Fracture behavior of Cu-cored solder joints.Published in:Journal of Materials Science, 2011, v. 46, n. 21, p. 6897, doi. 10.1007/s10853-011-5654-xBy:Yunsung Kim;Hyelim Choi;Hyoungjoo Lee;Dongjun Shin;Jeongtak Moon;Choe, HeemanPublication type:Article