Direct Writing of Spot and Line Bonds for Microsystem Packaging Using Transmission Laser Bonding Technique.
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- Materials & Manufacturing Processes, 2007, v. 22, n. 1, p. 71, doi. 10.1080/10426910601015964
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- Article
Works matching DE "PACKAGING machinery manufacturing"
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ENERGY EFFICIENCY OF STEAM PIPELINE SYSTEM.
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- Annals of DAAAM & Proceedings, 2010, p. 1063
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- Article