Works matching DE "MULTICHIP modules (Microelectronics)"


Results: 66
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    GOOD VIBRATIONS.

    Published in:
    Electronics Systems & Software, 2005, v. 3, n. 4, p. 40
    By:
    • Collins, Luke
    Publication type:
    Article
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    Testing Mobile Memories.

    Published in:
    EE: Evaluation Engineering, 2005, v. 44, n. 9, p. 12
    By:
    • Gusinow, Kurt
    Publication type:
    Article
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    Thermal Analysis of MCM Packaging.

    Published in:
    Electronics & Electrical Engineering, 2014, v. 20, n. 5, p. 112, doi. 10.5755/j01.eee.20.5.7110
    By:
    • Andonova, A.
    Publication type:
    Article
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    Corrections.

    Published in:
    2013
    Publication type:
    Correction Notice
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    Errata.

    Published in:
    2013
    Publication type:
    Correction Notice
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    Development of CAD models for space engineering.

    Published in:
    International Journal of RF & Microwave Computer-Aided Engineering, 2012, v. 22, n. 1, p. 3, doi. 10.1002/mmce.20578
    By:
    • Bila, Stéphane;
    • Aubourg, Michel;
    • Baillargeat, Dominique;
    • Verdeyme, Serge;
    • Pacaud, Damien;
    • Villemazet, Jean-François;
    • Cazaux, Jean-Louis
    Publication type:
    Article
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    Network-on-Multi-Chip (NoMC) with Monitoring and Debugging Support.

    Published in:
    Journal of Telecommunications & Information Technology, 2011, v. 2011, n. 3, p. 81, doi. 10.26636/jtit.2011.3.1161
    By:
    • Łuczak, Adam;
    • Stępniewska, Marta;
    • Siast, Jakub;
    • Domański, Marek;
    • Stankiewicz, Olgierd;
    • Kurc, Maciej;
    • Konieczny, Jacek
    Publication type:
    Article
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