Works matching DE "MICROELECTRONICS industry"

Results: 75

Job stress models, depressive disorders and work performance of engineers in microelectronics industry.

Published in:

International Archives of Occupational & Environmental Health, 2011, v. 84, n. 1, p. 91, doi. 10.1007/s00420-010-0538-y

By:

Sung-Wei Chen;
Po-Chuan Wang;
Ping-Lung Hsin;
Oates, Anthony;
I-Wen Sun;
Shen-Ing Liu

Publication type:

Article

Molecular electronics: DNA charges ahead.

Published in:

Nature Chemistry, 2009, v. 1, n. 2, p. 106, doi. 10.1038/nchem.188

By:

Genereux, Joseph C.;
Barton, Jacqueline K.

Publication type:

Article

Development and validation of the analytical method by high performance liquid chromatography (HPLC) for Lamotrigine raw material.

Published in:

Acta Scientiarum: Health Sciences, 2011, v. 33, n. 2, p. 153, doi. 10.4025/actascihealthsci.v33i2.8244

By:

do Nascimento, Guilherme Nobre Lima;
de Freitas Pereira, Keila Carla;
Nishijo, Hisao;
Aversi-Ferreira, Tales Alexandre

Publication type:

Article

A Review on Aerosol-Based Direct-Write and Its Applications for Microelectronics.

Published in:

Journal of Nanotechnology, 2012, p. 1, doi. 10.1155/2012/324380

By:

Hoey, Justin M.;
Lutfurakhmanov, Artur;
Schulz, Douglas L.;
Akhatov, Iskander S.

Publication type:

Article

Effect of Process Parameters on Surface Quality for Wire Saw Cutting of Alumina Ceramic.

Published in:

Gazi University Journal of Science, 2011, v. 24, n. 2, p. 291

By:

TEOMETE, Egemen

Publication type:

Article

Engineering performance in applied EPD: problems and solutions.

Published in:

Journal of Materials Science, 2006, v. 41, n. 24, p. 8115, doi. 10.1007/s10853-006-0418-8

By:

Zarbov, Martin;
Brandon, David;
Cohen, Nissim;
Shemesh, Liat

Publication type:

Article

A state-of-the-art review of ductile cutting of silicon wafers for semiconductor and microelectronics industries.

Published in:

International Journal of Advanced Manufacturing Technology, 2012, v. 63, n. 5-8, p. 481, doi. 10.1007/s00170-012-3937-2

By:

Arif, Muhammad;
Rahman, Mustafizur;
San, Wong

Publication type:

Article

Aromatic polyethers with 2,6-bis(4-azidotetrafluorobenzylidene)cyclohexanone side fragments and styryl groups in the backbone.

Published in:

Doklady Chemistry, 2011, v. 438, n. 1, p. 140, doi. 10.1134/S0012500811050041

By:

Vainer, A. Ya.;
Dyumaev, K. M.;
Mareeva, S. A.;
Alekseev, V. D.;
Bruskina, M. B.;
Glagolev, A. A.

Publication type:

Article

Laser-Induced Forward Transfer of Functional Materials: Advances and Future Directions.

Published in:

Journal of Laser Micro / Nanoengineering, 2014, v. 9, n. 3, p. 192, doi. 10.2961/jlmn.2014.03.0002

By:

Piqué, Alberto;
Heungsoo Kim

Publication type:

Article

POSS-benzocyclobutene (POSS-BCB) resin.

Published in:

High Performance Polymers, 2018, v. 30, n. 9, p. 1123, doi. 10.1177/0954008317740194

By:

Su, Tao;
Men, Weiwei;
Wang, Zhiqiang;
Xuan, Lixin;
Zhao, Weiwei

Publication type:

Article

Ferroelectric, Thermal, and Magnetic Characteristics of Praseodymium Malonate Hexahydrate Crystals.

Published in:

Journal of Electronic Materials, 2016, v. 45, n. 4, p. 2206, doi. 10.1007/s11664-015-4269-4

By:

Ahmad, Nazir;
Ahmad, M.;
Kotru, P.

Publication type:

Article

Nucleation and Growth of Cu-Al Intermetallics in Al-Modified Sn-Cu and Sn-Ag-Cu Lead-Free Solder Alloys.

Published in:

Journal of Electronic Materials, 2015, v. 44, n. 3, p. 842, doi. 10.1007/s11664-014-3551-1

By:

Reeve, Kathlene;
Anderson, Iver;
Handwerker, Carol

Publication type:

Article

Optimal Phosphorous Content Selection for the Soldering Reaction of Ni-P Under Bump Metallization with Sn-Ag-Cu Solder.

Published in:

Journal of Electronic Materials, 2006, v. 35, n. 8, p. 1665, doi. 10.1007/s11664-006-0215-9

By:

Yung-Chi Lin;
Jenq-Gong Duh

Publication type:

Article

IR studies of the oxygen and carbon precipitation processes in electron irradiated tin-doped silicon.

Published in:

Journal of Materials Science: Materials in Electronics, 2017, v. 28, n. 14, p. 10298, doi. 10.1007/s10854-017-6798-5

By:

Chroneos, A.;
Sgourou, E.;
Angeletos, T.;
Londos, C.

Publication type:

Article

Growth mechanism of phases, Kirkendall voids, marker plane position, and indication of the relative mobilities of the species in the interdiffusion zone.

Published in:

Journal of Materials Science: Materials in Electronics, 2011, v. 22, n. 7, p. 833, doi. 10.1007/s10854-010-0220-x

By:

Paul, A.

Publication type:

Article

Three-Dimensional (3D) Printed Microneedles for Microencapsulated Cell Extrusion.

Published in:

Bioengineering (Basel), 2018, v. 5, n. 3, p. 1, doi. 10.3390/bioengineering5030059

By:

Farias, Chantell;
Lyman, Roman;
Hemingway, Cecilia;
Huong Chau;
Mahacek, Anne;
Bouzos, Evangelia;
Mobed-Miremadi, Maryam

Publication type:

Article

Amkor's experiences with factory opportunities in China.

Published in:

Solid State Technology, 2001, v. 44, n. 8, p. S25

By:

Breton, Gary

Publication type:

Article

Marseille-Provence: A center of microelectronics.

Published in:

Solid State Technology, 1999, v. 42, n. 7, p. 44

By:

Laushway, Ester

Publication type:

Article

Eastern Germany's `Silicon Saxony' attracting high-tech business.

Published in:

Solid State Technology, 1998, v. 41, n. 9, p. 52

By:

Karnath, Lorie

Publication type:

Article

Europe is speeding up R&D in deep submicron processing.

Published in:

Solid State Technology, 1998, v. 41, n. 6, p. 50

By:

Wauters, Jan

Publication type:

Article

All or nothing [production engineering computing - vacuum pumps].

Published in:

Manufacturing Engineer, 2007, v. 86, n. 1, p. 40, doi. 10.1049/me:20070109

By:

Lerner, N.

Publication type:

Article

Profitability decided by patent quality? An empirical study of the U.S. semiconductor industry.

Published in:

Scientometrics, 2010, v. 82, n. 1, p. 175, doi. 10.1007/s11192-009-0080-4

By:

Yin-Hui Cheng;
Fu-Yung Kuan;
Shih-Chieh Chuang;
Yun Ken

Publication type:

Article

JESSI enters critical phase.

Published in:

Nature, 1989, v. 341, n. 6243, p. 559, doi. 10.1038/341559b0

By:

Dickman, S.

Publication type:

Article

The Chip Revolutionizes Electronics.

Published in:: Management Review, 1965, v. 54, n. 11, p. 14
Publication type:: Article

Freestanding few-layer sheets of a dual topological insulator.

Published in:

NPJ 2D Materials & Applications, 2021, v. 5, n. 1, p. 1, doi. 10.1038/s41699-021-00203-6

By:

Lê Anh, Mai;
Potapov, Pavel;
Lubk, Axel;
Doert, Thomas;
Ruck, Michael

Publication type:

Article

Pulsed laser deposition of Co and growth of CoSi<sub>2</sub> on Si(111).

Published in:

Applied Physics A: Materials Science & Processing, 2005, v. 81, n. 8, p. 1651, doi. 10.1007/s00339-005-3374-2

By:

Löffler, M.;
Cordón, J.;
Weinelt, M.;
Ortega, J. E.;
Fauster, T.

Publication type:

Article

Gender and the restructuring of high-tech multinational corporations:new twists to an old story.

Published in:

Cambridge Journal of Economics, 1992, v. 16, n. 3, p. 269

By:

Goldstein, Nance

Publication type:

Article

Feedback quality adjustment with Bayesian state-space models.

Published in:

Applied Stochastic Models in Business & Industry, 2007, v. 23, n. 2, p. 145, doi. 10.1002/asmb.659

By:

Triantafyllopoulos, K.

Publication type:

Article

Wafer Level Packaging of Compound Semiconductors.

Published in:

Journal of Microelectronic & Electronic Packaging, 2010, v. 7, n. 3, p. 152, doi. 10.4071/imaps.263

By:

Strandjord, Andrew;
Teutsch, Thorsten;
Scheffler, Axel;
Otto, Bernd;
Paat, Anna;
Alinabon, Oscar;
Jing Li

Publication type:

Article

Critical Issues of TSV and 3D IC Integration.

Published in:

Journal of Microelectronic & Electronic Packaging, 2010, v. 7, n. 1, p. 35, doi. 10.4071/1551-4897-7.1.35

By:

Lau, John H.

Publication type:

Article

Development of High-Speed On–Off Valves and Their Applications.

Published in:

Chinese Journal of Mechanical Engineering, 2022, v. 35, n. 1, p. 1, doi. 10.1186/s10033-022-00720-5

By:

Wang, He;
Chen, Zhen;
Huang, Jiahai;
Quan, Long;
Zhao, Bin

Publication type:

Article

The birth and development of a born global industry: The case of microelectronics in Norway.

Published in:

Journal of International Entrepreneurship, 2018, v. 16, n. 1, p. 82, doi. 10.1007/s10843-017-0206-3

By:

Aspelund, Arild;
Azari, Mohammad Javadinia;
Aglen, Andreas Flåt;
Graff, Sondre Gullord

Publication type:

Article

Chipping away.

Published in:

2007

By:

Bradley, David

Publication type:

Product Review

Electrochemical Polishing of Copper for Microelectronic Applications.

Published in:

Surface Engineering, 2003, v. 19, n. 1, p. 11, doi. 10.1179/026708402225010047

By:

Huo, J.;
Solanki, R.;
McAndrew, J.

Publication type:

Article

In Recognition of Professor Hitchman: Advances in Chemical Vapor Deposition.

Published in:

2017

By:

Maury, Francis;
Alexandrov, Sergey;
Barreca, Davide;
Davazoglou, Dimitris;
Pemble, Martyn

Publication type:

Editorial

Taguchi Designs and Linear Programming Speed New Product Formulation.

Published in:

Interfaces, 1989, v. 19, n. 5, p. 49, doi. 10.1287/inte.19.5.49

By:

Schmidt, Michael S.;
Meile, Larry C.

Publication type:

Article

Impurity Effects in Electroplated-Copper Solder Joints.

Published in:

Metals (2075-4701), 2018, v. 8, n. 6, p. 388, doi. 10.3390/met8060388

By:

Lee, Hsuan;
Chen, Chih-Ming

Publication type:

Article

Chip Wars: Can the U.S. Regain Its Advantage in Microelectronics?

Published in:

California Management Review, 1988, v. 30, n. 4, p. 64, doi. 10.2307/41166527

By:

Borrus, Michael

Publication type:

Article

SOCIOMATERIALIDAD Y ORGANIZACIÓN: BASES SOBRE UNA ONTOLOGÍA RELACIONAL DE LA TECNOLOGÍA.

Published in:

Gestión y Estrategia, 2014, n. 45, p. 133

By:

Cruz Rodríguez, David Salvador

Publication type:

Article

Silicon nanostructures for photonics and photovoltaics.

Published in:

Nature Nanotechnology, 2014, v. 9, n. 1, p. 19, doi. 10.1038/nnano.2013.271

By:

Priolo, Francesco;
Gregorkiewicz, Tom;
Galli, Matteo;
Krauss, Thomas F.

Publication type:

Article

Single-donor ionization energies in a nanoscale CMOS channel.

Published in:

Nature Nanotechnology, 2010, v. 5, n. 2, p. 133, doi. 10.1038/nnano.2009.373

By:

Pierre, M.;
Wacquez, R.;
Jehl, X.;
Sanquer, M.;
Vinet, M.;
Cueto, O.

Publication type:

Article

Numerical treatment of cosserat based rate independent strain gradient plasticity theories.

Published in:

Ingeniería y Ciencia, 2008, v. 4, n. 8, p. 99

By:

Gómez, Juan David

Publication type:

Article

A silicon/iron-disilicide light-emitting diode operating at a wavelength of 1.5 ...m.

Published in:

Nature, 1997, v. 387, n. 6634, p. 686, doi. 10.1038/42667

By:

Leong, D.;
Harry, M.

Publication type:

Article

GUEST EDITORIAL.

Published in:

2005

By:

TANG, TING-AO;
SOLAYAPPAN, NARAYAN;
BAIK, S.;
DEY, SANDWIP;
AUCIELLO, O.

Publication type:

Editorial

Determinants of Perceived Interfirm Dependence in Industrial Supplier Relations.

Published in:

Journal of Management & Governance, 1998, v. 2, n. 3, p. 213, doi. 10.1023/A:1009962926611

By:

Noorderhaven, Niels;
Nooteboom, Bart;
Berger, Hans

Publication type:

Article

The Microelectronics Industry (Book).

Published in:: 1986
Publication type:: Book Review

AC CONDUCTION AND DIELECTRIC CHARACTERIZATION OF LEAD SELENIDE THIN FILMS FROM VACUUM EVAPORATION TECHNIQUE.

Published in:

Chalcogenide Letters, 2009, v. 6, n. 9, p. 509

By:

Prabahar, S.;
Suryanarayanan, N.;
Srikanth, S.;
Kathirvel, D.;
Jebaramya, J.

Publication type:

Article

E-Textile Standards Surge Forward!

Published in:

AATCC Review, 2016, v. 16, n. 4, p. 45, doi. 10.14504/ar.16.4.3

By:

Quante, J. Michael

Publication type:

Article

RESEARCH, TECHNOLOGY, AND INNOVATION.

Published in:: Defense Acquisition, 2023, v. 52, n. 6, p. 57
Publication type:: Article

Traceability and Risk Analysis Strategies for Addressing Counterfeit Electronics in Supply Chains for Complex Systems.

Published in:

Risk Analysis: An International Journal, 2016, v. 36, n. 10, p. 1834, doi. 10.1111/risa.12536

By:

DiMase, Daniel;
Collier, Zachary A.;
Carlson, Jinae;
Gray, Robin B.;
Linkov, Igor

Publication type:

Article