temperature range etching.

Published in:

Solid State Technology, 2001, v. 44, n. 1, p. 76

By:

McKibben, James D.

Publication type:

Article

STI etch in CL[sub2]-Ar plasmas.

Published in:

Solid State Technology, 2000, v. 43, n. 12, p. 87

By:

Werbaneth, Paul;
Almerico, John

Publication type:

Article

Trikons low-k etch meets ITRS 2004 requirement.

Published in:

Solid State Technology, 2000, v. 43, n. 12, p. 38

By:

Demmin, Jeffrey C.

Publication type:

Article

Adapting semiconductor processing tools to thin film head fabrication.

Published in:

Solid State Technology, 2000, v. 43, n. 9, p. 122

By:

Werbaneth, Paul;
Kirshman, Sam;
Slomowitz, Harry;
Thomas, Jim

Publication type:

Article

Pattern transfer into low dielectric constant materials by high-density plasma etching.

Published in:

Solid State Technology, 2000, v. 43, n. 5, p. 125

By:

Oehrlein, Gottlieb S.;
Standaert, Theodorus E. F. M.;
Matsuo, Peter J.

Publication type:

Article

Closed-loop bias voltage control for plasma etching.

Published in:

Solid State Technology, 2000, v. 43, n. 2, p. 59

By:

Patrick, Roger;
Baldwin, Scott;
Williams, Norman

Publication type:

Article

In situ wafer temperature measurement during plasma etching.

Published in:

Solid State Technology, 1999, v. 42, n. 10, p. 99

By:

Gabriel, Calvin T.;
Yeh, Edward K.

Publication type:

Article

Solvent-free plasma removal of etch polymers.

Published in:

Solid State Technology, 1999, v. 42, n. 3, p. S13

By:

Christaud, Jean-Francois;
Helle, Wolfgang;
Ranft, Craig;
Gapasin, Cynthia

Publication type:

Article

Curbing plasma-induced gate oxide damage.

Published in:

Solid State Technology, 1999, v. 42, n. 3, p. 49

By:

Gabriel, Calvin T.

Publication type:

Article

Surface modification of hollow carbon fibres using plasma treatment.

Published in:

Surface Engineering, 2011, v. 27, n. 8, p. 623, doi. 10.1179/026708410X12786785573391

By:

Chih, Y K;
Hwang, J;
Kou, C S;
Chuang, C C;
Hu, J L;
Lee, J M;
Chang, S C;
Row, L C;
Cheng, S H;
Chen, J P

Publication type:

Article

Challenges in controlling plasma processes using artificial neural network.

Published in:

Surface Engineering, 2006, v. 22, n. 4, p. 225, doi. 10.1179/174329406X126780

By:

Kim, B.

Publication type:

Article

Improvement in galling performance through surface engineering.

Published in:

Surface Engineering, 2006, v. 22, n. 4, p. 235, doi. 10.1179/174329406X122946

By:

Podgornik, B.;
Vižintin, J.;
Hogmark, S.

Publication type:

Article

Influence of bias and in situ cleaning on through cage (TC) or active screen plasma nitrided (ASPN) steels.

Published in:

Surface Engineering, 2006, v. 22, n. 4, p. 243, doi. 10.1179/174329406X122937

By:

Hubbard, P.;
Dowey, S. J.;
Doyle, E. D.;
McCulloch, D. G.

Publication type:

Article

Pressure Controlled Surface Roughness of SiC Plasma Etching.

Published in:

Surface Engineering, 2004, v. 20, n. 5, p. 391, doi. 10.1179/026708404225016445

By:

Kim, B.;
Lee, B.-T.

Publication type:

Article

Plasma Etch Prediction Using Genetic Algorithm Based Polynomial Neural Network.

Published in:

Surface Engineering, 2004, v. 20, n. 1, p. 31, doi. 10.1179/026708404225010658

By:

Kim, D.-W.;
Kim, B.;
Shim, I.-J.;
Park, G.-T.

Publication type:

Article

Large‐Area Uniaxially Oriented Sub‐5 nm Line Patterns of Hybrid Liquid Crystals Constructed by Perylene Diimide and Oligo(Dimethylsiloxane).

Published in:

Chemistry - A European Journal, 2023, v. 29, n. 18, p. 1, doi. 10.1002/chem.202203702

By:

Yang, Weilu;
Liu, Dong;
Liu, Yun;
Yang, Shichu;
Liu, Yadi;
Shen, Zhihao;
Yang, Huai;
Fan, Xing‐He;
Zhou, Qi‐Feng

Publication type:

Article

Microscale pattern etch of 4H–SiC by inductively coupled plasma.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 20, p. 18788, doi. 10.1007/s10854-019-02232-w

By:

Zhuang, Shiwei;
Tang, Jiale;
Gu, Zhiqiang;
Che, Dongchen;
Hu, Dongdong;
Chen, Lu;
Xu, Kaidong

Publication type:

Article

Fabrication and properties of ZnO nanorods on silicon nanopillar surface for gas sensor application.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 12, p. 11404, doi. 10.1007/s10854-019-01489-5

By:

Liu, Jing;
Yi, Futing

Publication type:

Article

Barrier inhomogeneities in titanium Schottky contacts formed on argon plasma etched p-type SiGe.

Published in:

Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 3, p. 1527, doi. 10.1007/s10854-014-1763-z

By:

Mamor, M.;
Bouziane, K.;
Tirbiyine, A.

Publication type:

Article

Improvement and characteristics of conical silicon emitters employing wet-dry etching.

Published in:

Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 1, p. 31, doi. 10.1007/s10854-013-1502-x

By:

Hung, Shang-Chao;
Cheng, Nai-Jen;
Huang, Shun-Tsung;
Hsu, Yi-Cheng

Publication type:

Article

Improving the quality of GaN epilayer by preparing a novel patterned sapphire substrate.

Published in:

Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 1, p. 267, doi. 10.1007/s10854-013-1582-7

By:

Yang, Dechao;
Liang, Hongwei;
Qiu, Yu;
Shen, Rensheng;
Liu, Yang;
Xia, Xiaochuan;
Song, Shiwei;
Zhang, Kexiong;
Yu, Zhennan;
Du, Guotong

Publication type:

Article

Characteristics of GaN thin films by inductively coupled plasma etching with Cl/BCl and Cl/Ar.

Published in:

Journal of Materials Science: Materials in Electronics, 2012, v. 23, n. 6, p. 1224, doi. 10.1007/s10854-011-0577-5

By:

Yang, G.;
Chen, P.;
Wu, Z.;
Yu, Z.;
Zhao, H.;
Liu, B.;
Hua, X.;
Xie, Z.;
Xiu, X.;
Han, P.;
Shi, Y.;
Zhang, R.;
Zheng, Y.

Publication type:

Article

Impact of plasma etching on fabrication technology of liquid crystal polymer printed circuit board.

Published in:

Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 9, p. 954, doi. 10.1007/s10854-009-0024-z

By:

Yung, K. C.;
Liem, H.;
Choy, H. S.;
Yue, T. M.

Publication type:

Article

The kinetics of conductivity type conversion in HgCdTe by ion beam milling.

Published in:

Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 10, p. 965, doi. 10.1007/s10854-007-9428-9

By:

Shaw, Derek;
Capper, Peter

Publication type:

Article

Hydrophobisation of lignocellulosic materials part I: physical modification.

Published in:

Cellulose, 2022, v. 29, n. 10, p. 5375, doi. 10.1007/s10570-022-04620-8

By:

Rodríguez-Fabià, Sandra;
Torstensen, Jonathan;
Johansson, Lars;
Syverud, Kristin

Publication type:

Article

Electrodeposition of polypyrrole on He plasma etched carbon nanotube films for electrodes of flexible all-solid-state supercapacitor.

Published in:

Journal of Solid State Electrochemistry, 2019, v. 23, n. 5, p. 1553, doi. 10.1007/s10008-019-04242-4

By:

Han, Yichuan;
Chen, Peishan;
Xia, Yanfei;
Huang, Sanqing;
Chen, Wenxing;
Lu, Wangyang

Publication type:

Article

Microembossed copper microchannel heat sink for high-density cooling in electronics.

Published in:

Micro & Nano Letters (Wiley-Blackwell), 2019, v. 14, n. 12, p. 1258, doi. 10.1049/mnl.2019.0198

By:

Xuanyang Li;
Jing Chen

Publication type:

Article

Metal-assisted chemical etching for realisation of deep silicon microstructures.

Published in:

Micro & Nano Letters (Wiley-Blackwell), 2019, v. 14, n. 10, p. 1083, doi. 10.1049/mnl.2019.0113

By:

Zarei, Sanaz;
Zahedinejad, Mohammad;
Mohajerzadeh, Shams

Publication type:

Article

A facile nanopattern modification of silk fibroin electrospun scaffold and the corresponding impact on cell proliferation and osteogenesis.

Published in:

Regenerative Biomaterials, 2024, v. 11, p. 1, doi. 10.1093/rb/rbae117

By:

Liu, Xiaojiao;
Ouyang, Qinjun;
Yao, Xiang;
Zhang, Yaopeng

Publication type:

Article

介质阻挡放电等离子体处理对香蕉粉理化和流变学特性的影响.

Published in:

Food Research & Development, 2019, v. 40, n. 13, p. 93, doi. 10.3969/j.issn.1005-6521.2019.13.016

By:

闫斯亮;
靳楠;
魏瑞;
陈野;
王维君

Publication type:

Article

Towards practical quantum computers: transmon qubit with a lifetime approaching 0.5 milliseconds.

Published in:

NPJ Quantum Information, 2022, v. 8, n. 1, p. 1, doi. 10.1038/s41534-021-00510-2

By:

Wang, Chenlu;
Li, Xuegang;
Xu, Huikai;
Li, Zhiyuan;
Wang, Junhua;
Yang, Zhen;
Mi, Zhenyu;
Liang, Xuehui;
Su, Tang;
Yang, Chuhong;
Wang, Guangyue;
Wang, Wenyan;
Li, Yongchao;
Chen, Mo;
Li, Chengyao;
Linghu, Kehuan;
Han, Jiaxiu;
Zhang, Yingshan;
Feng, Yulong;
Song, Yu

Publication type:

Article

Contact Resistivity in Edge‐Contacted Graphene Field Effect Transistors.

Published in:

Advanced Electronic Materials, 2022, v. 8, n. 5, p. 1, doi. 10.1002/aelm.202101169

By:

Lee, Sungwon;
Choi, Hyungyu;
Moon, Inyong;
Shin, Hoseong;
Watanabe, Kenji;
Taniguchi, Takashi;
Yoo, Won Jong

Publication type:

Article

Film‐Depth‐Dependent Light Absorption and Charge Transport for Polymer Electronics: A Case Study on Semiconductor/Insulator Blends by Plasma Etching.

Published in:

Advanced Electronic Materials, 2016, v. 2, n. 12, p. 1, doi. 10.1002/aelm.201600359

By:

Bu, Laju;
Gao, Shuang;
Wang, Weichen;
Zhou, Ling;
Feng, Shi;
Chen, Xin;
Yu, Demei;
Li, Shengtao;
Lu, Guanghao

Publication type:

Article

„DIE VORNEHMSTEN PLÄTZE UND GEBÄUDE, DIE IN DANZIG ZU SEHEN SIND". AEGIDIUS DICKMANS ANSICHTEN VON DANZIG 1617.

Published in:

Baltic Journal of Art History, 2020, v. 20, p. 81, doi. 10.12697/BJAH.2020.20.03

By:

Larsson, Lars Olof

Publication type:

Article

MOCVD Grown InGaAs/InAlAs Quantum Cascade Lasers Emitting at 7.7 μm.

Published in:

Photonics, 2024, v. 11, n. 12, p. 1195, doi. 10.3390/photonics11121195

By:

Bugajski, Maciej;
Kolek, Andrzej;
Hałdaś, Grzegorz;
Strupiński, Włodzimierz;
Pasternak, Iwona;
Kołkowski, Walery;
Pierściński, Kamil

Publication type:

Article

Air Core ARROW Waveguides Fabricated in a Membrane-Covered Trench.

Published in:

Photonics, 2024, v. 11, n. 6, p. 502, doi. 10.3390/photonics11060502

By:

Walker, Seth;
Schmidt, Holger;
Hawkins, Aaron R.

Publication type:

Article

Femtosecond Laser Microfabrication of Artificial Compound Eyes.

Published in:

Photonics, 2024, v. 11, n. 3, p. 264, doi. 10.3390/photonics11030264

By:

Zhang, Fan;
Xu, Huacheng;
Yang, Qing;
Lu, Yu;
Du, Guangqing;
Chen, Feng

Publication type:

Article