Works about MICROMECHANICS
1
- International Journal of Damage Mechanics, 2025, v. 34, n. 6, p. 1014, doi. 10.1177/10567895251329950
- Weng, Yanmo;
- Qiao, Pizhong;
- Sun, Lizhi
- Article
2
- Biomechanics & Modeling in Mechanobiology, 2025, v. 24, n. 3, p. 779, doi. 10.1007/s10237-025-01957-4
- Atashgar, Fatemeh;
- Shafieian, Mehdi;
- Abolfathi, Nabiollah
- Article
3
- Challenges in Nano & Micro Scale Science & Technology, 2023, v. 11, n. 2, p. 17, doi. 10.22111/cnmst.2025.49331.1252
- Bakamal, Ali;
- Ansari, Reza;
- Hassanzadeh-Aghdam, MohammadKazem
- Article
4
- Soft Materials, 2014, v. 12, p. S152, doi. 10.1080/1539445X.2014.959596
- Sodhani, Deepanshu;
- Reese, Stefanie
- Article
5
- Soft Materials, 2003, v. 1, n. 2, p. 167, doi. 10.1081/SMTS-120022462
- Article
6
- Journal of Assisted Reproduction & Genetics, 2015, v. 32, n. 5, p. 765, doi. 10.1007/s10815-015-0453-y
- Hornick, Jessica;
- Duncan, Francesca;
- Sun, Mingxuan;
- Kawamura, Ryo;
- Marko, John;
- Woodruff, Teresa
- Article
7
- Surface Engineering, 2019, v. 35, n. 1, p. 29, doi. 10.1080/02670844.2018.1447781
- Liu, Fan;
- Yang, Yang;
- Pan, Bingsuo
- Article
8
- Surface Engineering, 2014, v. 30, n. 8, p. 612, doi. 10.1179/1743294414Y.0000000292
- Zhu, Y. S.;
- Lu, W. Z.;
- Zuo, D. W.;
- Feng, W.;
- He, Y. F.
- Article
9
- Surface Engineering, 2010, v. 26, n. 3, p. 209, doi. 10.1179/174329409X409521
- Liang, X. B.;
- Cheng, J. B.;
- Bai, J. Y.;
- Xu, B. S.
- Article
10
- Surface Engineering, 2010, v. 26, n. 3, p. 185, doi. 10.1179/174329409X433876
- Tuckart, W.;
- Gregorio, M.;
- Iurman, L.
- Article
11
- Surface Engineering, 2010, v. 26, n. 1/2, p. 30, doi. 10.1179/026708409X12450792800079
- Ji, R.;
- Li, X. Y.;
- Dong, H.
- Article
12
- Surface Engineering, 2009, v. 25, n. 3, p. 196, doi. 10.1179/174329408X326452
- Wang, J.;
- Song, R. G.;
- Lin, X.;
- Huang, W. D.
- Article
13
- Surface Engineering, 2009, v. 25, n. 3, p. 206, doi. 10.1179/026708409X375299
- Sun, R. L.;
- Lei, Y. W.;
- Niu, W.
- Article
14
- Surface Engineering, 2008, v. 24, n. 2, p. 110, doi. 10.1179/174329408X286079
- Article
15
- Surface Engineering, 2007, v. 23, n. 5, p. 355, doi. 10.1179/174329407X247172
- Bolelli, G.;
- Lusvarghi, L.;
- Pighetti Mantini, F.;
- Barletta, M.;
- Casadei, F.
- Article
16
- Surface Engineering, 2007, v. 23, n. 2, p. 107, doi. 10.1179/174329407X169511
- Raman, R. K. Singh;
- Murray, S.;
- Brandt, M.
- Article
17
- Surface Engineering, 2007, v. 23, n. 2, p. 120, doi. 10.1179/174329407X169476
- Majumdar, J. D.;
- Chandra, B. R.;
- Biswas, D.;
- Nath, A. K.;
- Manna, I.
- Article
18
- Surface Engineering, 2006, v. 22, n. 4, p. 283, doi. 10.1179/174329406X122955
- Babul, T.;
- Kucharieva, N.;
- Nakonieczny, A.;
- Senatorski, J.
- Article
19
- Surface Engineering, 2005, v. 21, n. 2, p. 81, doi. 10.1179/174329405X49688
- Article
20
- Surface Engineering, 2005, v. 21, n. 1, p. 6, doi. 10.1179/174329405X41299
- Article
21
- Surface Engineering, 2004, v. 20, n. 6, p. 459, doi. 10.1179/174329404X7108
- Article
22
- Surface Engineering, 2004, v. 20, n. 6, p. 469, doi. 10.1179/174329404X7144
- Khajavi, M. R.;
- Shariat, M. H.;
- Pasha, A.
- Article
23
- Surface Engineering, 2004, v. 20, n. 6, p. 416, doi. 10.1179/sur.2004.20.6.416
- Article
24
- Journal of Materials Science: Materials in Electronics, 2018, v. 29, n. 9, p. 7730, doi. 10.1007/s10854-018-8769-x
- He, Li;
- Zhao, Yuchen;
- Wang, Jianhong;
- Wang, Pengyu;
- Xie, Hongwei;
- Zhang, Chao
- Article
25
- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 3, p. 2534, doi. 10.1007/s10854-015-4056-2
- Zhou, Houqian;
- Wang, Chunhua;
- Peng, Hao
- Article
26
- Journal of Materials Science: Materials in Electronics, 2016, v. 27, n. 2, p. 1398, doi. 10.1007/s10854-015-3903-5
- Article
27
- Journal of Materials Science: Materials in Electronics, 2015, v. 26, n. 11, p. 8973, doi. 10.1007/s10854-015-3580-4
- Yang, Wen-dong;
- Wang, Chang-hai;
- Arrighi, Valeria;
- Liu, Chun-yan;
- Watson, David
- Article
28
- Journal of Materials Science: Materials in Electronics, 2014, v. 25, n. 2, p. 791, doi. 10.1007/s10854-013-1647-7
- Zhu, Jianfeng;
- Wang, Jingjing;
- Zhou, Yong;
- Wang, Fen
- Article
29
- Journal of Materials Science: Materials in Electronics, 2013, v. 24, n. 3, p. 987, doi. 10.1007/s10854-012-0863-x
- Fu, Qiu-yun;
- Qin, Yu-xiang;
- Zhou, Dong-xiang;
- Hu, Yun-xiang;
- Xie, Zhen-zhen
- Article
30
- Journal of Materials Science: Materials in Electronics, 2011, v. 22, n. 11, p. 1674, doi. 10.1007/s10854-011-0344-7
- Article
31
- Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 7, p. 643, doi. 10.1007/s10854-009-9970-8
- Lili Gao;
- Songbai Xue;
- Liang Zhang;
- Zhong Sheng;
- Guang Zeng;
- Feng Ji
- Article
32
- Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 7, p. 676, doi. 10.1007/s10854-009-9976-2
- Hong He;
- Yongge Cao;
- Renli Fu;
- Wang, Hai;
- Jiquan Huang;
- Changgang Huang;
- Meili Wang;
- Zhonghua Deng
- Article
33
- Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 7, p. 702, doi. 10.1007/s10854-009-9981-5
- Tai, F.;
- Guo, F.;
- Xia, Z. D.;
- Lei, Y. P.;
- Shi, Y. W.
- Article
34
- Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 7, p. 719, doi. 10.1007/s10854-009-9984-2
- WenXue Chen;
- Songbai Xue;
- Hui Wang;
- YuHua Hu;
- Jianxin Wang
- Article
35
- Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 3, p. 246, doi. 10.1007/s10854-009-9900-9
- Sousa, V. C.;
- Oliveira, M. M.;
- Orlandi, M. O.;
- Longo, E.
- Article
36
- Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 2, p. 145, doi. 10.1007/s10854-009-9883-6
- Hua Wang;
- Muhui Xu;
- Jiwen Xu;
- Ling Yang;
- Shangju Zhou
- Article
37
- Journal of Materials Science: Materials in Electronics, 2010, v. 21, n. 2, p. 137, doi. 10.1007/s10854-009-9881-8
- Li Jia;
- Yu Jun;
- Wang Yunbo;
- Peng Gang;
- Li Jianjun
- Article
38
- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 8, p. 704, doi. 10.1007/s10854-008-9788-9
- Hyun Ho Shin;
- Yang Hee Joung;
- Seong Jun Kang
- Article
39
- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 8, p. 741, doi. 10.1007/s10854-008-9796-9
- Hui Zhang;
- Liang Fang;
- Heping Su;
- Xuemin Cui
- Article
40
- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 8, p. 685, doi. 10.1007/s10854-009-9895-2
- Liang Zhang;
- Song-bai Xue;
- Li-li Gao;
- Guang Zeng;
- Zhong Sheng;
- Yan Chen;
- Sheng-lin Yu
- Article
41
- Journal of Materials Science: Materials in Electronics, 2009, v. 20, n. 8, p. 735, doi. 10.1007/s10854-008-9795-x
- Guo, R. H.;
- Jiang, S. Q.;
- Yuen, C. W. M.;
- Ng, M. C. F.
- Article
42
- Journal of Materials Science: Materials in Electronics, 2009, v. 20, p. 336, doi. 10.1007/s10854-008-9612-6
- Barbosa, Hélder M. C.;
- Ramos, Marta M. D.
- Article
43
- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 12, p. 1169, doi. 10.1007/s10854-007-9517-9
- Ponce, M. A.;
- Bueno, P.;
- Varela, J.;
- Castro, M.;
- Aldao, C.
- Article
44
- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 11, p. 1140, doi. 10.1007/s10854-007-9492-1
- Ramam, Koduri;
- Lopez, Marta
- Article
45
- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 11, p. 1135, doi. 10.1007/s10854-007-9489-9
- Hua Wang;
- Jiwen Xu;
- Mingfang Ren;
- Ling Yang
- Article
46
- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 10, p. 973, doi. 10.1007/s10854-007-9429-8
- Fechine, P. B. A.;
- Da Rocha, M. J. S.;
- Santos, M. R. P.;
- Pereira, F. M. M.;
- De Menezes, A. S.;
- Almeida, J. M. A.;
- Góes, J. C.;
- Ayala, A. P.;
- Sombra, A. S. B.
- Article
47
- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 8/9, p. 868, doi. 10.1007/s10854-007-9543-7
- Fang, L. M.;
- Zu, X. T.;
- Li, Z. J.;
- Zhu, S.;
- Liu, C. M.;
- Wang, L. M.;
- Gao, F.
- Article
48
- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 8/9, p. 849, doi. 10.1007/s10854-007-9501-4
- Bhatti, Kanwal;
- Malik, Viv Kumar;
- Chaudhary, Sujeet
- Article
49
- Journal of Materials Science: Materials in Electronics, 2008, v. 19, n. 6, p. 505, doi. 10.1007/s10854-007-9371-9
- Shunhua Wu;
- Shuang Wang;
- Liying Chen;
- Xiaoyong Wang
- Article
50
- Journal of Materials Science: Materials in Electronics, 2007, v. 18, n. 11, p. 1119, doi. 10.1007/s10854-007-9274-9
- Bojorge, C.;
- Cánepa, H.;
- Gilabert, U.;
- Silva, D.;
- Dalchiele, E.;
- Marotti, R.
- Article