Works matching DE "MOLDED interconnect devices"

Results: 27

Effects of Silver Addition on Properties and Performance of Plasma Sprayed La0.6Sr0.4Co0.2Fe0.8O3−δ Interconnect Layer.

Published in:

Journal of Thermal Spray Technology, 2008, v. 17, n. 5/6, p. 708, doi. 10.1007/s11666-008-9276-z

By:

Soodong Park;
S. Kumar;
Hyuntaek Na;
Changhee Lee

Publication type:

Article

Libraries and Learning: A History of Paradigm Change.

Published in:

Portal: Libraries & the Academy, 2009, v. 9, n. 2, p. 181, doi. 10.1353/pla.0.0049

By:

Bennett, Scott

Publication type:

Article

An Explanation of the Selective Plating of Laser Machined Surfaces Using Surface Tension Components.

Published in:

Journal of Adhesion Science & Technology, 2011, v. 25, n. 16, p. 2101, doi. 10.1163/016942410X550021

By:

Zhang, Yang;
Kontogeorgis, Georgios M.;
Hansen, Hans Nørgaard

Publication type:

Article

Metal deposition on liquid crystal polymers for molded interconnect devices using physical vapor deposition.

Published in:

Journal of Adhesion Science & Technology, 2004, v. 18, n. 8, p. 883, doi. 10.1163/156856104840480

By:

Wang, B.;
Eberhardt, W.;
Kück, H.

Publication type:

Article

Selective metallization of polymers using laser induced surface activation (LISA)-characterization and optimization of porous surface topography.

Published in:

International Journal of Advanced Manufacturing Technology, 2011, v. 55, n. 5-8, p. 573, doi. 10.1007/s00170-010-3051-2

By:

Zhang, Yang;
Hansen, Hans;
De Grave, Arnaud;
Tang, Peter;
Nielsen, Jacob

Publication type:

Article

Process chains for the manufacturing of molded interconnect devices.

Published in:

International Journal of Advanced Manufacturing Technology, 2009, v. 42, n. 9/10, p. 831, doi. 10.1007/s00170-008-1660-9

By:

Islam, A.;
Hansen, H.;
Tang, P.;
Sun, J.

Publication type:

Article

3D-MID manufacturing via laser direct structuring with nanosecond laser pulses.

Published in:

Journal of Polymer Engineering, 2016, v. 36, n. 9, p. 957, doi. 10.1515/polyeng-2015-0367

By:

Hengfeng Yan;
Jimin Chen;
Jinyan Zhao

Publication type:

Article

The application of carbon black and printing ink technology in molded interconnect devices.

Published in:

Journal of Polymer Engineering, 2014, v. 34, n. 5, p. 395, doi. 10.1515/polyeng-2013-0292

By:

Liu, Ren-Hao;
Young, Wen-Bin

Publication type:

Article

Novel Ceramic‐Based Material for the Applications of Molded Interconnect Devices (3D‐MID) Based on Laser Direct Structuring.

Published in:

Advanced Engineering Materials, 2018, v. 20, n. 7, p. 1, doi. 10.1002/adem.201700824

By:

Bachy, Bassim;
Süß‐Wolf, Robert;
Wang, Li;
Fu, Zongwen;
Travitzky, Nahum;
Greil, Peter;
Franke, Jörg

Publication type:

Article

Design of the printing pattern on film for three‐dimensional molded interconnect devices.

Published in:

Advances in Polymer Technology, 2018, v. 37, n. 6, p. 1722, doi. 10.1002/adv.21830

By:

Liu, Ren Hao;
Young, Wen‐Bin;
Ming, Hsu Pe

Publication type:

Article

Evaluating the Impact of Optical Interconnects on a Multi-Chip Machine-Learning Architecture.

Published in:

Electronics (2079-9292), 2018, v. 7, n. 8, p. 130, doi. 10.3390/electronics7080130

By:

Ro, Yuhwan;
Lee, Eojin;
Ahn, Jung Ho

Publication type:

Article

Designer adaptation in the changing PCB industry.

Published in:

EE: Evaluation Engineering, 2017, v. 56, n. 11, p. 20

By:

Jordan, Benjamin

Publication type:

Article

Comparison of methods for broadband electromagnetic characterization of Molded Interconnect Device materials.

Published in:

Advances in Radio Science, 2009, v. 7, p. 11, doi. 10.5194/ars-7-11-2009

By:

Orlob, C.;
Kornek, D.;
Preihs, S.;
Rolfes, I.

Publication type:

Article

The extraordinary in decision-making: myth, apology or opportunity?

Published in:

Sustainable & Resilient Infrastructure, 2020, v. 5, n. 1/2, p. 20, doi. 10.1080/23789689.2018.1469356

By:

Maes, M. A.;
Dann, M. R.;
Caspeele, R.

Publication type:

Article

PEI replaces aluminum for telecom interconnect devices.

Published in:: Advanced Materials & Processes, 2005, v. 163, n. 10, p. 13
Publication type:: Article

Laser-activated polyesters make electronic structures.

Published in:: Advanced Materials & Processes, 2004, v. 162, n. 3, p. 18
Publication type:: Article

LDS Molded Interconnect Devices Fit For mmWave.

Published in:

Microwave Journal, 2016, v. 59, n. 9, p. 116

By:

Friedrich, Aline;
Geck, Bernd;
Fengler, Malte

Publication type:

Article

3D LDS Components for New Production Opportunities.

Published in:

Microwave Journal, 2012, v. 55, n. 2, p. 46

By:

Heininger, Nils

Publication type:

Article

Molex Incorporated.

Published in:: Microwave Journal, 2008, v. 51, n. 7, p. 190
Publication type:: Article

30 Years of Sensors' Assembly and Packaging 1988 to 2018.

Published in:

Sensors & Materials, 2018, v. 30, n. 9, p. 1935, doi. 10.18494/SAM.2018.1859

By:

Wilde, Juergen

Publication type:

Article

Metal Strip Grating on Grounded Dielectric Slab and PEC/PMC Shielded Interconnect: Modal Relationships.

Published in:

Applied Computational Electromagnetics Society Journal, 2014, v. 29, n. 11, p. 828

By:

Kun Chen;
Jiming Song;
Kamgaing, Telesphor

Publication type:

Article

Horizontal and vertical integration of product data for the design of moulded interconnect devices.

Published in:

International Journal of Computer Integrated Manufacturing, 2009, v. 22, n. 11, p. 1024, doi. 10.1080/09511920902741091

By:

Zhuo, Y.;
Alvarez, C.;
Feldmann, K.

Publication type:

Article

Direct-print/cure as a molded interconnect device (MID) process for fabrication of automobile cruise controllers.

Published in:

Journal of Mechanical Science & Technology, 2015, v. 29, n. 12, p. 5377, doi. 10.1007/s12206-015-1139-1

By:

Lu, Yanfeng;
Yun, Hae-Yong;
Vatani, Morteza;
Kim, Ho-Chan;
Choi, Jae-Won

Publication type:

Article

The A/R/T connection: linking art practice, research and teaching.

Published in:

International Journal of Education through Art, 2009, v. 5, n. 2/3, p. 265, doi. 10.1386/eta.5.2and3.265/1

By:

Smith, Jill

Publication type:

Article

Thermal Behavior of Silver Nanoparticles for Low-Temperature Interconnect Applications.

Published in:

Journal of Electronic Materials, 2005, v. 34, n. 2, p. 168, doi. 10.1007/s11664-005-0229-8

By:

Kyoung-Sik Moon;
Hai Dong;
Maric, Radenka;
Pothukuchi, Suresh;
Hunt, Andrew;
Yi Li;
Wong, C. P.

Publication type:

Article

Application of WDM holographic devices in access and metro networks.

Published in:

Optical & Quantum Electronics, 2007, v. 39, n. 2, p. 131, doi. 10.1007/s11082-007-9069-5

By:

Minguez, Alfredo;
Horche, Paloma

Publication type:

Article

Experimental Investigation and Optimization for the Effective Parameters in the Laser Direct Structuring Process.

Published in:

Journal of Laser Micro / Nanoengineering, 2015, v. 10, n. 2, p. 202, doi. 10.2961/jlmn.2015.02.0018

By:

Bachya, Bassim;
Franke, Jörg

Publication type:

Article