Works matching DE "MOLDED interconnect devices"
Results: 27
Experimental Investigation and Optimization for the Effective Parameters in the Laser Direct Structuring Process.
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- Journal of Laser Micro / Nanoengineering, 2015, v. 10, n. 2, p. 202, doi. 10.2961/jlmn.2015.02.0018
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LDS Molded Interconnect Devices Fit For mmWave.
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- Microwave Journal, 2016, v. 59, n. 9, p. 116
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3D LDS Components for New Production Opportunities.
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- Microwave Journal, 2012, v. 55, n. 2, p. 46
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Molex Incorporated.
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- Microwave Journal, 2008, v. 51, n. 7, p. 190
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- Article
Thermal Behavior of Silver Nanoparticles for Low-Temperature Interconnect Applications.
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- Journal of Electronic Materials, 2005, v. 34, n. 2, p. 168, doi. 10.1007/s11664-005-0229-8
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3D-MID manufacturing via laser direct structuring with nanosecond laser pulses.
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- Journal of Polymer Engineering, 2016, v. 36, n. 9, p. 957, doi. 10.1515/polyeng-2015-0367
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The application of carbon black and printing ink technology in molded interconnect devices.
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- Journal of Polymer Engineering, 2014, v. 34, n. 5, p. 395, doi. 10.1515/polyeng-2013-0292
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Designer adaptation in the changing PCB industry.
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- EE: Evaluation Engineering, 2017, v. 56, n. 11, p. 20
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Comparison of methods for broadband electromagnetic characterization of Molded Interconnect Device materials.
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- Advances in Radio Science, 2009, v. 7, p. 11, doi. 10.5194/ars-7-11-2009
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Effects of Silver Addition on Properties and Performance of Plasma Sprayed La<sub>0.6</sub>Sr<sub>0.4</sub>Co<sub>0.2</sub>Fe<sub>0.8</sub>O<sub>3−δ</sub> Interconnect Layer.
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- Journal of Thermal Spray Technology, 2008, v. 17, n. 5/6, p. 708, doi. 10.1007/s11666-008-9276-z
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Libraries and Learning: A History of Paradigm Change.
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- Portal: Libraries & the Academy, 2009, v. 9, n. 2, p. 181, doi. 10.1353/pla.0.0049
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An Explanation of the Selective Plating of Laser Machined Surfaces Using Surface Tension Components.
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- Journal of Adhesion Science & Technology, 2011, v. 25, n. 16, p. 2101, doi. 10.1163/016942410X550021
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Metal deposition on liquid crystal polymers for molded interconnect devices using physical vapor deposition.
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- Journal of Adhesion Science & Technology, 2004, v. 18, n. 8, p. 883, doi. 10.1163/156856104840480
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The extraordinary in decision-making: myth, apology or opportunity?
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- Sustainable & Resilient Infrastructure, 2020, v. 5, n. 1/2, p. 20, doi. 10.1080/23789689.2018.1469356
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Metal Strip Grating on Grounded Dielectric Slab and PEC/PMC Shielded Interconnect: Modal Relationships.
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- Applied Computational Electromagnetics Society Journal, 2014, v. 29, n. 11, p. 828
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Selective metallization of polymers using laser induced surface activation (LISA)-characterization and optimization of porous surface topography.
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- International Journal of Advanced Manufacturing Technology, 2011, v. 55, n. 5-8, p. 573, doi. 10.1007/s00170-010-3051-2
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Process chains for the manufacturing of molded interconnect devices.
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- International Journal of Advanced Manufacturing Technology, 2009, v. 42, n. 9/10, p. 831, doi. 10.1007/s00170-008-1660-9
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Evaluating the Impact of Optical Interconnects on a Multi-Chip Machine-Learning Architecture.
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- Electronics (2079-9292), 2018, v. 7, n. 8, p. 130, doi. 10.3390/electronics7080130
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Direct-print/cure as a molded interconnect device (MID) process for fabrication of automobile cruise controllers.
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- Journal of Mechanical Science & Technology, 2015, v. 29, n. 12, p. 5377, doi. 10.1007/s12206-015-1139-1
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The A/R/T connection: linking art practice, research and teaching.
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- International Journal of Education through Art, 2009, v. 5, n. 2/3, p. 265, doi. 10.1386/eta.5.2and3.265/1
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Novel Ceramic‐Based Material for the Applications of Molded Interconnect Devices (3D‐MID) Based on Laser Direct Structuring.
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- Advanced Engineering Materials, 2018, v. 20, n. 7, p. 1, doi. 10.1002/adem.201700824
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Application of WDM holographic devices in access and metro networks.
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- Optical & Quantum Electronics, 2007, v. 39, n. 2, p. 131, doi. 10.1007/s11082-007-9069-5
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Design of the printing pattern on film for three‐dimensional molded interconnect devices.
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- Advances in Polymer Technology, 2018, v. 37, n. 6, p. 1722, doi. 10.1002/adv.21830
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Horizontal and vertical integration of product data for the design of moulded interconnect devices.
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- International Journal of Computer Integrated Manufacturing, 2009, v. 22, n. 11, p. 1024, doi. 10.1080/09511920902741091
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30 Years of Sensors' Assembly and Packaging 1988 to 2018.
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- Sensors & Materials, 2018, v. 30, n. 9, p. 1935, doi. 10.18494/SAM.2018.1859
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PEI replaces aluminum for telecom interconnect devices.
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- Advanced Materials & Processes, 2005, v. 163, n. 10, p. 13
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Laser-activated polyesters make electronic structures.
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- Advanced Materials & Processes, 2004, v. 162, n. 3, p. 18
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