Works matching DE "MULTICHIP modules (Microelectronics)"

Results: 70

INCREASE OF EFFICIENCY OF Li+-INTERCALATED CURRENT GENERATION IN SUPRAMOLECULAR ENSEMBLES WITH HIERARCHICAL ARCHITECTURE MCM-41 〈HYDROQUINONE〉.

Published in:

International Journal of Nanoscience, 2013, v. 12, n. 5, p. 1, doi. 10.1142/S0219581X13500373

By:

MATULKA, D. V.;
GRYGORCHAK, I. I.;
LUKIYANETS, B. A.

Publication type:

Article

Microwave dielectric properties of ZnO-RO2-TiO2-Nb2O5(R = Sn, Zr, Ce) ceramic system.

Published in:

Journal of Materials Science Letters, 2003, v. 22, n. 8, p. 569, doi. 10.1023/A:1023309225186

By:

Duck-Hwan Kim;
Chul An;
Young-Shin Lee;
Kyu-Seok Bang;
Jun-Chul Kim;
Hyeung-Kyu Lee;
Sang-Kyu Lim

Publication type:

Article

Dielectric Spectroscopy of Betaine Phosphite Confined in MCM-41 Molecular Sieve Materials.

Published in:

Ferroelectrics, 2007, v. 353, n. 1, p. 97, doi. 10.1080/00150190701368042

By:

Banys, J.;
Kinka, M.;
Volkel, G.;
Bohlman, W.;
Umamaheswari, V.;
Hartmann, M.;
Poppl, A.

Publication type:

Article

Improved Long-range Order of Silicious MCM-41 by Gradual Heating of Synthesis Gel.

Published in:

Chemistry Letters, 2004, v. 33, n. 3, p. 266, doi. 10.1246/cl.2004.266

By:

Sinha, A. K.;
Seelan, S.;
Akita, T.;
Tsubota, S.;
Haruta, M.

Publication type:

Article

Thermal and Thermo-mechanical Analysis for Design Evaluation of an Automotive Radar Module.

Published in:

Quality & Reliability Engineering International, 2004, v. 20, n. 7, p. 709, doi. 10.1002/qre.594

By:

Lindgren, Mats;
Belov, Ilja;
Leisner, Peter

Publication type:

Article

PLASTIC-STRAIN OF ALUMINIUM INTERCONNECTIONS DURING PULSED OPERATION OF IGBT MULTICHIP MODULES.

Published in:

Quality & Reliability Engineering International, 1996, v. 12, n. 4, p. 297, doi. 10.1002/(SICI)1099-1638(199607)12:4<297::AID-QRE21>3.0.CO;2-C

By:

Ciappa, Mauro;
Malberti, Paolo

Publication type:

Article

DoD/NASA MCM RELTECH Programme.

Published in:: Quality & Reliability Engineering International, 1992, v. 8, n. 6, p. 568
Publication type:: Article

Electronic Packaging Reliability Assessment.

Published in:: Quality & Reliability Engineering International, 1991, v. 7, n. 1, p. 50
Publication type:: Article

Modeling Deformations in Multichip Packages of NAND Memory.

Published in:

Technical Physics Letters, 2018, v. 44, n. 10, p. 919, doi. 10.1134/S1063785018100176

By:

Belyaev, M. A.;
Putrolaynen, V. V.;
Romanenko, V. A.

Publication type:

Article

Synthesize and characterization of Aminosilane functionalized MCM-41 for removal of anionic dye: Kinetic and thermodynamic study.

Published in:

International Journal of Nano Dimension, 2016, v. 7, n. 4, p. 295, doi. 10.7508/ijnd.2016.04.005

By:

Torabinejad, Ali;
Nasirizadeh, Navid;
Yazdanshenas, Mohammad Esmail;
Tayebi, Habib Allah

Publication type:

Article

Removal of copper(II) ions from Aqueous Media by Chemically Modified MCM‐41 with <italic>N</italic>‐(3‐(trimethoxysilyl)propyl)ethylenediamine and Its 4‐hydroxysalicylidene Schiff‐base.

Published in:

Environmental Progress & Sustainable Energy, 2018, v. 37, n. 2, p. 746, doi. 10.1002/ep.12771

By:

Saad, Eman M.;
Hassan, Hassan M. A.;
Soltan, Mohamed S.;
Butler, Ian S.;
Mostafa, Sahar I.

Publication type:

Article

Testing Mobile Memories.

Published in:

EE: Evaluation Engineering, 2005, v. 44, n. 9, p. 12

By:

Gusinow, Kurt

Publication type:

Article

System Tests MCPs and Discrete Flash Memory.

Published in:: 2005
Publication type:: Product Review

Thermal Analysis of MCM Packaging.

Published in:

Electronics & Electrical Engineering, 2014, v. 20, n. 5, p. 112, doi. 10.5755/j01.eee.20.5.7110

By:

Andonova, A.

Publication type:

Article

Multi-Chip Power Module Fast Thermal Modeling for Layout Optimization.

Published in:

Computer-Aided Design & Applications, 2012, v. 9, n. 6, p. 837, doi. 10.3722/cadaps.2012.837-846

By:

Shook, Brett W.;
Zihao Gong;
Yongfeng Feng;
Francis, A. Matthew;
Mantooth, H. Alan

Publication type:

Article

Case Study: Design and Construction of the Draper Laboratory Microfabrication Center.

Published in:

2013

By:

Morrison, Richard H.;
Racz, Livia M.;
Carter, David J.

Publication type:

Case Study

Failure analysis method to study solder wicking phenomena in modern microelectronic devices.

Published in:

Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 2, p. 609, doi. 10.1007/s10854-013-1634-z

By:

Vargas, Lidia;
Terrazas, Juan;
Cabrera, Eduardo;
Valdez, Benjamin;
Nedev, Nicola

Publication type:

Article

Wideband vertical transitions for multilayer BCB-based MCM.

Published in:

Microwave & Optical Technology Letters, 2009, v. 51, n. 6, p. 1584, doi. 10.1002/mop.24354

By:

Xiaoyun Ding;
Fei Geng;
Le Luo

Publication type:

Article

Neural network approach for comodeling design of multichip module.

Published in:

Microwave & Optical Technology Letters, 2008, v. 50, n. 7, p. 1770, doi. 10.1002/mop.23530

By:

El Zoghbi, M.;
Baillargeat, D.;
Bila, S.;
Verdeyme, S.;
Villemazet, J. F.

Publication type:

Article

Time-dependent characterization of an optically modulated CPW line characterized with a large signal network analyzer.

Published in:

Microwave & Optical Technology Letters, 2007, v. 49, n. 12, p. 3124, doi. 10.1002/mop.22888

By:

Poesen, G.;
Stiens, J.;
Vounckx, R.;
Bossche, M. Vanden

Publication type:

Article

60 GHz multi-chip module based on cost effective hybrid multilayer PWB.

Published in:

Microwave & Optical Technology Letters, 2007, v. 49, n. 9, p. 2303, doi. 10.1002/mop.22719

By:

Sung Tae Choi;
Hamaguchi, Kiyoshi;
Ogawa, Hiroyo;
Tokuda, Kiyohito;
Yong Hoon Kim

Publication type:

Article

Evaluation of microwave material of low K interconnection for RF package.

Published in:

Microwave & Optical Technology Letters, 2006, v. 48, n. 8, p. 1675, doi. 10.1002/mop.21707

By:

Min-Hang Weng;
Hung-Wei Wu;
Yan-Kuin Su;
Ru-Yuan Yang;
Cheng-Yuan Hung

Publication type:

Article

Microwave performance of MCM-D embedded capacitors with interconnects.

Published in:

Microwave & Optical Technology Letters, 2005, v. 46, n. 5, p. 487, doi. 10.1002/mop.21025

By:

Post, John E.

Publication type:

Article

Grounded-moating and shielding for noise-coupling reduction between adjacent packages and MCMs.

Published in:

Microwave & Optical Technology Letters, 2005, v. 45, n. 6, p. 557, doi. 10.1002/mop.20878

By:

Ki-Don Kim;
Jongbae Park;
Jae-Gon Lee;
Jeong-Hae Lee;
Joungho Kim

Publication type:

Article

Sequential-rotation arrays of circularly polarized aperture antennas in the MCM-D technology.

Published in:

Microwave & Optical Technology Letters, 2005, v. 44, n. 6, p. 581, doi. 10.1002/mop.20702

By:

Soliman, E. A.;
Brebels, S.;
Beyne, E.;
Vandenbosch, G. A. E.

Publication type:

Article

Design of Synthesizable, Retimed Digital Filters Using FPGA Based Path Solvers with MCM Approach: Comparison and CAD Tool.

Published in:

VLSI Design, 2014, p. 1, doi. 10.1155/2014/280701

By:

Yagain, Deepa;
Vijaya Krishna, A.

Publication type:

Article

A Novel HBE-MCM-Based Multiplier Architecture for 8-Point DCT Structure.

Published in:

Journal of Circuits, Systems & Computers, 2017, v. 26, n. 4, p. -1, doi. 10.1142/S0218126617500542

By:

Kiruba, M.;
Sumathy, V.

Publication type:

Article

The Circular RNA Cdr1as Promotes Myocardial Infarction by Mediating the Regulation of miR-7a on Its Target Genes Expression.

Published in:

PLoS ONE, 2016, v. 11, n. 3, p. 1, doi. 10.1371/journal.pone.0151753

By:

Geng, Hai-Hua;
Li, Rui;
Su, Ya-Min;
Xiao, Jie;
Pan, Min;
Cai, Xing-Xing;
Ji, Xiao-Ping

Publication type:

Article

Network-on-Multi-Chip (NoMC) with Monitoring and Debugging Support.

Published in:

Journal of Telecommunications & Information Technology, 2011, v. 2011, n. 3, p. 81, doi. 10.26636/jtit.2011.3.1161

By:

Łuczak, Adam;
Stępniewska, Marta;
Siast, Jakub;
Domański, Marek;
Stankiewicz, Olgierd;
Kurc, Maciej;
Konieczny, Jacek

Publication type:

Article

System-on-a-chip challenged by stacked system-in-a-package technology*.

Published in:

Solid State Technology, 2001, v. 44, n. 7, p. 48

By:

Asakura, Hiroshi

Publication type:

Article

Advanced multilayer thick-film technology and TFMS, CPW, and SIW up to 180 GHz for cost-effective ceramic-based circuits and modules.

Published in:

IET Microwaves, Antennas & Propagation (Wiley-Blackwell), 2018, v. 12, n. 7, p. 1064, doi. 10.1049/iet-map.2016.1065

By:

Samanta, Kamal K.

Publication type:

Article

Micro‐/Nanohierarchical Surfaces for Enhanced Pool Boiling in Large‐Area Silicon Multichips.

Published in:

Small Structures, 2025, v. 6, n. 5, p. 1, doi. 10.1002/sstr.202400512

By:

Lee, Youngseob;
Kim, Kiwan;
Kim, Yunseo;
Kong, Daeyoung;
Park, Jeonghwan;
Son, Daehyuk;
Kang, Sungchan;
Hong, Seogwoo;
Lee, Hyoungsoon

Publication type:

Article

Laser printing of conformal and multi-level 3D interconnects.

Published in:

Applied Physics A: Materials Science & Processing, 2013, v. 113, n. 1, p. 5, doi. 10.1007/s00339-013-7909-7

By:

Kim, H.;
Duocastella, M.;
Charipar, K. M.;
Auyeung, R. C. Y.;
Piqué, A.

Publication type:

Article

Multichip Module Planarity Requirements Derived From Solder Surface Tension Models.

Published in:

Journal of Microelectronic & Electronic Packaging, 2018, v. 15, n. 1, p. 9, doi. 10.4071/imaps.526636

By:

Marinis, Thomas F.;
Soucy, Joseph W.

Publication type:

Article

Die-Attach Technologies for Ultraviolet LED Multichip Module Based on Ceramic Substrate.

Published in:

Journal of Microelectronic & Electronic Packaging, 2012, v. 9, n. 3, p. 113, doi. 10.4071/imaps.334

By:

Burkhardt, T.;
Hornaff, M.;
Acker, A.;
Peschel, T.;
Beckert, E.;
Suphan, K.-H.;
Mensel, K.;
Jirak, S.;
Eberhardt, R.;
Tünnermann, A.

Publication type:

Article

A NOVEL MODEL EXTRACTION ALGORITHM FOR RECONSTRUCTION OF COUPLED TRANSMISSION LINES IN HIGH-SPEED DIGITAL SYSTEM.

Published in:

Journal of Electromagnetic Waves & Applications, 2005, v. 19, n. 12, p. 1595, doi. 10.1163/156939305775537393

By:

C. J. Lin;
C.-C. Chiu;
S.-G. Hsu;
H. C. Liu

Publication type:

Article

Corrections.

Published in:: 2013
Publication type:: Correction Notice

A Checkpoint-Related Function of the MCM Replicative Helicase Is Required to Avert Accumulation of RNA:DNA Hybrids during S-phase and Ensuing DSBs during G2/M.

Published in:

PLoS Genetics, 2016, v. 12, n. 8, p. 1, doi. 10.1371/journal.pgen.1006277

By:

Vijayraghavan, Sriram;
Tsai, Feng-Ling;
Schwacha, Anthony

Publication type:

Article

MCM-41 Supports Modified by Al, Zr and Ti for NiW Hydrodenitrogenation Catalysts.

Published in:

Catalysis Letters, 2014, v. 144, n. 9, p. 1584, doi. 10.1007/s10562-014-1307-4

By:

Guo, Fang;
Guo, Shaoqing;
Wei, Xian-Xian;
Wang, Xiaoxiao;
Xiang, Hongwei;
Qiu, Zegang;
Zhao, Liangfu

Publication type:

Article

Catalytic Degradation of LDPE and PP over MCM-49 Based Micro-Mesoporous Composites.

Published in:

Catalysis Letters, 2014, v. 144, n. 7, p. 1296, doi. 10.1007/s10562-014-1205-9

By:

Gao, Ningning;
Xie, Sujuan;
Liu, Shenglin;
An, Jie;
Zhu, Xiangxue;
Hu, Linyan;
Wei, Huijuan;
Li, Xiujie;
Xu, Longya

Publication type:

Article

Selective Synthesis of 1-butene through Positional Isomerisation of 2-butene over Mesoporous Silica MCM-41.

Published in:

Catalysis Letters, 2007, v. 119, n. 1/2, p. 179, doi. 10.1007/s10562-007-9219-1

By:

Jong-Ki Jeon;
Heejin Lee;
Jin-Heong Yim;
Yong Seung Kim;
Seong Jun Lee;
Young-Kwon Park;
Jeong Kuk Shon;
Ji Man Kim

Publication type:

Article

Influence of CaCO3, CaF2, SiO2, and TiO2 Scattering Particles' Concentration on Color Rending Index and Color Quality Scale of the Conformal Packaging Multi-chip White LEDs.

Published in:

International Journal on Electrical Engineering & Informatics, 2017, v. 9, n. 1, p. 139, doi. 10.15676/ijeei.2017.9.1.9

By:

Tran Hoang Quang Minh;
Nguyen Huu Khanh Nhan;
Nguyen Doan Quoc Anh

Publication type:

Article

Yüksek hızlı sayısal FIR filtrelerinin tasarımında alan optimizasyonu algoritmaları.

Published in:

ITU Journal Series D: Engineering, 2010, v. 9, n. 1, p. 45

By:

Aksoy, Levent;
Günes, Ece Olcay

Publication type:

Article

Disordered interdomain region of Gins is important for functional tetramer formation to stimulate MCM helicase in Thermoplasma acidophilum.

Published in:

Bioscience, Biotechnology & Biochemistry, 2015, v. 79, n. 3, p. 432, doi. 10.1080/09168451.2014.982503

By:

Hiromi Ogino;
Sonoko Ishino;
Takuji Oyama;
Daisuke Kohda;
Yoshizumi Ishino

Publication type:

Article

GOOD VIBRATIONS.

Published in:

Electronics Systems & Software, 2005, v. 3, n. 4, p. 40

By:

Collins, Luke

Publication type:

Article

Development of a wide bandwidth Wilkinson power divider on multilayer organic substrates.

Published in:

Microwave & Optical Technology Letters, 2010, v. 52, n. 7, p. 1606, doi. 10.1002/mop.25252

By:

Jia-Chi Samuel Chieh;
Anh-Vu Pham

Publication type:

Article

Effect of Preparation Conditions on Formation and Features of Micro/Mesoporous Composite Materials on Base of Zeolites MCM-22, ZSM-5, and Beta.

Published in:

Theoretical & Experimental Chemistry, 2014, v. 50, n. 5, p. 323, doi. 10.1007/s11237-014-9383-5

By:

Struzhko, V.;
Yaremov, P.;
Senchylo, E.;
Solomakha, V.;
Ilyin, V.

Publication type:

Article

Application of Thermal Network Model to Transient Thermal Analysis of Power Electronic Package Substrate.

Published in:

Active & Passive Electronic Components, 2011, p. 1, doi. 10.1155/2011/823654

By:

Masaru Ishizuka;
Tomoyuki Hatakeyama;
Yuichi Funawatashi;
Katsuhiro Koizumi

Publication type:

Article

A prototype of the FPGA-based nanosecond trigger.

Published in:

Instruments & Experimental Techniques, 2010, v. 53, n. 6, p. 812, doi. 10.1134/S0020441210060084

By:

Dobrotvorskii, A.;
Karpukhin, V.;
Shafigullin, R.

Publication type:

Article

Digital-noise reduction with on-chip inductors.

Published in:

Instruments & Experimental Techniques, 2006, v. 49, n. 3, p. 361, doi. 10.1134/S0020441206030092

By:

Dima, M.;
Becks, K.

Publication type:

Article