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Fracture behavior of Cu-cored solder joints.
Published in:
Journal of Materials Science, 2011, v. 46, n. 21, p. 6897, doi. 10.1007/s10853-011-5654-x
By:
Yunsung Kim;
Hyelim Choi;
Hyoungjoo Lee;
Dongjun Shin;
Jeongtak Moon;
Choe, Heeman
Publication type:
Article