Study of microvia filling process based on multi-physical coupling.
- Published in:
- Transactions of the Institute of Metal Finishing, 2018, v. 96, n. 2, p. 86, doi. 10.1080/00202967.2018.1426174
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- Publication type:
- Article
Works matching DE "MICROVIAS (Electronics)"
Results: 7
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An electrochemical model for prediction of microvia filling process.
- Published in:
- Transactions of the Institute of Metal Finishing, 2016, v. 94, n. 1, p. 49, doi. 10.1080/00202967.2015.1124638
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- Publication type:
- Article
3
Investigation of suppressor polyethylene glycol dodecyl ether on electroplated Cu filling by electrochemical method.
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- Transactions of the Institute of Metal Finishing, 2015, v. 93, n. 4, p. 190, doi. 10.1179/0020296715Z.000000000251
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- Publication type:
- Article
4
FAILURE ANALYSIS ON SOLDERED BALL GRID ARRAYS: PART II.
- Published in:
- Electronic Device Failure Analysis, 2017, v. 19, n. 2, p. 4, doi. 10.31399/asm.edfa.2017-2.p004
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- Article
5
High-Density Interconnect Technology Assessment of Printed Circuit Boards for Space Applications.
- Published in:
- Journal of Microelectronic & Electronic Packaging, 2020, v. 17, n. 3, p. 79, doi. 10.4071/imaps.1212898
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- Publication type:
- Article
6
Microvia fill process model and control.
- Published in:
- Journal of Mathematical Chemistry, 2014, v. 52, n. 5, p. 1414, doi. 10.1007/s10910-014-0320-6
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- Article
7
Superconducting Multilayer High-Density Flexible Printed Circuit Board for Very High Thermal Resistance Interconnections.
- Published in:
- Journal of Low Temperature Physics, 2018, v. 193, n. 3/4, p. 578, doi. 10.1007/s10909-018-1930-3
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- Publication type:
- Article