Works about NICKEL-plating

Results: 523

Study on the Influence of Nickel Plating on the Structure and Properties of Aluminum/Steel Bimetallic Bonding.

Published in:

Materials (1996-1944), 2025, v. 18, n. 9, p. 1898, doi. 10.3390/ma18091898

By:

Zhang, Yufei;
Zhang, Guowei;
Wang, Mingjie;
Xu, Hong

Publication type:

Article

Enhancing Oxidation Resistance and Electrothermal Performance of Carbon Fibers Through Nickel Plating for Advanced Applications.

Published in:

Journal of Electronic Materials, 2025, v. 54, n. 6, p. 4846, doi. 10.1007/s11664-025-11878-8

By:

Dong, Xiongwei;
Yin, Zixiong;
Tian, Yuan;
Chen, Chunliang;
Wang, Yumin;
Zhao, Xipo;
Liu, Huihong;
Fang, Pengfei;
Xiong, Yi;
Mahmud, Sakil;
Hu, Doumeng;
Zeng, Wei

Publication type:

Article

Influence of pH on the electroless Ni-P plating of SiC particles.

Published in:

Surface Engineering, 2025, v. 41, n. 2, p. 217, doi. 10.1177/02670844251320318

By:

Kollabathini, S V S Sarath Chandra;
Dora, Siva Prasad;
Chintada, Shoba;
Arava, Haripriyani

Publication type:

Article

Examination of the metallization behaviour of an ABS surface.

Published in:

Surface Engineering, 2023, v. 39, n. 7-12, p. 807, doi. 10.1080/02670844.2023.2259700

By:

Ünlü, Büsra;
Öz, Yahya;
Erdoğan, Metehan;
Karakaya, İshak

Publication type:

Article

Mechanical properties of Ni-based coatings fabricated by electroless plating method.

Published in:

Surface Engineering, 2020, v. 36, n. 9, p. 944, doi. 10.1080/02670844.2019.1662226

By:

Shu, Xin;
He, Zhen;
Wang, Yuxin;
Yin, Li

Publication type:

Article

Improved uniformity of Ni/Au coating on circuits by electroless plating.

Published in:

Surface Engineering, 2019, v. 35, n. 10, p. 913, doi. 10.1080/02670844.2018.1548537

By:

Liu, Dongguang;
Tian, Heng;
Lin, Lijing;
Shi, Wenchao

Publication type:

Article

Influence of zinc-dipping on electroless nickel coating on magnesium alloy.

Published in:

Surface Engineering, 2019, v. 35, n. 10, p. 906, doi. 10.1080/02670844.2018.1548101

By:

Guan, Xiurong;
Zhu, Hongda;
Shi, Jingwei;
Wei, Shouqiang;
Shao, Zhongcai;
Shen, Xiaoyi

Publication type:

Article

Fabrication and characterisation of functionally graded Ni-P coatings with improved wear and corrosion resistance.

Published in:

Surface Engineering, 2019, v. 35, n. 10, p. 883, doi. 10.1080/02670844.2018.1539295

By:

Hadipour, Ali;
Rahsepar, Mansour;
Hayatdavoudi, Hadis

Publication type:

Article

Ni–B/SiC nanocomposite coating obtained by pulse plating and evaluation of its electrochemistry and mechanical properties.

Published in:

Surface Engineering, 2019, v. 35, n. 10, p. 861, doi. 10.1080/02670844.2018.1498823

By:

Ahmadiyeh, Somayeh;
Rasooli, Ali;
Hosseini, Mir Ghasem

Publication type:

Article

A novel approach to prevent decarburisation through electroless plating.

Published in:

Surface Engineering, 2019, v. 35, n. 10, p. 848, doi. 10.1080/02670844.2018.1479363

By:

Johari Teymoori, R.;
Shahidi, M.;
Taji, I.;
Sharifalhoseini, Z.;
Beidokhti, B.

Publication type:

Article

Electroless nickel-phosphorus plating on WC-Co powders using HVOF feedstock.

Published in:

Surface Engineering, 2019, v. 35, n. 2, p. 121, doi. 10.1080/02670844.2018.1477558

By:

Alhaji, Amir;
Shamanian, Morteza;
Salehi, Mehdi;
Nahvi, Saied Mehran;
Erfanmanesh, Mohammad

Publication type:

Article

Mechanical properties of heat-treated duplex electroless nickel coatings.

Published in:

Surface Engineering, 2019, v. 35, n. 2, p. 159, doi. 10.1080/02670844.2018.1463679

By:

Vitry, Veronique;
Francq, Elodie;
Bonin, Luiza

Publication type:

Article

Chemical, morphological and structural characterisation of electroless duplex NiP/NiB coatings on steel.

Published in:

Surface Engineering, 2018, v. 34, n. 6, p. 475, doi. 10.1080/02670844.2017.1320032

By:

Vitry, Véronique;
Bonin, Luiza;
Malet, Loïc

Publication type:

Article

Modelling of surfactants and chemistry for electroless Ni-P plating.

Published in:

Surface Engineering, 2018, v. 34, n. 6, p. 454, doi. 10.1080/02670844.2017.1287621

By:

Farzaneh, Amir;
Ehteshamzadeh, Maryam;
Cobley, Andrew J.

Publication type:

Article

The effect of nitriding on adhesion and mechanical properties of electroless Ni–P coating on AISI 4140 steel.

Published in:

Surface Engineering, 2017, v. 33, n. 2, p. 116, doi. 10.1080/02670844.2016.1148831

By:

Soares, Marcos E.;
Soares, Paulo;
Souza, Peterson R.;
Souza, Roberto M.;
Torres, Ricardo D.

Publication type:

Article

Influence of activation on performance of nickel-phosphorous coating.

Published in:

Surface Engineering, 2015, v. 31, n. 9, p. 685, doi. 10.1179/1743294415Y.0000000052

By:

Pan, Y.;
Yu, G.;
Hu, B.;
Xie, Z.;
Tran, T.;
Zhang, X.

Publication type:

Article

Development of alternative environment friendly nickel and gold plating baths.

Published in:

Surface Engineering, 2015, v. 31, n. 9, p. 641, doi. 10.1179/1743294415Y.0000000025

By:

Gezerman, A. O.;
Çorbacıoğlu, B. D.

Publication type:

Article

Ultrasonic irradiation assisted electroless Ni-P coating on magnesium alloy.

Published in:

Surface Engineering, 2014, v. 30, n. 12, p. 880, doi. 10.1179/1743294413Y.0000000213

By:

Ban, C. L.;
Shao, X.;
Wang, L. P.

Publication type:

Article

Studies on electroless nickel boride coating on boron carbide particles.

Published in:

Surface Engineering, 2014, v. 30, n. 10, p. 702, doi. 10.1179/1743294414Y.0000000279

By:

Deepa, J. P.;
Rajan, T. P. D.;
Pavithran, C.;
Pai, B. C.

Publication type:

Article

Influence of an external magnetic field on performance of composite coatings.

Published in:

Surface Engineering, 2014, v. 30, n. 1, p. 11, doi. 10.1179/1743294413Y.0000000179

By:

Hou, J.;
Zhou, Z.

Publication type:

Article

Iron(II) acetylacetonate containing brightener and sulphur containing carrier in nickel plating.

Published in:

Surface Engineering, 2013, v. 29, n. 7, p. 516, doi. 10.1179/1743294413Y.0000000154

By:

Gezerman, A O;
Çorbacıoglu, B D

Publication type:

Article

Fabrication of nanocrystalline nickel coatings by brush plating.

Published in:

Surface Engineering, 2013, v. 29, n. 5, p. 342, doi. 10.1179/1743294413Y.0000000125

By:

Shang, T;
Zhang, H Z;
Jiang, H;
Dai, L;
Zhang, G L;
Liu, X L

Publication type:

Article

Effect of heat treatment on wear behaviour of WC-(W,Cr)2C-Ni coating.

Published in:

Surface Engineering, 2012, v. 28, n. 10, p. 786, doi. 10.1179/1743294412Y.0000000025

By:

Hou, G L;
An, Y L;
Zhao, X Q;
Chen, J;
Chen, J M;
Zhou, H D;
Liu, G

Publication type:

Article

Electrodeposition of copper coating on AZ31 magnesium alloy.

Published in:

Surface Engineering, 2012, v. 28, n. 10, p. 796, doi. 10.1179/1743294412Y.0000000052

By:

Zhu, P;
Wang, L Y;
Chen, Y;
Zhou, M;
Zhou, J

Publication type:

Article

Analyses of plated films by thermal desorption spectrometry (TDS).

Published in:

Surface Engineering, 2012, v. 28, n. 9, p. 674, doi. 10.1179/1743294411Y.0000000083

By:

Koiwa, I;
Deguchi, K;
Haijima, Y;
Hirashita, N;
Maejima, K

Publication type:

Article

Quantum mechanical approach for electroless plating process.

Published in:

Surface Engineering, 2012, v. 28, n. 10, p. 743, doi. 10.1179/1743294412Y.0000000053

By:

Karthikeyan, S;
Jeeva, P A;
Narayanan, S;
Srinivasan, K N;
Hu, X

Publication type:

Article

Improvement to corrosion resistance of Ni-P coating on MAO magnesium alloy by BTESPT.

Published in:

Surface Engineering, 2012, v. 28, n. 7, p. 491, doi. 10.1179/1743294412Y.0000000015

By:

Chen, M-A;
Cheng, N;
Li, J-M;
Liu, S-Y

Publication type:

Article

Effects of plasma nitriding on properties of electroless Ni-B coating.

Published in:

Surface Engineering, 2012, v. 28, n. 3, p. 195, doi. 10.1179/1743294411Y.0000000058

By:

Ahmadkhaniha, D;
Mahboubi, F

Publication type:

Article

Effect of morphology and content of Ni nanoparticles on electromagnetic shielding coatings with salt resistance and heating performance.

Published in:

Journal of Materials Science: Materials in Electronics, 2022, v. 33, n. 31, p. 24367, doi. 10.1007/s10854-022-09155-z

By:

Zhao, Xuanzheng;
Vokhidova, Noira;
Wang, Qin;
Lan, Bijian;
Lu, Yinxiang

Publication type:

Article

Simple hydrothermal synthesis of g-C3N4/Ni9S8 composites for efficient photocatalytic H2 evolution.

Published in:

Journal of Materials Science: Materials in Electronics, 2021, v. 32, n. 16, p. 21643, doi. 10.1007/s10854-021-06678-9

By:

Li, Ao;
Peng, Zhijian;
Fu, Xiuli

Publication type:

Article

Effects of accelerator in a copper plating bath on interfacial microstructure and mechanical properties of SAC305/Cu solder joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 24, p. 22810, doi. 10.1007/s10854-020-04806-5

By:

Xu, Han;
Zhang, Xudong;
Chen, Wenjing;
Zou, Minming;
Hu, Xiaowu

Publication type:

Article

Interfacial microstructure evolution of solder joints by doping Cu nanoparticles into Ni(P) electroless plating.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 22, p. 20232, doi. 10.1007/s10854-020-04543-9

By:

Cheng, Jinxuan;
Zhang, Jiankang;
Liu, Yi;
Hu, Xiaowu;
Zhang, Zhe;
Jiang, Xiongxin

Publication type:

Article

A facile process combined with defect-induced electroless plating and selective laser sintering forming to fabricate catalytically active free-standing material.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 20, p. 17810, doi. 10.1007/s10854-020-04334-2

By:

Zhang, Ruxia;
Gui, Chengmei;
Huang, Junjun;
Chen, Zhenming;
Yang, Guisheng

Publication type:

Article

Effects of the Ni(P) plating thickness on microstructure evolution of interfacial IMCs in Sn–58Bi/Ni(P)/Cu solder joints.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 14, p. 11470, doi. 10.1007/s10854-020-03695-y

By:

Cheng, Jinxuan;
Hu, Xiaowu;
Zhang, Zhe;
Li, Qinglin

Publication type:

Article

Facile synthesis of nickel/reduced graphene oxide-coated glass fabric for highly efficient electromagnetic interference shielding.

Published in:

Journal of Materials Science: Materials in Electronics, 2020, v. 31, n. 11, p. 8910, doi. 10.1007/s10854-020-03426-3

By:

Zhai, Jianyu;
Cui, Ce;
Ren, Erhui;
Zhou, Mi;
Guo, Ronghui;
Xiao, Hongyan;
Li, Ang;
Jiang, Shouxiang;
Qin, Wenfeng

Publication type:

Article

Effects of electroless nickel plating method for low temperature joining ZnS ceramics.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 16, p. 15236, doi. 10.1007/s10854-019-01896-8

By:

Xu, Sunwu;
Qi, Xiaoquan;
Xu, Xiangyu;
Wang, Xingxing;
Yang, Zimu;
Zhang, Shuye;
Lin, Tiesong;
He, Peng

Publication type:

Article

Electromagnetic shielding effectiveness and electrical conductivity of a thin silver layer deposited onto cellulose film via electroless plating.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 13, p. 12044, doi. 10.1007/s10854-019-01562-z

By:

Sun, Guangming;
Wang, Zhaoqi;
Huang, Jintian

Publication type:

Article

Influence of thiourea on electroless Ni–P films deposited on silicon substrates.

Published in:

Journal of Materials Science: Materials in Electronics, 2019, v. 30, n. 8, p. 7717, doi. 10.1007/s10854-019-01088-4

By:

Wu, Wangping;
Liu, Jianwen;
Miao, Naiming;
Jiang, Jinjin;
Zhang, Yi;
Zhang, Lei;
Yuan, Ningyi;
Wang, Qinqin;
Tang, Lixin

Publication type:

Article

Nickel deposition on Kevlar fabric modified with aminopropyltrimethoxysilane in supercritical fluid via electroless plating.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 22, p. 19200, doi. 10.1007/s10854-018-0046-5

By:

Zheng, Guanghong;
Jianhua, Ren;
Guo, Ronghui

Publication type:

Article

Effect of plating time on structural properties of Ni-plating coating on Nylon 12 powders.

Published in:

Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 4, p. 3281, doi. 10.1007/s10854-017-8263-x

By:

Gui, Chengmei;
Yao, Chenguang;
Yang, Guisheng

Publication type:

Article

Method for electroless nickel plating on poly(ethylene terephthalate) substrates and through holes modified with primer.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 15, p. 10974, doi. 10.1007/s10854-017-6878-6

By:

Huang, Junjun;
Sun, Zhiping;
Zhou, Fang;
Yuan, Yuan;
Chen, Wei;
Gao, Min;
Chen, Zhenming

Publication type:

Article

Crack generation in electroless nickel plating layers on copper-metallized silicon nitride substrates during thermal cycling.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 11, p. 8278, doi. 10.1007/s10854-017-6541-2

By:

Fukuda, Shinji;
Shimada, Kazuhiko;
Izu, Noriya;
Miyazaki, Hiroyuki;
Hirao, Kiyoshi;
Iwakiri, Shoji

Publication type:

Article

Effects of temperature on Ni coating on poly(ethylene terephthalate) substrate modified with primer.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 6, p. 5892, doi. 10.1007/s10854-016-4507-4

By:

Sun, Zhiping;
Huang, Junjun;
Liu, Qi;
Gao, Min;
Li, Mengyu;
Zhao, Feng;
Cheng, Wei;
Tang, Bin

Publication type:

Article

The formation and conversion of intermetallic compounds in the Cu pillar Sn-Ag micro-bump with ENEPIG Cu substrate under current stressing.

Published in:

Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 3, p. 2201, doi. 10.1007/s10854-015-4011-2

By:

Hsiao, Yu-Hsiang;
Lin, Kwang-Lung

Publication type:

Article

Method for electroless nickel plating on poly(ethylene terephthalate) substrate modified with primer and self-assembled monolayer.

Published in:

Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 12, p. 10132, doi. 10.1007/s10854-015-3698-4

By:

Sun, Zhiping;
Huang, Junjun;
Wang, Libao;
Zhang, Xicheng;
Li, Mingliang;
Tang, Bin

Publication type:

Article

Heel crack propagation mechanism of cold-rolled Cu/Al clad ribbon bonding in harsh environment.

Published in:

Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 9, p. 7277, doi. 10.1007/s10854-015-3355-y

By:

Park, Semin;
Nagao, Shijo;
Sugahara, Tohru;
Suganuma, Katsuaki

Publication type:

Article

Effect of carbon nanotubes and their dispersion on electroless Ni-P under bump metallization for lead-free solder interconnection.

Published in:

Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 6, p. 2682, doi. 10.1007/s10854-014-1929-8

By:

Xu, Sha;
Hu, Xiao;
Yang, Ying;
Chen, Zhong;
Chan, Yan

Publication type:

Article

Effects of Mn on the electrical resistance of electrolessly plated Ni-P thin-film and its application as embedded resistor.

Published in:

Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 3, p. 1341, doi. 10.1007/s10854-014-1732-6

By:

Zhou, Guoyun;
Chen, Chia-Yun;
Lin, Ziyin;
Li, Liyi;
Tao, Zhihua;
He, Wei;
Wong, Ching

Publication type:

Article

Tin whiskers growth of SnAgIn solder on Kovar substrate with Au/Ni plating.

Published in:

Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 3, p. 1222, doi. 10.1007/s10854-014-1713-9

By:

Li, Qingqian;
Chan, Y.;
Chen, Zhong

Publication type:

Article

Effect of Pd thickness on wettability and interfacial reaction of Sn-1.0Ag-Ce solders on ENEPIG surface finish.

Published in:

Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 1, p. 423, doi. 10.1007/s10854-013-1605-4

By:

Bui, Q.;
Jung, S.

Publication type:

Article